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B2GM, July 2013, Blacksburg, VA B2GM Summary 1 Blacksburg, VA, July 4-7 Executive changes Spokesperson: Peter Krizan -> Tom Browder IB Chair: Eunil Won.

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Presentation on theme: "B2GM, July 2013, Blacksburg, VA B2GM Summary 1 Blacksburg, VA, July 4-7 Executive changes Spokesperson: Peter Krizan -> Tom Browder IB Chair: Eunil Won."— Presentation transcript:

1 B2GM, July 2013, Blacksburg, VA B2GM Summary 1 Blacksburg, VA, July 4-7 Executive changes Spokesperson: Peter Krizan -> Tom Browder IB Chair: Eunil Won -> Zdenek Dolezal Aihara-san will remain as EB chair Masa Yamauchi  Yoshihide Sakai (Belle II Project Manager) SVD detector co-leaders (T. Tsuboyama, M. Friedl)  (K. Hara, C. Irmler) Computing/software position will be modified: “Computing” T. Hara, “Software”, T. Kuhr New physics co-coordinator (Bostian Golob ->(P. Urquijo, K. Trabelsi)

2 B2GM, July 2013, Blacksburg, VA New Belle II Members 2

3 B2GM, July 2013, Blacksburg, VA Statistics 3

4 B2GM, July 2013, Blacksburg, VA DEPFET Production 4 Sensor production started in July 2012 2 batches with 13 and 18 wafers Batch 1: FOL finished, Metal layers waiting for EMCM Batch 2: started Feb. 2013, 18 wafers Batch was split in 9 + 9 wafers processing fine (ahead by 21 days) Batch 3: tailing (~ 7 steps behind)

5 B2GM, July 2013, Blacksburg, VA Batch 1 faster than planned (300d/360d, can be done in 220 days) Wait for EMCM test before start of metal layer processing: 8.7.2013 Batch 2/3 another 100/120 days for FOL, will be finished well before end of 2013 Expect the first sensors to be ready in July 2014, as scheduled! PXD9 Production 5 Calender Days Production steps Split

6 B2GM, July 2013, Blacksburg, VA EMCM 6 Electrical dummy: Metal layers only, to be complemented with ASICs tests electrical functionality of the module routing cross talk, voltage drops, RC-delays processing issues (shorts, interruptions) Absolutely mandatory to test EMCM before metal processing is started. 1 st batch of EMCMs failed because of a processing error 2 nd batch (wafers for process development) => 3 good EMCMs They are now at IZM, Berlin for ASIC bonding. New batch with EMCMs in production (8 x 7 ready soon) Plan is to achieve ‘production go’ by end of September Despite the setbacks the EMCM productions turned out to be extremely useful in order to improve our design and technology We still have enough contingency in to meet our schedule (first sensors ready in July 2014)

7 B2GM, July 2013, Blacksburg, VA TC report (Ushiroda-san) 7

8 B2GM, July 2013, Blacksburg, VA TC Report: RVC 8

9 B2GM, July 2013, Blacksburg, VA TC report: Background 9

10 B2GM, July 2013, Blacksburg, VA Conclusions 10 PXD: Attendance low, finished our session in < 3h lack of discussion on RVC and Assembly/Installation => need to be well prepared for BPAC (VXD hat ~ 8h session!) Background becomes acceptable but not enough safety margin Factor 2 is suggested Do we have to increase the gold layer in the beam pipe ? Belle II: change in management collaboration still growing TOP on the critical path


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