1. PMG, Aug 03, 2000 Slide 1 Schedule In preparation Done Started Done Started Half done

2. PMG, Aug 03, 2000 Slide 2 Action Triggers p Currently:  6 disks complete  3 barrels complete  Produced 2 disks in the months of May, June and July  Wedge production proceeding at significantly faster pace

3. PMG, Aug 03, 2000 Slide 3 Sensor Delivery p Axial detectors (3-chip):  All sensors in hand p 90 o detectors, DSDM (6-chip):  ~19 sensors still to be delivered  July delivery: 28 sensors  Complete order in August !  Some sensors will be returned but will have no impact on availability of good devices for completion of detector p 2 o detectors (9-chip)  Still to deliver 19 (lyr2) sensors  Delivery should not be a problem  If we need to call into effect fallback: ~10 sensors »Fallback: Accept sensors which have higher R bias, ~50 sensors have been identified p F-Wedge sensors  All sensors (Micron + Eurisys) in hand p H-Wedge sensors  All sensors in hand   ()()

4. PMG, Aug 03, 2000 Slide 4 High Density Interconnect Status p 3-chip hdi’s  done p 6-chip hdi’s  done (6 hdi’s to Promex for backup) p 9-chip hdi’s  26 + 32 hdi’s processed at Promex  ~12 sent to Promex. Last batch ! p F-wedge hdi’s  18 hdi’s processed at Promex  22 sent to Promex. Last batch ! p H-wedge hdi’s  20 at Silitronics. Last batch ! p Total to be stuffed:  Promex: ~40  Silitronics: ~20

5. PMG, Aug 03, 2000 Slide 5 Ladder and Wedge Production p Axial detectors (3-chip):  Ladder production continuing; 4-5 more ladders to go p 2 o detectors (9-chip):  Production lagging due to availability of hdi’s »Surface mount at Promex faster than anticipated »First hdi’s from new batch received at Fermilab and burn-in and production started  Hope to make up some of the lag incurred over the course of the last month p 90 o detectors (6-chip):  Paced by Micron delivery, 136 ladders built so far, 107 A/B grade  Enough ladders for barrel 4  Ladder production should proceed adequately p F Wedges (14-chip):  Production proceeding at adequate pace  Sensor and hdi availability not a problem  Testing sensors is cumbersome p H Wedges (6-chip):  192 half wedges produced to date, 115 A/B grade  Half wedge production proceeding adequately  Glued 64 full wedges of which 33 A/B grade  Encapsulation is slow and tedious process  Enough wedges for first two H disks, enough graded for first

6. PMG, Aug 03, 2000 Slide 6 Production Status and Projection p Projected rates: assumed yieldcapacity  9-chip: >12.0/week 80% 15/wk  6-chip: 6.1/week 85% 10/wk  H-wedge: 6.2 week 85% 10/wk  F-wedge: 3.4/week 90% 15/wk p Slope for end game for 9-chip ladder production getting steeper ! Nominal completion date for ladder production still early September Nov 1, 00 Aug 28, 00 today

7. PMG, Aug 03, 2000 Slide 7 Production Rate

8. PMG, Aug 03, 2000 Slide 8 Production Schedule Summary 2 nd half cylinder “short tails” p Barrel assembly going to be driven by availability of 9-chip ladders p Enough 6-chip ladders available for barrel 4; trying to improve overall quality of ladders p 9-chip ladder production should pick up rapidly so no delay will be incurred

9. PMG, Aug 03, 2000 Slide 9 F Disk Status The Point of No Return p Disks 10 and 12 assembled  Disk 10 first to be dropped in fallback scenarios p Disk 11 is being assembled; All 6 disks for first half cylinder completed p Thus, it is implicit that there is no descoping of the silicon detector! Any remaining fallback is in scheduling

10. PMG, Aug 03, 2000 Slide 10 Barrel / Disk Assembly and Mounting p Fixturing proceeding for barrel disk mounting and installation  Barrel Removal Fixture, completed  Barrel / Disk mating fixture, completed  Barrel / Disk insertion fixture, behind schedule  End Disk Assembly Insertion Fixture, behind schedule  Silicon Support Cradle, “tumbler”, completed  ……… p All barrels for first half cylinder done, but  refitting of barrel 1 (grounding)  final surveys of barrels p F disks:  Preparation of central ring of end assembly  Radiation Monitors p H disks  CMM programming complete  Ring assembly started. One side of first ring completed and ring flipped over p Support cylinder  ready

11. PMG, Aug 03, 2000 Slide 11 10% Test p Interface Board design nearly complete  “Acceptable” solution for cross talk still gives glitches »Need to implement ALTERA FPGA »Still to be tested more thoroughly »Design will then be frozen for first 2/15 production boards  termination of bus lines decided  Controls and Monitoring features of board have been verified  Board submitted for bid; vendor visit this Friday p Interlock and Cooling system setup p Disk F14 installed and being exercised:  run coolant at 55 o F  downloading  biasing  readout  L3 and examine p Plan to shake out system with disk F14 and then move to barrel/disk readout

12. PMG, Aug 03, 2000 Slide 12 Low Mass Cables p Delivery recently slowed down to 35/wk, whereas 56/wk needed, due to vacation and bereavement  Keeping close watch on production p Enough cables available for first half cylinder