1. ILC Instrumentation and Simulation R&D at SCIPP DOE Site Visit Thursday, June 18, 2009 Bruce Schumm Santa Cruz Institute for Particle Physics

2. Faculty/Senior Vitaliy Fadeyev Alex Grillo Bruce Schumm Collaborator Rich Partridge (SLAC) Undergrads Sean Crosby* Jerome Carman Jared Newmiller Sheena Schier Kelsey Collier Amy Simonis Jeff Schulte* Chris Betancourt Alex Bogert The SCIPP/UCSC ILC R&D GROUP Lead Engineer: Ned Spencer Technical Staff: Max Wilder All senior participants mostly working on other projects * 2009 Senior thesis (graduation requirement)

3. OUTLINE OF SCIPP ILC R&D PROGRAM LSTFE Frint-End ASIC Optimized for ILC (long ladders for barrel; high rates for forward tracking) Applicable to both SiD and ILD SiD KPIX/Double-Metal Development SiD baseline; alternative to LSTFE SCIPP has done group’s sensor testing, now beginning critical systems tests

4. Fundamental (“Generic”) R&D Use of charge division for longitudinal coordinate (with Rich Partridge) Solid-state noise sources Prospects for RadHard Sensors (far- forward Calorimetry If funded, will support SLAC collaboration ESA test beam: SCIPP sensor expertise plus SLAC operation and dosimetry OUTLINE (Continued)

5. SiD Simulation Projects Tracking and momentum reconstruction validation Non-prompt signatures

6. ILC Tracker Baseline Designs SiD Baseline: Five barrel and 4 endcap layers, to R = 125cm ILD Baseline: Si tracking envelops TPC; outer layers at 1.8m

7. 1-3  s shaping time (LSTFE-I is ~1.2  s); analog measurement is Time-Over-Threshold Process: TSMC 0.25  m CMOS The LSTFE ASIC

8. 1/4 mip 1 mip 128 mip Operating point threshold Readout threshold High gain advantageous for overall performance (channel matching)

9. FIFO (Leading and trailing transitions) Low Comparator Leading-Edge-Enable Domain Proposed LSTFE Back-End Architecture Clock Period  = 400 nsec Event Time 8:1 Multi- plexing (  clock = 50 ns)

10. Observed Expected 1 meter LSTFE SPACE-POINT RESOLUTION RMS Gaussian Fit Observed noise vs. capacitive load (LSTFE-I) Simulated space-point resolution for “expected” noise 167 cm Ladder

11. LSTFE-II Prototype Optimized for 80cm ladder (ILD barrel application) Institute “analog memory cells” to improve power- cycling switch-on from 30 msec to 1 msec Improved environmental isolation Additional amplification stage to improve S/N, control of shaping time, and channel-to-channel matching Improved control of return-to-baseline for < 4 mip signals (time-over-threshold resolution) 128 Channels (256 comparators) read out at 3 MHz, multiplexed onto 8 LVDS outputs Testing underway in SCIPP lab

12. The SiD KPIX/Double-Metal Baseline Design 10cm 2 modules tessellate the five barrel tracking layers Traces on 2 nd (surface) metal layer to two 1024-node bump-bonding arrays

13. SiD Double-Metal Sensor SLAC/FNAL Design Hamamatsu Fabrication Testing at SCIPP

14. Sensors bias at ~50 V. Capacitance shown is for all 1840 strips, but strips to backplane only SiD Tiles: Biasing and Plane-to-Plane Capacitance For now: single sensor (sensor #26)

15. SiD Leakage Current (sensor #26): Average leakage for 1840 channels is about ~160 pA/channel Next Steps:  Larger-scale testing (statistics)  Test of combined KPIX/Double-Metal perforamce to get underway at SCIPP this summer (pending DOE support)

16. Longitudinal Resolution via Charge Division Proposed by Rich Partridge, based on seminal paper by Radeka: V. Radeka "Signal, Noise and Resolution in Position-Sensitive Detectors", IEEE Trans. Nucl. Sci. 21, 51 (1974), which in turn references earlier work with planar sensors from R.B. Owen and M.L. Awcock, IEEE Trans. Nucl. Sci. 15, 290 (1968) Small ($16K) LCRD grant supports this work. Progress due to UCSC undergraduate physics major Jerome Carman Basic idea: For resistive sensor, impedances dominated by sensor rather than amplifier input impedance; charge should divide proportional to point of deposition.  Read out implant (SLAC/FNAL “charge division” sensor has 600 k  implant)

17. Charge Division Sensor Mock-Up 10-stage RC network PC board (Jerome Carman)

18. Amplifiers: First Stage: TI OPA657 Low-noise FET OpAmp Later Stages: Analog Devices ADA4851 rail-to-rail video amp Measure Noise (either end): 0.64 fC Charge Division Sensor Mock-Up Model 600 k  resistive implant with 10-stage RC network Read out at both left (“L”) and right (“R”) ends

19. Mean Amplifier Response vs. Injection Point Fairly linear; little offset from 0  appropriate for charge division. Right-Hand Amplifier P-Spice, including all parasitics Observed signal

20. Longitudinal Resolution Estimate Trying to measure fractional distance f from right to left end of strip: Rewrite: Then, and dL, dR apparently uncorrelated.

21. Longitudinal Resolution Estimate: Conclusion Depends upon location of hit (middle or near end of resistive implant) and the magnitude of the charge deposition. Assume a 4 fC deposition in the middle of the strip (x=1): However, note that, so this is not much better.  Optimize shaping time, implant resistivity, ?  Goal of better than 0.1 (1cm for SiD sensors).

22. Readout Noise for Linear Collider Applications Use of silicon strip sensors at the ILC tend towards different limits than for hadron collider or astrophysical applications:  Long shaping time  Resistive strips (narrow and/or long) But must also achieve lowest possible noise to meet ILC resolution goals. How well do we understand Si strip readout noise?

23. Strip Noise Idea: “Center Tapping” – half the capacitance, half the resistance? Result: no significant change in measured noise However, sensors have 237  m pitch  Currently characterizing CDF L00 sensors Measured noise Expected noise, assuming 75% reduction in strip noise

24. Standard Form for Readout Noise (Spieler) Series Resistance Amplifier Noise (series)Amplifier Noise (parallel) Parallel Resistance F i and F v are signal shape parameters that can be determined from average scope traces. There is some circumstantial evidence that this may be an oversimplification, particularly for the case of series noise…

25. CDF L00 Sensor “Snake” CDF L00 “Snake” LSTFE1 chip on Readout Board

26. CDF L00 Sensor “Snake” Plus much work eliminating environmental noise, constraining amplifier contributions…Thanks to Sean Crosby, UCSC undergraduate thesis student

27. Measured vs. Expected Noise Johnson-Noise-Dominated for > 6 strips “Rigorous Calc”: Carefully measured shape factors F i, F v.

28. Results rather surprising  Re-check methodology  Develop P-Spice simulation (as for charge-division studies Sean’s understudy, Kelsey Collier, will grab the reigns…

29. Conclusions SiD sensor: first pass characterization looks fine (complex design!). “Charge Division” sensors shorted by strips. LSTFE-2 awaits testing (soon!); design refined by studies of LSTFE-1 Charge division approach looks interesting; needs to be optimized and some questions explored (but what happens to S/N and transverse resolution?) Effects of series noise being questioned; empirical study of readout noise contributions underway Starting SPICE simulation of “snake” and charge-division setup to calibrate understanding (Ryan Stagg)

30. Radiation-Hard Silicon Sensors (SCIPP/SLAC) Far-Forward region: Need to tag electrons from two-photon events to remove SUSY backgrounds (to 20 mrad) Expected doses of 100s MRad anticipated for ILC running (5x limits for probed for ATLAS upgrade studies) UCSC experience with rad-hard sensors (e.g. Czochralski-process) and characterization, in combination with SLAC testbeams and dosimetry expertise Funding expected for studies in 2010-2011

31. Simulation Studies for the SiD Concept Tracking Performance Evaluation Reconstruction Efficiency Momentum Resolution Non-Prompt Tracks Reconstruction Algorithms GMSB Signatures

33. 3-Hit Tracks & Non-Prompt Signatures Probably need 5+1 layers for prompt track If we require 4 hits for non-prompt tracks, sensitive region for kinked tracks is very limited.