1. ELECTRICAL MULTI-CHIP MODULE testing status 3 rd Belle II PXD/SVD Workshop and 12 th International Workshop on DEPFET Detectors and Applications Wetzlar, Germany Paola Avella Max Planck Institute for Physics Semiconductor Laboratory Munich, Germany

2. Outline Motivations of EMCM testing Discontinuities Adjacencies The actual system The testing strategy Summary and future plans Paola Avella, MPI for Physics - HLL 3rd Belle II PXD/SVD Workshop 2

3. Paola Avella, MPI for Physics - HLL 3rd Belle II PXD/SVD Workshop 3 Motivations of EMCM testing A substrate with inter-chip wirings on which a certain number of ASICs are mounted. WHY TESTING THE EMCM Discover defects in the substrate before connection of the ASICs:  avoid waste of expensive ASICs  improve reliability of the module Adapted from A. B. Kahng and al., Optimal algorithms for Substrate Testing in Multi-Chip Modules, World Scientific Publishing Co., 1996 ASIC

4. The Belle II Electrical-Multi-Chip Module Paola Avella, MPI for Physics - HLL 3rd Belle II PXD/SVD Workshop 4 ~ 70 mm 7 modules per wafer 3 metal layers 6 SWITCHERs4 DCDs 4 DHPs

5. Failure test [I] : discontinuities Paola Avella, MPI for Physics - HLL 3rd Belle II PXD/SVD Workshop 5 P1 P3 P2 P4 V1 V2

6. Failure tests [II] : adjacencies Paola Avella, MPI for Physics - HLL 3rd Belle II PXD/SVD Workshop 6 2D Adjacencies3D Adjacencies

7. From layout to X-Y coordinates Paola Avella, MPI for Physics - HLL 3rd Belle II PXD/SVD Workshop 7 I n numbers: Total number of test-points: 4631 Total number of nets: 2149 Discontinuities: 819 tests/module, with > 2k touchdowns Adjacencies: 2101 tests/module, with > 110k touchdowns ad hoc parser.ipc file Cadence layout courtesy of C. Koffmane

8. Instrumentation Paola Avella, MPI for Physics - HLL 3rd Belle II PXD/SVD Workshop 8 SUSS Probe station PA200 equipped with 2 flying probes ●SUSS Semi-automatic probe PH600 ●Cascade Semi-automatic probe PH510 (max range 25 mm) Keithley 4200 Semiconductor Characterization System Agilent LCR meter 4280 Measurement instruments

9. Testing strategy [I] Paola Avella, MPI for Physics - HLL 3rd Belle II PXD/SVD Workshop 9 Assign east/west regions to probes  sorting conveniently pair of points  taking care of the probes’ range  taking care of the pad’s material PH510PH600 d < 50 mm ●Allow for movements of the chuck where d > 50 mm capacitance measurements (using one probe) ●Allow for the minimum number of touchdowns per pad ●Combine, where possible, capacitance/resistance measurements resistance measurements

10. Testing strategy [II] Paola Avella, MPI for Physics - HLL 3rd Belle II PXD/SVD Workshop 10 ~ 70 mm Start from testing shorts on the EOS, i.e. between:  DGND  AGND  DCD-AVDD  DCD-AmpLow Reduce the number of test-areas:  Short digital inputs of switchers  Test master DCD and DHP

11. Summary and future plans Paola Avella, MPI for Physics - HLL 3rd Belle II PXD/SVD Workshop 11 Map of the pads to be tested Instrumentation suitably programmed with routines fully integrated in the measurement instrument’s software environment and customised for EMCM testing Awareness of the limitations of the actual probe system Testing strategy which includes an initial reduced test of selected small areas Consideration of possibilities of using a different flying probe system for the full EMCM testing

12. Paola Avella, MPI for Physics - HLL 3rd Belle II PXD/SVD Workshop 12 Thank you!