1. FPI Training Material
New Product Development Group 1

2. Ⅰ What is Fingerprint?
The definition of minutia feature is made from modern fingerprint method by E.R. Henry, a British scholar, which is Henry System Classification. He classified the fingerprint as 2 parts and 8 types. If there are 13 features matching, Henry will consider they are same fingerprint. The gap between 2 ridges are between 300 to 500 μm, while the height difference are between 100 to 400 μm. In order to get enough feature points for identification, the size and resolution of the fingerprint image should be 1cm x 1cm and 500dpi.

3. Ⅰ What is Fingerprint?

4. Ⅰ What is Fingerprint?

5. Ⅱ Fingerprint Identification System and Application

6. Ⅱ Fingerprint Identification System and Application
ENROLMENT:
Extraction of biometric data and construction of template
FTE: Failure To Enrol Template
Verification (1:1):
User: “I am Christian”
System: “Yes you are” or “No, you are not”
Identification (1:n) or (1:many):
User: “Here I am”
System: “You are Christian” or “I do not know you”

7. Ⅱ Fingerprint Identification System and Application
VERIFICATION:Comparison of captured biometric data with one predetermined stored template
FRR: False Rejection Rate
FAR: False Acceptance Rate

8. Ⅱ Fingerprint Identification System and Application
IDENTIFICATION:Comparison of captured biometric data with many stored template in database

9. Ⅱ Fingerprint Identification System and Application
Fingerprint Identification provides a safe and convenient method for ID Verification and Management
Cellphone/PAD Unlocking
App. Access Control
Folder Encryption
Fast Logging(alternative for digital code)
Quick Launch and Logging
Express Payment

10. Optical：Illuminant+CMOS+Lens Ultrasonic：determine the distance
Ⅲ Fingerprint Sensoring Principle
Capacity Type
Trans Capacitive
Self Capacitance
Optical：Illuminant+CMOS+Lens
Ultrasonic：determine the distance
Two types: Area vs. Swipe Sensor

11. Self Capacitance Ⅲ Fingerprint Sensoring Principle Sapphire Cover Lens
Exciter Ring
Sense Pixel Array

12. Ⅲ Fingerprint Sensoring Principle
Each square is pixel RX
Finger is TX
Driven by Exciter
Ridge
Valley
Excitation voltage ~1 MHz coupled into finger via Exciter Ring or Bezel
Sense Amps at each pixel measure capacitance between finger and pixel
Very good sensitivity, but active circuitry at each pixel needed

13. Trans Capacitive Ⅲ Fingerprint Sensoring Principle Very fine TouchPadTX RX
Ridge
Valley
Very fine TouchPad
Sense trace spacing typically um
16 MHz 3V RF placed onto successively-scanned TX rows

14. Swipe Type Sensor Ⅲ Fingerprint Sensoring Principle Host Platform
Reconstruct Image
Extract Minutiae
M1={x1,y1,a1,z1)
M2={x2,y2,a2,z2}
...
Raw Image Data
Fingerprint Template

15. Ⅲ Fingerprint Sensoring Principle
Area Type Sensor

16. Ⅳ FPI Module Structure and Sensor List
I Molding + Ultra thin cover lens
II Molding+Thick CoverLens

17. Ⅳ FPI Module Structure and Sensor List
III Molding+Coating
IV CoverLens（Independent)

18. Ⅳ FPI Module Structure and Sensor List
V Under Glass
FPI Module RoadMap MP PP MP PP MP
R&D PP MP
R&D PP MP

19. Molding+Coating Structure FPI Appearance and Surface Magnification
Ⅳ FPI Module Structure and Sensor List
Molding+Coating Structure FPI Appearance and Surface Magnification
Features
Coating
Sapphire Lens
Glass(thick) Lens
Glass(thin) Lens
Appearance
Hardness
Cost
IC Compatibility
MP Capacity
IC Sources for Truly
Goodix、Silead
Goodix
Goodix、Silead、MicroArray

20. Ⅳ FPI Module Structure and Sensor List
FPI Solutions
IC Supplier
IC P/N
IC Packaging
IC Size
Pixels
0.26mm Saphire/Glass Cover Lens
Goodix
GF616
COB+Trench+Exposed Molding
4.2*12*0.47
68*118
GF816
COB+Trench++Exposed Molding
GF818
96*96
0.2mm Glass Cover Lens
GF516
COB+Molding
GF518M
Silead
GSL6163DPR
Die
109*123
MicroArray
AFS120
TVS
Square
0.05mm Ultra-thin Glass Cover Lens
/Coating
GSL6162MSB
COB+Trench++Molding
110*118
GSL6162MRB
GSL6162EM
GSL6172MTB
80*200
GF316
GF318

21. Ⅴ Production Capacity Plan

22. Ultra-thin Glass Cover Lens
Ⅵ Market Information
Smart
Phone
Apple
iPhone6/Plus
HuaWei
Mate 7
OPPO N3
Meizu
Mx4Pro
GuanQun
3022
Type
Sapphire Cover Lens
Coating
Ultra-thin Glass Cover Lens
Sensor
Authentic
FPC
Goodix
Silead
Module Vendor
Taiwan ASE
Korea CrucialTec
A-Kerr
Truly
Cost
13 USD
8 USD
11 USD
10 USD

23. LENS Manufacturing Process：
Substrate Cleaning→Silkscreen/Ink Spraying →Solidification→AF Evaporation→Cutting
→Splintering→LENS QC
Assembly Process：
FPC Baking→Solder Paste Printing→Chip Mounting →Reflow Soldering→Gel Filling →Solidification →Washing→LENS Lamination→Autoclave→ Solidification→Semi-finished Product Electrical QC→Holder Attaching→ Solidification →Label Printing →Splintering→Silicone Pad Attaching →Finished Product Electrical QC →Protective Film Attaching→Visual Inspection→OQC→Shipping

24. Sensor Supplier Qualification List Qualcomm (Ultrasonic)
√ Qualified ×Total Rejected Updated by 2015/03/15
Class
Customer
FPC
Goodix
Synaptics
Silead
Qualcomm (Ultrasonic)
1st Tier Brand
VIVO √ x
OPPO
Huawei
ZTE
Xiaomi
2nd and 3rd Tier Brand
LeTV
K-Touch
TCL
Gionee
Design House
Ragentek
SIMCOM

25. FPI Module Manufacturing Ability Matrix 20150430
Molding
Coating
Optical Bonding
Sensor Resources
Truly × √
Goodix, Silead, MicroArray
O-Film
FPC, Goodix
A-Kerr
Goodix, MicroArray
WLCSP
Silead
Crucial Tec
FPC, Idex

26. Notes for Design Stage
Independent power for FPI Module to make sure pure AVDD without noise.
If the FPI module is placed on the back of smartphone, and the rear cover is made of metal(connected to GND), customer need to contact the sensor supplier need to confirm the potential risk.
If the FPI module is placed on the front side, and the middle- frame is made of metal(connected to GND), customer need to contact the sensor supplier need to confirm the potential risk.

27. Debugging Notice Silead Sensor Debugging Suite.
The debugging suites for Android 4.2/4.4 are OK
The debugging suite for Android 5.0 will be OK by the end of this month.