Download presentation
Presentation is loading. Please wait.
Published byMagdalene Franklin Modified over 9 years ago
1
MEDIPIX, RELAXD... and BEYOND Nikhef Jamboree 16-12-2008 Jan Visschers, Detector R&D, Nikhef
2
16-12-2008/JV3s 2 Medipixhybrid pixel detectors Large-Area Tiling ReLAXDongoing project XFEL-HPADa detector for photon physics Hidralonhuman diagnostics Future Plans and Motivations Outline
3
The Medipix Family (1) 16-12-2008/JV3s 3 Collaboration(s) based at CERN. Multi-disciplinary: HEP, Bio, Atomic, Astro,... ~25 Universities and Research Institutes (most from EU, 2 US, 1 New Zealand) Chip-design mostly at CERN Readout, Firmware, Software and Applications mostly by other members Nikhef active in Readout, Firmware, Industrial Applications and HEP applications
4
The Medipix Family (2) 16-12-2008/JV3s 4 Medipix 1Medipix 2TimePixMedipix 3 Technology( nm)1000250 130 Pixelsize ( μ m) 17055 55/110/220 Chipsize (cm 2 )1.2222 Counter (bits)1513 (+1) 1/2/4/12/24 Thresholds1212/8 Min Thresh (e)+1500+/- 1000+/- 800+/- 600? Arrival Timeno Common-Stop TDCno Photon Energyno1 windowTime-over-Threshold ADC 8 windows Charge Summing Date of Birth1997200220062008
5
Photon Counting 16-12-2008/JV3s 5 Geiger Mueller tube (WikiPedia)
6
Hybrid Pixel Detector 16-12-2008/JV3s 6 Semiconductor as Sensor Substrate Flip-chip solder bumps ~20 μ m diameter
7
Pixel Cell, ~400 transistors (Xavi Llopart) Chip Architecture 256 x 256 pixels, 14 x 16 mm 2 CMOS Chip Design 16-12-2008/JV3s 7
8
Small and Beautiful result: 16-12-2008/JV3s 8 14 x 16 mm 2 “Digital Camera” for E γ > ~3 keV
9
But you need Big machines: 16-12-2008/JV3s 9 Spinners and mask aligners FC150 Flipchip bonder Suss Microtec Die- and Wire-bonders Wafer Dicers Analysis: SEM, shear tester etc… Need: MESA, IMEC, IZM, VTT, IRT, … And: Silicon Alley at Nikhef
10
300 mm Wafer Prober at Nikhef 16-12-2008/JV3s 10 Arrived Yesterday in Si-Alley !
11
Reversely-Engineering 4 Pixels 16-12-2008/JV3s 11 Medipix2 Chip fixed on holder by Carbon tape Total 3540 s of polishing SEM Imaging multiple stack layers with one polishing step In total 6 metal layers (work done in Silicon Alley by bachelor student of hogeschool Rijswijk) (D. Boltje, G. Blaj)
12
Medipix3: Layout 16-12-2008/JV3s 12 Pixel: ~1600 transistors Chip: ~100x10 6 transistors (X. Llopart, R. Ballabriga)
13
Medipix3: Spectral Imaging 16-12-2008/JV3s 13 +1 Sum the charges of neighbouring pixels And count them only in the “Largest”
14
The next step: Large Area Tiling 16-12-2008/JV3s 14 # Chips# PixelsTotal Area cm 2 1-chip165 5362 Quad4262 1448 Octet8524 28816 ReLAXD362 Megapixels36 XFEL4 x 4816 Megapixels 4 x10 x 10 Hidralon??~ 30 x 40
15
Done: 1-chip, Quad, Octet 16-12-2008/JV3s 15 “Swatch movie” with quad Single Quad Octet
16
R&D: RELAXD 16-12-2008/JV3s 16 Four-side tilable Quad-Medipix modules Fast serial readout at 3.125 Gigabit/s High REsolution Large Area X-ray Detector http://www.nikhef.nl/pub/experiments/medipix PANalytical NIKHEF CANBERRA IMEC 2006-2010
17
Through-Wafer-Via 16-12-2008/JV3s 17 Ball-Grid-Array replaces the wire bonds Better: Robustness HF properties Thermal conductivity Electrical conductivity Through-Si Via’s Piet de Moor (IMEC) R ~40mO (25µm wire) 20-30mO 1mmwirebond3D-WLP via R ~200m (25µm wire) 20-30m 5mmwirebond3D-WLP via
18
Multi Gigabit/s board and dimensions 16-12-2008/JV3s 18 Dimensions: 3cm x 8.3cm (Bas van der Heijden)
19
ReLAXD: now almost done... 16-12-2008/JV3s 19 (Jan Visser) Proto: 4-Quad Next : 16-Quad
20
XFEL: Free Electron Laser (Desy) 16-12-2008/JV3s 20 (Heinz Graafsma, Desy)
21
XFEL Beamline Layout 16-12-2008/JV3s 21 Distribution of the 5 (3) beamlines, with 2 experimental stations each (Heinz Graafsma, Desy)
22
Detector Building blocks 16-12-2008/JV3s 22 Detector head Rack/crate/instrument style systems main fast data stream control, monitoring, synchronizing, veto infrastructure e.g. cooling, power digitizing, data sorting and formatting, ASIC/link control integrating, analogue storage with 5MHz and analogue multiplexing common for all XFEL-detectors? (Heinz Graafsma, Desy)
23
Detector ASIC: 64 64 pixels 16-12-2008/JV3s 23 control from interface electronics C1 C2 C3 discr. control logic 2 bit analog pipeline filter DAC digital pipeline amp 400 cells multiplexing between pixels/bunches 4 analogue lines 2 bits per bunch per pixel bunch clock, train start, usage of bunch bunch clock, train start usage of bunch fast veto train stop readout control boot data few bits/pixel Highest gain: 0 to 256 photons (Heinz Graafsma, Desy)
24
Module mechanics 16-12-2008/JV3s 24 Each interface has to fit behind active area no depth limitation Separate PCB constructions for low-EMI analogue and high dense digital Heat per module: 40W (Heinz Graafsma, Desy)
25
HPAD: a pixel detector for XFEL 16-12-2008/JV3s 25 - 1Mpixel: 1024 1024 pixel - 4 Quadrants to allow beam hole - 32 modules for 256 128 pixel - 8 ASIC's/module: 64 64pixel -pixel: 200µm 200µm Module: size: ~ 51.2 25.6mm 2 pixels: 32K K=1024 XFEL Current first dates for: 1 st beam injector ~ end. 2012 1 st beam Linac ~ end. 2013 1 st SASE(1) at 0.2nm ~ end. 2014 (P. Goettlicher, Desy) N.B. Collaboration with PSI, Bonn, Hamburg, Desy All of them HEP-institutes!!
26
Experiments 16-12-2008/JV3s 26 Coherent imaging of “small things” (structure) Photon Correlation Spectroscopy (time evolution) Pump-Probe diffraction (non-equilibrium states) Small Quantum systems Warm dense matter (“plasmas”) Unexpected effects (Heinz Graafsma, Desy) N.B. Physics for AMOLF, Rijnhuizen, Bio-medical, Pharma, … But Detector R&D compatible with HEP-ILC !!
27
Hidralon : a.o. Human Diagnostics 16-12-2008/JV3s 27 Improve CMOS imagers for Entertainment/Broadcasting, Automotive & Medical Digital Radiography, (Mammography, CT, PET, SPECT, Dual-mode) Latest News: EZ/SenterNovem Funding for a.o. Philips Healthcare and Nikhef !!!! www.philips.com
28
Amorphous Silicon Panels 16-12-2008/JV3s 28
29
Direct Conversion: CdTe or GaAs 29 Si: FOV 84x84mm, Pixel pitch 55 μ m, 10kV / 120uA, distance 40cm, 0.1sec, photon counting. http://www.nikhef.nl/pub/experiments/medipix/relaxd.html CzTe: FOV 38x69mm, Pixel pitch 100 μ m, 80kV / 80uA, distance 50cm, 0.5 sec, integrating. http://www.acrorad.co.jp 16-12-2008/JV3s
30
Future 16-12-2008/JV3s 30 Jan Visschers will gradually eclipse, but Jan Visser takes the over the helm from 1-1-2009 !!!
31
Plans and Motivations 16-12-2008/JV3s 31 Expand : Generic pixel detector R&D Multi-disciplinary contacts Mesa, Dimes, Leiden, Amolf, Rijnhuizen, Radboud, KVI PANalytical, Philips, Thomson, DEP/Photonis IMEC, IZM, VTT, Canberra Obtain: Appreciation in Dutch R&D world Funding from unusual sources (Industry, EZ, EU) PhD students from high-tech curricula Develop new technologies for High-Energy Physics (cf. next speaker Harry van der Graaf)
Similar presentations
© 2025 SlidePlayer.com Inc.
All rights reserved.