1. MEDIPIX, RELAXD... and BEYOND Nikhef Jamboree 16-12-2008 Jan Visschers, Detector R&D, Nikhef

2. 16-12-2008/JV3s 2  Medipixhybrid pixel detectors  Large-Area Tiling  ReLAXDongoing project  XFEL-HPADa detector for photon physics  Hidralonhuman diagnostics  Future Plans and Motivations Outline

3. The Medipix Family (1) 16-12-2008/JV3s 3 Collaboration(s) based at CERN. Multi-disciplinary: HEP, Bio, Atomic, Astro,... ~25 Universities and Research Institutes (most from EU, 2 US, 1 New Zealand) Chip-design mostly at CERN Readout, Firmware, Software and Applications mostly by other members Nikhef active in Readout, Firmware, Industrial Applications and HEP applications

4. The Medipix Family (2) 16-12-2008/JV3s 4 Medipix 1Medipix 2TimePixMedipix 3 Technology( nm)1000250 130 Pixelsize ( μ m) 17055 55/110/220 Chipsize (cm 2 )1.2222 Counter (bits)1513 (+1) 1/2/4/12/24 Thresholds1212/8 Min Thresh (e)+1500+/- 1000+/- 800+/- 600? Arrival Timeno Common-Stop TDCno Photon Energyno1 windowTime-over-Threshold ADC 8 windows Charge Summing Date of Birth1997200220062008

5. Photon Counting 16-12-2008/JV3s 5 Geiger Mueller tube (WikiPedia)

6. Hybrid Pixel Detector 16-12-2008/JV3s 6 Semiconductor as Sensor Substrate Flip-chip solder bumps ~20 μ m diameter

7. Pixel Cell, ~400 transistors (Xavi Llopart) Chip Architecture 256 x 256 pixels, 14 x 16 mm 2 CMOS Chip Design 16-12-2008/JV3s 7

8. Small and Beautiful result: 16-12-2008/JV3s 8 14 x 16 mm 2 “Digital Camera” for E γ > ~3 keV

9. But you need Big machines: 16-12-2008/JV3s 9  Spinners and mask aligners  FC150 Flipchip bonder Suss Microtec  Die- and Wire-bonders  Wafer Dicers  Analysis: SEM, shear tester etc… Need: MESA, IMEC, IZM, VTT, IRT, … And: Silicon Alley at Nikhef

10. 300 mm Wafer Prober at Nikhef 16-12-2008/JV3s 10 Arrived Yesterday in Si-Alley !

11. Reversely-Engineering 4 Pixels 16-12-2008/JV3s 11  Medipix2 Chip fixed on holder by Carbon tape  Total 3540 s of polishing  SEM Imaging multiple stack layers with one polishing step  In total 6 metal layers  (work done in Silicon Alley by bachelor student of hogeschool Rijswijk) (D. Boltje, G. Blaj)

12. Medipix3: Layout 16-12-2008/JV3s 12 Pixel: ~1600 transistors Chip: ~100x10 6 transistors (X. Llopart, R. Ballabriga)

13. Medipix3: Spectral Imaging 16-12-2008/JV3s 13 +1 Sum the charges of neighbouring pixels And count them only in the “Largest”

14. The next step: Large Area Tiling 16-12-2008/JV3s 14 # Chips# PixelsTotal Area cm 2 1-chip165 5362 Quad4262 1448 Octet8524 28816 ReLAXD362 Megapixels36 XFEL4 x 4816 Megapixels 4 x10 x 10 Hidralon??~ 30 x 40

15. Done: 1-chip, Quad, Octet 16-12-2008/JV3s 15 “Swatch movie” with quad Single Quad Octet

16. R&D: RELAXD 16-12-2008/JV3s 16 Four-side tilable Quad-Medipix modules Fast serial readout at 3.125 Gigabit/s High REsolution Large Area X-ray Detector http://www.nikhef.nl/pub/experiments/medipix PANalytical NIKHEF CANBERRA IMEC 2006-2010

17. Through-Wafer-Via 16-12-2008/JV3s 17 Ball-Grid-Array replaces the wire bonds Better:  Robustness  HF properties  Thermal conductivity  Electrical conductivity Through-Si Via’s Piet de Moor (IMEC) R ~40mO (25µm wire) 20-30mO 1mmwirebond3D-WLP via R ~200m  (25µm wire) 20-30m  5mmwirebond3D-WLP via

18. Multi Gigabit/s board and dimensions 16-12-2008/JV3s 18 Dimensions: 3cm x 8.3cm (Bas van der Heijden)

19. ReLAXD: now almost done... 16-12-2008/JV3s 19 (Jan Visser) Proto: 4-Quad Next : 16-Quad

20. XFEL: Free Electron Laser (Desy) 16-12-2008/JV3s 20 (Heinz Graafsma, Desy)

21. XFEL Beamline Layout 16-12-2008/JV3s 21 Distribution of the 5 (3) beamlines, with 2 experimental stations each (Heinz Graafsma, Desy)

22. Detector Building blocks 16-12-2008/JV3s 22 Detector head Rack/crate/instrument style systems main fast data stream control, monitoring, synchronizing, veto infrastructure e.g. cooling, power digitizing, data sorting and formatting, ASIC/link control integrating, analogue storage with 5MHz and analogue multiplexing common for all XFEL-detectors? (Heinz Graafsma, Desy)

23. Detector ASIC: 64  64 pixels 16-12-2008/JV3s 23 control from interface electronics C1 C2 C3 discr. control logic 2 bit analog pipeline filter DAC digital pipeline amp 400 cells multiplexing between pixels/bunches 4 analogue lines 2 bits per bunch per pixel bunch clock, train start, usage of bunch bunch clock, train start usage of bunch fast veto train stop readout control boot data few bits/pixel Highest gain: 0 to 256 photons (Heinz Graafsma, Desy)

24. Module mechanics 16-12-2008/JV3s 24 Each interface has to fit behind active area no depth limitation Separate PCB constructions for low-EMI analogue and high dense digital Heat per module: 40W (Heinz Graafsma, Desy)

25. HPAD: a pixel detector for XFEL 16-12-2008/JV3s 25 - 1Mpixel: 1024  1024 pixel - 4 Quadrants to allow beam hole - 32 modules for 256  128 pixel - 8 ASIC's/module: 64  64pixel -pixel: 200µm  200µm Module: size: ~ 51.2  25.6mm 2 pixels: 32K K=1024 XFEL Current first dates for:  1 st beam injector ~ end. 2012  1 st beam Linac ~ end. 2013  1 st SASE(1) at 0.2nm ~ end. 2014 (P. Goettlicher, Desy) N.B. Collaboration with PSI, Bonn, Hamburg, Desy All of them HEP-institutes!!

26. Experiments 16-12-2008/JV3s 26  Coherent imaging of “small things” (structure)  Photon Correlation Spectroscopy (time evolution)  Pump-Probe diffraction (non-equilibrium states)  Small Quantum systems  Warm dense matter (“plasmas”)  Unexpected effects (Heinz Graafsma, Desy) N.B. Physics for AMOLF, Rijnhuizen, Bio-medical, Pharma, … But Detector R&D compatible with HEP-ILC !!

27. Hidralon : a.o. Human Diagnostics 16-12-2008/JV3s 27 Improve CMOS imagers for Entertainment/Broadcasting, Automotive & Medical Digital Radiography, (Mammography, CT, PET, SPECT, Dual-mode) Latest News: EZ/SenterNovem Funding for a.o. Philips Healthcare and Nikhef !!!! www.philips.com

28. Amorphous Silicon Panels 16-12-2008/JV3s 28

29. Direct Conversion: CdTe or GaAs 29 Si: FOV 84x84mm, Pixel pitch 55 μ m, 10kV / 120uA, distance 40cm, 0.1sec, photon counting. http://www.nikhef.nl/pub/experiments/medipix/relaxd.html CzTe: FOV 38x69mm, Pixel pitch 100 μ m, 80kV / 80uA, distance 50cm, 0.5 sec, integrating. http://www.acrorad.co.jp 16-12-2008/JV3s

30. Future 16-12-2008/JV3s 30 Jan Visschers will gradually eclipse, but Jan Visser takes the over the helm from 1-1-2009 !!!

31. Plans and Motivations 16-12-2008/JV3s 31 Expand :  Generic pixel detector R&D  Multi-disciplinary contacts  Mesa, Dimes, Leiden, Amolf, Rijnhuizen, Radboud, KVI  PANalytical, Philips, Thomson, DEP/Photonis  IMEC, IZM, VTT, Canberra Obtain:  Appreciation in Dutch R&D world  Funding from unusual sources (Industry, EZ, EU)  PhD students from high-tech curricula  Develop new technologies for High-Energy Physics (cf. next speaker Harry van der Graaf)