September 2004 doc.: IEEE Submission Slide 1 Jack Pardee, INNOV8RS, LLC Project: IEEE Working Group for Wireless Personal Area Networks (WPANs) Submission Title: [Response to the No Comments Involving Time To Market Issues] Date Submitted: [14Sept2004] Source: [Jack Pardee] Company [Innov8rs, LLC] Address [9135 W. Manitoba St. #2, Milwaukee, WI, USA] Voice:[ ], FAX: [], Re: [ a-consolidation-explanations-no-vote-confirmation.doc] Abstract:[Response to a No Vote Comments] Purpose:[Explain rationale for how one or more no votes for confirmation of DS-UWB merger #2 proposal have been addressed by the merger #2 comment resolution team.] Notice:This document has been prepared to assist the IEEE It is offered as a basis for discussion and is not binding on the contributing individual(s) or organization(s). The material in this document is subject to change in form and content after further study. The contributor(s) reserve(s) the right to add, amend or withdraw material contained herein. Release:The contributor acknowledges and accepts that this contribution becomes the property of IEEE and may be made publicly available by

September 2004 doc.: IEEE Submission Slide 2 Jack Pardee, INNOV8RS, LLC Time To Market – Overview Selection Criteria Definitions Representative No-Voter Comments Consolidated Comment Questions and Answers

September 2004 doc.: IEEE Submission Slide 3 Jack Pardee, INNOV8RS, LLC Time To Market – Selection Criteria Definition Time to Market addresses the question of when the proposed technology will be ready for integration Values The Proposal shall include an estimate of a schedule for when the Phy would be available for integration

September 2004 doc.: IEEE Submission Slide 4 Jack Pardee, INNOV8RS, LLC Representative TTM Comments #3 - It is not clear what the time to market for this proposal is. #55 - I would consider changing my "NO" vote for merged proposal #2 to a "YES" vote if: There is a better explanation of the time-to-market considerations. #84 - I also have concern for power and time to market. Lack of data for these items is still missing

September 2004 doc.: IEEE Submission Slide 5 Jack Pardee, INNOV8RS, LLC TTM Comments Continued #29 - Time to market Merge proposal #2 has repeatedly claimed time to market advantages because of "silicon shipping today". I have heard these claims for almost 2 years now repeated over and over again but there is no evidence that this is true. Since this proposal has changed as recently as last meeting, I am worried about time-to-market with this proposal because there is so much work to do and they are so far behind the dozens of vendors already building silicon and end products based on the MBOA proposal. Additionally, in the IEEE meetings the presenters or merged proposal #2 have repeatedly made contradictory statements about whether or not the proposal they are presenting represents the silicon they claim is commercially available …* For me to change my no vote to yes would require seeing working silicon that implements the proposal as I fear there is significant time to market concerns for merge proposal #2. In addition, I would require that credibility of their claims be re-established since there are so many inconsistencies in their past claims. * Some text omitted. See Comment resolution database for full text.

September 2004 doc.: IEEE Submission Slide 6 Jack Pardee, INNOV8RS, LLC TTM Comments Continued #73 - Merge proposal #2 claims time to market advantage of silicon that is supposedly available in the market as generation 3; however, merge proposal #2 has recently drastically changed and the silicon does not represent the proposal before us; does not meet performance requirements as specified by the selection criteria, including power consumption.

September 2004 doc.: IEEE Submission Slide 7 Jack Pardee, INNOV8RS, LLC TTM Comments Continued #152 - Merge proposal #2 claims time to market advantage of silicon that is supposedly available in the market as generation 3; however, merge proposal #2 has recently drastically changed and the silicon does not represent the proposal before us; does not meet performance requirements as specified by the selection criteria, including power consumption.

September 2004 doc.: IEEE Submission Slide 8 Jack Pardee, INNOV8RS, LLC TTM Comments Continued #200 - Freescale has not addressed the questions raised regarding time to market issues with their proposal. The proposal has changed significantly several times, and yet they have continued to say they have ICs ready to ship with each version of their proposal. This is not a realistic statement.

September 2004 doc.: IEEE Submission Slide 9 Jack Pardee, INNOV8RS, LLC TTM Comments Continued #253 - Time to Market - There is too much confusion in the argumentation about DS-UWB products. The arguments since 2003 are that "the silicon is already here, the production has started". However many changes have occurred since that time in Proposal#2, and the way the current silicon reflects or will reflect that (technical changes, interoperability, worldwide regulation) is very unclear to me (gate count, power consumption etc.).

September 2004 doc.: IEEE Submission Slide 10 Jack Pardee, INNOV8RS, LLC Consolidated Time To Market Comment Questions and Answers Q1: What is time to market for DS-UWB proposal? A1: The current version (… r3) of the Merged Proposal #2 Phy design proposal is available for integration now. (September ‘04)

September 2004 doc.: IEEE Submission Slide 11 Jack Pardee, INNOV8RS, LLC Time To Market – Consolidated Questions and Answers Q2: What is the currency of the specification proposed for standardization vis-à- vis the silicon chips in DS-UWB products currently being shipped? A2: Products using integrated circuits that implement the current version (…r3) of the Merged Proposal #2 are estimated to be available in the market from multiple Tier 1 vendors in Q4 of Experience gained from these pre-standard integration implementations provide real world validation of the technology and provide feedback for enhancing the final standard and expediting development of fully compliant products.