2/9/04 1 LBNL LC-TPC Activities ● International LC-TPC R&D ● Physics and Detector Simulations ● Micromegas-based TPC R&D ● US-Japan TPC R&D Proposal ●

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Presentation transcript:

2/9/04 1 LBNL LC-TPC Activities ● International LC-TPC R&D ● Physics and Detector Simulations ● Micromegas-based TPC R&D ● US-Japan TPC R&D Proposal ● American Large TPC Detector Design ●International LC-TPC R&D●Micromegas-based TPC R&D●US-Japan Proposal●Americal Large TPC Detector●International LC-TPC R&D●Micromegas-based TPC R&D●US-Japan Proposal●Americal Large TPC Detector

2/9/04 1 International LC-TPC R&D US – Japan – Europe LC-TPC R&D coordination: Takeshi Matsuda KEK Mike Ronan LBNL Ron Settles DESY/MPI Organize international LC-TPC R&D meetings, e.g. Jan Carleton- following American LC Chicago meeting Sep KEK- following International LCWS meeting at Jeju Is., Korea Oct LBNL- following Berkeley TPC Symposium Apr Paris- before International LCWS in Paris American Large TPC Detector Layed out conceptual design and wrote LCD reconstruction software. Studied physics performance and LC background sensitivity. TESLA-TPC Contributed to TPC design in TESLA TDR. Member of European LC-TPC R&D Steering Committee. Ongoing LC-TPC R&D Collaborations: Micromegas-based TPC R&D (Berkeley, Orsay & Saclay) GEM-based TPC R&D (Berkeley, CERN, Karlsruhe & MPI) TPC DAQ and Analysis software (Berkeley, Carleton, Montreal & Victoria) TPC Simulation software (Berkeley, Cornell, SLAC & Victoria) US-Japan LC-TPC R&D (Berkeley, KEK, MPI & Tokyo)

2/9/04 1 LCD Modules: Hit smearing TPC Pattern recognition Event display... LCIO JAS histograms AIDA tuples American Large TPC Detector Simulations

2/9/04 1 Micromegas-based TPC R&D 2x10 mm 2 pads 1024 pads 1x10 mm2 pads Readout anode pad plane Berkeley Saclay Orsay Chamber diameter 50 cm length 50 cm Mesh 50  m pitch 50  m gap

2/9/04 1 Online Event Display Ar-Iso 5%, Vmesh = 300 V B = 1 Tesla wT ~ 2

2/9/04 1 GasArgon CF4 3% E field200 V/cm v drift 9-10 cm/  sec diffusion~400  1 cm Micromegas Vmesh340 V Expected transverse diffusion For B = 3 T and d = 50 cm1 m2.5 m  m Position resolution limits (1 cm pads)  m B field  Diff. (  m/sqrt(cm)) 0 T T T T T T20 20 Transverse Diffusion Measurement Measure Diff. (B=1T) =  m/sqrt(cm) Diffusion [mm^2] Distance B = 1 Tesla

2/9/04 1 Attenuation vs. drift time Ar-CF4 attenuation check: Use all 10 pad rows. Calculate truncated mean. Plot average track TrMean in several drift time bins. Find no significant attenuation in low field (200V/cm) drift volume. Attenuation Measurement TrMean 0 cm 50 cm Att. Length > 243 cm 95% conf. level)

2/9/04 1 US-Japan Proposal Phase IKEK TPC Testing w/ MPI Munich MPI TPC Chamber dimensionsdia. 25 cm readout options:Wire or GEM Electronics STAR FEE cards256 channels New VME readout module Magnet thin coil1.2 T large bore80 cm KEK test beam Phase IINew composite TPC New large-area composite TPC dimensionsdia. 80 cm, length 80 cm Electronics ALTRO chipzero suppression,... Phase IIINew electronics Next generation RO electronics new chip design New versions of MPGD's 1mm/kV Surface Standoff Rohacell Foam ~25mm EMI Foil ~  Al G10 doubler (thin) Termin ation Ring (Al) G10 insulator— thickness to stand-off required HV HV Stripe Ground Stripe Carbon Structural Shell (2-3mm) Plated Thru Holes Shorts Outer Stripes to corresponding inner stripes Field Cage Bonded Assembly Cu-Kapton Double sided flex circuit printed with field degradation stripes backside art helps to ‘pull-down’ charge collected on insulator between stripes in active volume

2/9/04 1 American Large TPC Detector Design Large (TPC) reference detector Large TPC Chamber dimensionsdia. 2 m, half-length 2.5 m pad layout pad rows readout options:Wire or GEM or Micromegas Electronics Next generationover 1M channels Magnet outside cal.3-4 T Reconstruction3D Pattern Recognition LCD Java Framework modular design TPC Simulation smear space points with m resolution no-detector effects Tracking efficiency~ 99% Z(  ) + H(jets) event Hits: TPC (cyan), EM Cal (blue) Tracks (red), Clusters (green)