TPC electronics for ILD P. Colas Krakow, IFJ-PAN, ILD Pre-meeting September 24, 2013.

Slides:

Advertisements

Similar presentations

Front-end electronics for the LPTPC  Connectors  Cables  Alice readout electronics  New developments  New ideas  Open questions Leif Jönsson Phys.

Advertisements

LCWS12 Arlington October 22-26, 2012 D. Attié, P. Colas, M. Dixit, P. Hayman, T. Maerschalk, A. Robichaud, J. Timmermans, W. Wang.

Meeting on status and plans of the LP subsystems for the LP beamtest at DESY 02/25/2008 Franck SENÉE1 LP-TPC: Micromegas Panel and Cosmic Muon Trigger.

Bulk Micromegas Our Micromegas detectors are fabricated using the Bulk technology The fabrication consists in the lamination of a steel woven mesh and.

Front-end electronics for Time Projection Chamber I.Konorov Outlook:  TPC requirements  TPC readout options  Options for TPC FE chips  Prototype TPC.

1 Pixel readout for a LC TPC LCWA 2009 – Detectors Tracking session 30 September 2009 Jan Timmermans On behalf of the Bonn/CERN/Freiburg/Nikhef/Saclay.

Overview of the read-out electronics for the TPCs at T2K ND280m P. Baron, D. Calvet, X. De La Broïse, E. Delagnes, F. Druillole, J-L Fallou, J-M. Reymond,

Gaseous Tracking (TPC) Summary LCWT09 Nov. 5, 2009 LAL, Orsay Takeshi MATSUDA DESY/FLC 1.

P. Colas on behalf of LCTPC. 2 detector concepts : ILD and SiD SiD: all-silicon ILD: TPC for the central tracking 15/05/2012P. Colas - LCTPC2 Both based.

P. Colas on behalf of LCTPC Frontier detectors for frontier physics 12 th Pisa meeting on advanced detectors Isola d’Elba, May 2012.

Zeuthen, January 16, 2008 P. Colas - Micromegas panels1 Micromegas panels Status and plans D. Attié, P. Colas, X. Coppolani, M. Dixit, M. Riallot, F. Sénée,

Status and outlook of the Micromegas modules D. Attié, D.S. Bhattacharya, P. Colas, S. Ganjour, et al. LCTPC Collaboration meeting DESY, 30/05/2014.

Large Area Endplate Prototype for the LC TPC 1 D. Attié, P. Baron, D. Calvet, P. Colas, C. Coquelet, E. Delagnes, M. Dixit, A. Le Coguie, R. Joannes, S.

Micromegas Panels LP electronics P. Colas. Foreword We aim at 1 single system –Same DAQ : easier comparison, less duplicate work We have to keep in mind.

SALTRO TPC readout system Presented by Ulf Mjörnmark Lund University 1.

A TPC for the Linear Collider P. Colas, on behalf of the LCTPC collaboration Instrumentation for Colliding Beam Physics 2014 Novosibirsk, Russia.

Current TPC electronics P. Colas Krakow, IFJ-PAN, ILD Pre-meeting September 18, 2014.

TPC Large Prototype cosmic trigger and Micromegas panels D. Attié, P. Colas, E. Delagnes, M. Dixit, A. Giganon, M. Riallot, F. Senée, S. Turnbull Large.

Micromegas modules Towards the 7 module test. Micromegas panels Phase I: ‘Large Prototype’ Micromegas modules were built and tested in beam ( ):

Astrophysics Detector Workshop – Nice – November 18 th, D. Attié, P. Colas, E. Delagnes, M. Dixit, M. Riallot, Y.-H. Shin, S.

Post-AFTER and Post-S-ALTRO electronics P. Colas.

The AFTER electronics from a user’s point of view D. Attié, P. Colas Mamma meeting,CERN Feb T2K electronics.

Status report on the development of a readout system based on the SALTRO-16 chip Leif Jönsson Lund University LCTPC Collaboration Meeting

EPS-HEP 2015, Vienna. 1 Test of MPGD modules with a large prototype Time Projection Chamber Deb Sankar Bhattacharya On behalf of.

Micromegas TPC Results from beam tests 7-module design ILD TPC mechanics and integration D. Attié, M. Carty, P. Colas, G. De Lentdecker, M. Dixit, M. Riallot,

June 22, 2009 P. Colas - Analysis meeting 1 D. Attié, P. Colas, M. Dixit, Yun-Ha Shin (Carleton and Saclay) Analysis of Micromegas Large Prototype data.

Resistive anode studies D. Attié, P. Colas, E. Delagnes, M. Dixit, A. Giganon, M. Riallot, F. Senée, S. Turnbull Micromegas Large Prototype panels Studies.

Carbon-aluminum composite structures for the TPC, , Pierre Manil, 1 Detector structure: Carbon-aluminum composite structures for the TPC Pierre.

Update on the Triple GEM Detectors for Muon Tomography K. Gnanvo, M. Hohlmann, L. Grasso, A. Quintero Florida Institute of Technology, Melbourne, FL.

TPC Integration P. Colas (thanks to D. Attié, M. Carty, M. Riallot, LC-TPC…) TPC layout(s) Services Power dissipation Endplate thickness and cost Mechanical.

Takeshi Matsuda LC TPC Collaboration March 5, 2008 TPC Endcap Materials.

Towards a 7-module Micromegas Large TPC prototype 1 D. Attié, P. Baron, D. Calvet, P. Colas, C. Coquelet, E. Delagnes, M. Dixit, A. Le Coguie, R. Joannes,

R&D by LCTPC collaboration Last week: DESY PRC review: Status report:

Wenxin Wang 105/04/2013. L: 4.7m  : 3.6m Design for an ILD TPC in progress: Each endplate: 80 modules with 8000 pads Spatial Resolution (in a B=3.5T.

P. Colas on behalf of LCTPC. Strategy for Micromegas The Micromegas option is studied within the same (EUDET) facility as the other options (see R. Diener’s.

Wenxin Wang On behalf of LCTPC 01/11/2012W.Wang_ IEEE Conference Nuclear Science Symposium, Medical Imaging Conference & workshop on Room-Temperature.

Readout Architecture for MuCh Introduction of MuCh Layout of Much ( proposed several schemes) Read ASIC’s Key features Basic Readout chain ROC Block Diagram.

D. Attié, P. Baron, D. Calvet, P. Colas, C. Coquelet, E. Delagnes, R. Joannes, A. Le Coguie, S. Lhenoret, I. Mandjavidze, M. Riallot, E. Zonca TPC Electronics:

On behalf of the LCTPC collaboration VCI13, February 12th, 2013 Large Prototype TPC using Micro-Pattern Gaseous Detectors  David Attié 

TPC Large Prototype panels D. Attié, P. Colas, E. Delagnes, M. Dixit, A. Giganon, M. Riallot, F. Senée, S. Turnbull Status of the Micromegas Large Prototype.

1 19 th January 2009 M. Mager - L. Musa Charge Readout Chip Development & System Level Considerations.

D. Attié, P. Colas, E. Delagnes, M. Riallot M. Dixit, J.-P. Martin, S. Bhattacharya, S. Mukhopadhyay Linear Collider Power Distribution & Pulsing Workshop.

Status report on the development of a TPC readout system based on the SALTRO-16 chip and some thoughts about the next step Leif Jönsson AIDA Meeting Vienna.

AIDA 3rd Annual Meeting1 First test of MCM prototype board 1 G. De Lentdecker 2 L. Jönsson 2 U. Mjornmark 1 Y. Yang 3 F. Zhang 1 Université Libre de Bruxelles.

1 TPC Large Prototype (LP) Beam Tests Jan Timmermans NIKHEF/DESY (for LCTPC Collaboration) ALCPG 2011, Eugene.

Zeuthen, January 16, 2008 P. Colas - Micromegas panels1 Micromegas panels Status and plans D. Attié, P. Colas, X. Coppolani, M. Dixit, M. Riallot, F. Sénée,

D. Attié, P. Colas, K. Fujii,T. Matsuda, M. Riallot, A. Sugiyama, W. Wang Thanks to M. Dixit, Yun-Ha Shin, S. Turnbull,Yulan Li Construction and tests.

P. Colas D. Attié, P. Colas, I. Giomataris, W. Wang (Irfu) M. Dixit, N. Shiell, P. Hayman (Carleton U.) G. De Lentdecker (Brussels)

Development of the readout electronics in Lund for the ILD TPC Vincent Hedberg, Leif Jönsson, Anders Oskarsson, Björn Lundberg, Ulf Mjörnmark, Lennart.

Beam test Analysis Micromegas TPC by Wenxin Wang.

A Micromegas TPC for the ILC. 2 Introduction: Micromegas & TPC I. Micromegas ILC-TPC ILC & LP-TPC Beam test with Micromegas modules Test bench Ion backflow.

Readiness of the TPC P. Colas What is left before final design?

The future readout system based on SALTRO16

SUMMARY OF THE ORSAY LD-TPC ELECTRONICS MEETING

Large Area Endplate Prototype for the LC TPC

Electronics for ILD TPC

Mechanics for front-end Electronics Of T2K-II TPCs – A Few Conceptual Ideas D. Calvet, Irfu, CEA Saclay, Gif sur Yvette Cedex, FRANCE.

Power pulsing of AFTER in magnetic field

Micromegas module for ILC-TPC

TPC electronics for ILD

Toward the final design of a TPC for the ILD detector

TPC electronics design - GdSP

TPC Large Prototype Toward 7 Micromegas modules

Micromegas TPC D. Attié, M. Carty, P. Colas, G. De Lentdecker, M. Dixit, M. Riallot, YunHa Shin, S. Turnbull, W. Wang, and all the LC-TPC collaboration.

TPC Paul Colas Technical meeting, Lyon.

News from Micromegas modules

D. Attié, P. Colas, K. Fujii,T. Matsuda,

SALTRO16 activities in Lund

News from Micromegas modules

Presentation transcript:

TPC electronics for ILD P. Colas Krakow, IFJ-PAN, ILD Pre-meeting September 24, 2013

Electronics for LP: AFTER and SALTRO-16 The road to the electronics for ILD. ReadoutPad Size ElectronicsGroups MPGDs Micromegas (Resistive anode) (~ 3 × 7 mm 2 Pad) AFTERSaclay-Carleton Double GEMs (Laser-etched) (~ 1 × 6 mm 2 Pad) ALTRO Asia Triple GEMs (wet- etched) Desy Micromegas (test with 7 modules) GEM (test with 3 modules) 24/09/2013TPC electronics2

News and progress report from prototype electronics AFTER-based (ASIC For TPC Electronic Readout). Designed at Saclay for T2K. Adapted in to the Large Prototype. 72 channel Amplifier-shaper, full wave sampling by Switched Capacitor Aray, large versatility (1-100 MHz, ns peaking time, 120 to 600 pC full scale, 12 bit ADC). ALTRO-based (ALice TPC Read Out). SALTRO: evolution from Alice readout, 16 channel Amplifier-shaper ns peaking time, 25 MHz and 40 MHz sampling, Digital filtering, memory buffering. 24/09/2013TPC electronics3

AFTER integration to fully cover the endplate of LP-TPC ( ) TPC electronics The integration has been carried out so that the new electronics is flat behind the modules, and fits in 25 X° and 5 cm, with comfortable margins. It requires 3 connections only: 1 optical fibre, 1 LV and 1 HV. Remaining refinements are going on (for March 2014): -More robust connections -2P CO2 cooling D. Attié, D. Calvet, P. Colas, E. Delagnes, A. Le Coguie, M. Riallot et al. 24/09/2013

14 cm 25 cm Front-End Card (FEC) 12.5 cm 2.8 cm Integrated electronics  Remove packaging and protection diodes  Wire-bond AFTER chips  Use two 300 -point connectors 0.78 cm 0.74 cm 3.5 cm AFTER Chip The resistive foil protects against sparks 4.5 cm TPC electronics 24/09/2013

Material budget of a module M (g) Radiation Length (g/cm 2 ) Module frame + Back-frame + Radiator (× 6 ) Al Detector + FEC PCB (× 6 ) + FEM Si ‘ 300 -point’ connectors Carbon screws for FEC + Stud screws+ Fe Air cooling brass Plexiglas Average of a module Low material budget requirement for ILD-TPC: ‐Endplates: ~ 25 % X 0 (X 0 : radiation length in cm) TPC electronics Front-End Card (FEC) Pads PCB + Micromegas Front-End Mezzanine (FEM) Cooling system ‘ 300 -point’ connectors 24/09/2013

S-ALTRO 16 Developments Chip and carrier board Test Socket and Test Socket Board MCM board (multichip module) and its prototype The CPLD chip Ancillaries: LV board,… DAQ with SRU (Scalable readout unit from RD51) V. Hedberg, L. Jönsson, B. Lundberg, U. Mjörnmark, A. Oskarsson, L. Österman 24/09/2013TPC electronics7

24/09/2013TPC electronics8

MCMs on a pad board 24/09/2013TPC electronics9

Carrier board Arrived in Lund on 19/9/2013 Fully cabled and ready for testing end October For the final electronics, dies could be either wire bonded to the MCM or mounted by chip-flip tech. 24/09/2013TPC electronics10

24/09/2013TPC electronics11

The Low Voltage board 24/09/2013TPC electronics12

Future electronics GdSP (Paul Aspell et al.), joint R&D with other applications. Common Front End : part of a multi-user wafer to test several options, within AIDA. 24/09/2013TPC electronics13

Developments in progress S-ALTRO IBM 130nm 128 ch 32 ch SAMPA TSMC 130nm ALICE TPC ALICE muons Continuous readout No power pulsing GdSP IBM 130nm VFAT3 CMS SP1 CMS Fondary Q Use Q SP LCTPC ALICE GdSP Design 2016 Fondary 2024 Use /09/2013TPC electronics14

24/09/2013TPC electronics15

The CFE project (Paul Aspell et al.) …but ALICE electronics will be made in Brazil… Fabrice Guilloux 24/09/2013TPC electronics16

Future electronics Need to refine the specifications: packing (number of channels per unit surface), number of bits for the ADC, frequency, noise, shaping time, etc… Simulation required to justify the specifications Need to have in LC-TPC a team including specialists to monitor the electronics R&D Define the technology (130 nm? 95 nm?...) at the time of final design and vendor selection. Detailed design depends on the technology and is prone to become obsolete if choices are done too early. The feasability of the project is demonstrated (though 1mm pads are still challenging). 24/09/2013TPC electronics17