Hybrid Pixel R&D After BTeV As of two years ago: –FNAL-designed readout chip had two minor fatal flaws. –No system demonstration had yet been done. An “extended closeout” R&D program was approved –1 more readout chip submission. –Pixel R&D refocused on ILC. –Two system tests approved: Telescope for the forward direction of PHENIX (at RHIC) Test beam telescope –Both efforts in collaboration with LANL & Columbia U.

Sensor & FPIX2.1 wafers Sensor wafers produced for PHENIX by CiS (LANL has agreed to donate the x4 sensors for use in MTest) FPIX2.1 fabricated on wafer with “TripT” for D0; fatal flaws fixed; 11 wafers purchased by LANL for PHENIX, 11 by FNAL to support R&D - 2 required for MTest telescope.

Sensors & ROCs probed – yield is high Typical FPIX2.1 wafer map Typical sensor IV curve

Hybridization – solder bump bonding done by VTT (Finland) X-ray made at FCC VTT bump-deposition process flow Production orders placed ~10/15/07 Delivery of hybrids is the schedule driver.

Half-plane = three 1x4 modules Station = two half-planes offset by active area of sensor read out by 1 FPGA 2 stations upstream of DUT & 2-4 downstream (precision x & precision y) Test beam telescope

MT6-1A Assets Climate controlled hut. Aluminum table on rails allows entire setup to be removed from beam. Dark box with feed throughs for signals, power, & cooling fluid. Remotely controlled motors determine (x,y) position of both ends of box. Local chiller provides closed loop cooling system CAEN power system can provide LV & sensor bias (“HV”). Plenty of quiet power is available.

Schedule Goal = installation in February 2008 (depends on delivery of bump bonded hybrids). First user = LHCb. Hybrid pixel telescope will measure every beam particle with good timing and moderate precision (5-10  m). Anticipate the addition of one station with very high precision (& probably much less good time resolution), such as MAPS.