Importance of Materials Processing  All electronic devices & systems are made of materials in various combinations  Raw materials are far from the final electronic products  Semiconductor materials (e.g., Si, Ge, GaAs, GaN...) used for devices must be of extremely high purity and crystalline order

Real Materials and their Processing  Particles, lines and rigid bodies vs. real materials  Material-specific properties determine the function and processing details of a material  Comprehensive knowledge of materials processing requires ~ 5-10 years of learning and practice  Advantage and role of physics students

Different Types of Electronic Devices Discrete devices: diodes, transistors, rectifiers, sensors, … Integrated circuits (IC): CPU, DRAM, ASIC, … Opto-electronics: LED, semiconductor laser (in CD/VCD players, optical communication), display, lighting, … Solar cells: on satellites, calculators, large-scale power generation Data storage: DRAM, hard disk, ZIP, flush memory, CD-ROM,... Electro-mechanic devices: electro-magnetic, piezo-electric,...

Different Electronic Materials  Semiconductors: Elemental (Si, Ge) & Compound (GaAs, GaN, ZnS, CdS, …)  Insulators: SiO 2, Al 2 O 3, Si 3 N 4, SiO x N y,...  Conductors: Al, Au, Cu, W, silicides (metal-Si compounds),...  Organic and polymer: liquid crystal, insulator, semiconductor, conductor  Composite materials: multi-layer structures, nano-materials, photonic crystals,...  More: magnetic, superconductor, bio-material, …

Cubic Lattices and Main Crystal Faces X Z Y

Lattice Structures of Semiconductors Ga As Si Silicon, a = 5.43 Å (diamond structure) GaAs, a = 5.65 Å (zincblende structure)

Point Defects impurities

1D & 2D Defects Edge Dislocation

Real Device Structures in IC MOSFET Bipolar transistor Diode n n+n+ p metal contacts

Si(001) wafer Primary flat edge along [110] Secondary flat N-channel MOSFET (Metal-oxide-semiconductor FET) Schematic vs. Real

Fabrication of a Diode wafer cutdiffusion oxidationlithography diffusion (f) metallization

Crystal growth and wafer preparation Diffusion Oxidation LithographyDiffusion Ion implantation Etching Deposition TestingPackaging Processes involved in Semiconductor device and IC manufacture Connection Epitaxy