Phase-1 Design. i PHC Phase 1 2 03/04/2008 System Overview Clock, JTAG, sync marker and power supply connections Digital output.

Slides:



Advertisements
Similar presentations
L. Greiner 1IPHC meeting – September 5-6, 2011 STAR HFT LBNL Leo Greiner, Eric Anderssen, Thorsten Stezelberger, Joe Silber, Xiangming Sun, Michal Szelezniak,
Advertisements

Chapter 5 Internal Memory
Reconfigurable Computing (EN2911X, Fall07) Lecture 04: Programmable Logic Technology (2/3) Prof. Sherief Reda Division of Engineering, Brown University.
B. Hall June 14, 2001Pixel ReadoutPage 1 Goals Look at two word synchronization techniques. Look at signal integrity of LVDS transmission at receiving.
M. Szelezniak1PXL Sensor and RDO review – 06/23/2010 STAR PXL Sensors Overview.
4bit Parallel to Serial Data Stream Converter By Ronne Abat Johnny Liu.
18/05/2015 Calice meeting Prague Status Report on ADC LPC ILC Group.
FPGA-Based System Design: Chapter 3 Copyright  2004 Prentice Hall PTR SRAM-based FPGA n SRAM-based LE –Registers in logic elements –LUT-based logic element.
Terra-Pixel APS for CALICE Progress meeting 10 th Nov 2005 Jamie Crooks, Microelectronics/RAL.
Power Distribution FPGADDR2 OEM Board Flash MEMSSDINSD3 Cameras Connector Board 1.2V1.8V5V3.3V 3.3V, 5V, 12V 15V3.3V9-36V.
Large Area, High Speed Photo-detectors Readout Jean-Francois Genat + On behalf and with the help of Herve Grabas +, Samuel Meehan +, Eric Oberla +, Fukun.
SVT TDR meeting – March 30, 2012 List of peripheral blocks for SVT strip readout chips.
Research and Development for the HFT at STAR Leo Greiner BNL DAC 03/15/2006.
Timepix2 power pulsing and future developments X. Llopart 17 th March 2011.
Power pulsing strategy with Timepix2 X. Llopart 10 th May 2011 Linear Collider Power Distribution and Pulsing workshop Timepix3.
Time Division Multiplexing School of Physics and Astronomy Department of Particle Physics Elissavet Papadima 29/5/2014.
Spring semester (4/2009) High Speed Signal Processing Board Design By: Nir Malka, Lior Rom Instructor: Mike Sumszyk הטכניון - מכון טכנולוגי לישראל הפקולטה.
MEDIPIX3 TESTING STATUS R. Ballabriga and X. Llopart.
Institute of Experimental and Applied Physics Czech Technical University in Prague 11th December 2007 Michal Platkevič RUIN Rapid Universal INterface for.
Mathieu Goffe EUDET JRA1 meeting, DESY Wednesday 30 January 2008 IPHC, 23 rue du Loess BP 28, 67037, Strasbourg Cedex 02, France.
Ultimate Design Review G. Bertolone, C. Colledani, A. Dorokhov, W. Dulinski, G. Dozière, A. Himmi, Ch. Hu-Guo, F. Morel, H. Pham, I. Valin, J. Wang, G.
Leo Greiner IPHC testing Sensor and infrastructure testing at LBL. Capabilities and Plan.
Phase-1 Padring. i PHC Phase 1 Padring 2 03/04/2008 Padring Overview µm Several Blocs :  JTAG pads  Digital Control.
DEPFET Electronics Ivan Peric, Mannheim University.
Testing of integrated circuits and design for testability J. Christiansen CERN - EP/MIC
Leo Greiner IPHC meeting HFT PIXEL DAQ Prototype Testing.
Institute for Nuclear Physics, University of Frankfurt 1 A concept for the MVD-DAQ C.Schrader, S. Amar-Youcef, N. Bialas, M. Deveaux, I.Fröhlich, J. Michel,
Leo Greiner IPHC DAQ Readout for the PIXEL detector for the Heavy Flavor Tracker upgrade at STAR.
Development of an ASIC for reading out CCDS at the vertex detector of the International Linear Collider Presenter: Peter Murray ASIC Design Group Science.
ULTIMATE: Preliminary Test Results IPHC-LBNL Phone Conference Outline  Ultimate test status  Analogue outputs (tested by Mathieu)  Pixel array + Discriminators.
CEA DSM Irfu 20 th october 2008 EuDet Annual Meeting Marie GELIN on behalf of IRFU – Saclay and IPHC - Strasbourg Zero Suppressed Digital Chip sensor for.
Recent developments on Monolithic Active Pixel Sensors (MAPS) for charged particle tracking. Outline The MAPS sensor (reminder) MIMOSA-22, a fast MAPS-sensor.
Leo Greiner PIXEL Hardware meeting HFT PIXEL detector LVDS Data Path Testing.
Xiangming Sun1PXL Sensor and RDO review – 06/23/2010 STAR XIANGMING SUN LAWRENCE BERKELEY NATIONAL LAB Firmware and Software Architecture for PIXEL L.
J. Crooks STFC Rutherford Appleton Laboratory
PSI - 11 Feb The Trigger System of the MEG Experiment Marco Grassi INFN - Pisa On behalf of D. Nicolò F. Morsani S. Galeotti.
INTRODUCTION TO PIC MICROCONTROLLER. Overview and Features The term PIC stands for Peripheral Interface Controller. Microchip Technology, USA. Basically.
ClicPix ideas and a first specification draft P. Valerio.
Thanushan Kugathasan, CERN Plans on ALPIDE development 02/12/2014, CERN.
BTeV Hybrid Pixels David Christian Fermilab July 10, 2006.
Sensor testing and validation plans for Phase-1 and Ultimate IPHC_HFT 06/15/ LG1.
CERN, 18 december 2003Coincidence Matrix ASIC PRR Coincidence ASIC modifications E.Petrolo, R.Vari, S.Veneziano INFN-Rome.
BTeV in PHENIX: Pixel Readout Chip Basics David Christian Fermilab December 5, 2005.
Improvement of ULTIMATE IPHC-LBNL September 2011 meeting, Strasbourg Outline  Summary of Ultimate test status  Improvement weak points in design.
09/02/20121 Delay Chip Prototype & Delay Chip Test Board Joan Mauricio – Xavier Ondoño La Salle (URL) 12/04/2013.
Low Power, High-Throughput AD Converters
Pixel detector development: sensor
High Speed Digital Systems Lab Spring/Winter 2010 Project definition Instructor: Rolf Hilgendorf Students: Elad Mor, Ilya Zavolsky Integration of an A/D.
Low Power, High-Throughput AD Converters
MIMO  3 Preliminary Test Results. MIMOSTAR 2 16/05/2007 MimoStar3 Status Evaluation of MimoStar2 chip  Test in Laboratory.
QIE10 development Nov. 7, 2011: The first full-chip prototype was submitted to MOSIS. Output is 2-bit exponent (four ranges) and 6-bit mantissa (non-linear.
.1PXL READOUT STAR PXL READOUT requirement and one solution Xiangming Sun.
M. TWEPP071 MAPS read-out electronics for Vertex Detectors (ILC) A low power and low signal 4 bit 50 MS/s double sampling pipelined ADC M.
ASIC Development for Vertex Detector ’07 6/14 Y. Takubo (Tohoku university)
NOISE MEASUREMENTS ON CLICPIX AND FUTURE DEVELOPMENTS Pierpaolo Valerio.
NEWS FROM MEDIPIX3 MEASUREMENTS AND IMPACT ON TIMEPIX2 X. Llopart CERN.
H. Krüger, , DEPFET Workshop, Heidelberg1 System and DHP Development Module overview Data rates DHP function blocks Module layout Ideas & open questions.
Fast Full Scale Sensors Development IPHC - IRFU collaboration MIMOSA-26, EUDET beam telescope Ultimate, STAR PIXEL detector Journées VLSI 2010 Isabelle.
Low Power, High-Throughput AD Converters
BUILDING BLOCKS designed at IPHC in TOWER JAZZ CMOS Image Sensor 0.18 µm process Isabelle Valin on behalf of IPHC-PICSEL group.
Data Handling Processor v0.1 Preliminary Test Results - August 2010 Tomasz Hemperek.
GGT-Electronics System design Alexander Kluge CERN-PH/ED April 3, 2006.
MADEIRA Valencia report V. Stankova, C. Lacasta, V. Linhart Ljubljana meeting February 2009.
OMEGA3 & COOP The New Pixel Detector of WA97
LHC1 & COOP September 1995 Report
Topics SRAM-based FPGA fabrics: Xilinx. Altera..
Data Handling Processor v0.1 First Test Results
Hans Krüger, University of Bonn
The Xilinx Virtex Series FPGA
The Xilinx Virtex Series FPGA
Presentation transcript:

Phase-1 Design

i PHC Phase /04/2008 System Overview Clock, JTAG, sync marker and power supply connections Digital output only 4 data outputs per chip at 160 MHz 40 LVDS pairs to drive 1 m cable connection Low-mass system 10 chips per ladder Directly bonded on n-layers flex capton LVDS drivers on chip

i PHC Phase /04/2008 Preliminary specifications Process 0.35 µm (AMS c35b4/opto) (3.3 V ± 0.3 V) Matrix of 640 x 640 pixels with 30 µm pitch Raw digital output without zero suppression JTAG control for configuration and testing Internal bias DACs 2 levels of multiplexer:  Low speed (40 MHz for test) and High speed (160 MHz) Bonding pad location at the bottom edge  Analog test pads (~ 100µm x 100µm) on the top edge Area estimation 19.5 mm x 21.0 mm

i PHC Phase /04/2008 Chip floor-plan Ex. F RDO = 160 MHz  Discriminator frequency = 1 MHz  In pixel frequency = 16 MHz  Integration time = 640 µs Integration time = 160 / F RDO x µm µm

i PHC Phase /04/2008 Mimosa22 background Best suitable pixel to be chosen from M22 test Digital control logic  Pixel scan => resized to 640 rows  Pattern generator => OK JTAG interface => markers for synchronizations Output multiplexer with fast/slow outputs  not present in M22 -- NEW DESIGN Improved Testability for digital and analog blocks  2 registers for test patterns at the discriminator level  characterization of pixel matrix Reuse the experience and building blocks of M22

i PHC Phase /04/2008 Critical points and chip testability High speed MHz Synchronization among the chips in the ladder  Internal generation of markers + frame counter  How to recovery if chips are out of sync (adding more pins) LVDS pads drive 1m of flex cable Power consumption  Static: ~ 400 mW  Dynamic: ~60mW (serializ.); 110 mW (6 x LVDS TX); 8 mW (LVDS RX); Testability based on M22:  Digital: + additional synchronization markers  Analog information from groups of 8 columns of pixels

i PHC Phase /04/2008 Phase-1: I/O ~ 50 signals (7 LVDS pads included) Standard CMOS pads for low speed outputs ~ 50 power supply lines Two bonding per I/O to facilitate probe testing Analog outputs (8 pads) on top edge for testing purpose More detailed list later…

i PHC Phase /04/ Discriminators Pixel array 640x640 Shift Register (80 bits) Analog Multiplexer 1  80 (8  640) 8 Analog Outputs In normal mode the shift register is disabled. The first 8 columns are read continuously. In scan mode the shift register is enabled: groups of 8 columns are read after the read of 640 lines. Analog Test for Pixel Matrix

i PHC Phase /04/2008 Serializer Mux 160:1 4 intermediate outputs at low-speed for test Scrambled data at the fast output Latency  25.0 ns for low speed output  6.25 ns for high speed output