Department of Electrical Engineering Arizona State University

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Presentation transcript:

Department of Electrical Engineering Arizona State University PN Junctions Theory Dragica Vasileska Department of Electrical Engineering Arizona State University PN-Junctions: Introduction to some general concepts Current-Voltage Characteristics of an Ideal PN-junction (Shockley model) Non-Idealities in PN-Junctions AC Analysis and Diode Switching

Linearly-graded junction 1. PN-junctions - General Consideration: PN-junction is a two terminal device. Based on the doping profile, PN-junctions can be separated into two major categories: - step junctions - linearly-graded junctions p-side n-side p-side n-side Step junction Linearly-graded junction

(A) Equilibrium analysis of step junctions (a) Built-in voltage Vbi: (b) Majority- minority carrier relationship: -qNA qND + - p-side n-side

(c) Depletion region width:  Solve 1D Poisson equation using depletion charge approximation, subject to the following boundary condi- tions: p-side: n-side:  Use the continuity of the two solutions at x=0, and charge neutrality, to obtain the expression for the depletion region width W:

(d) Maximum electric field: The maximum electric field, which occurs at the metallurgical junction, is given by: (e) Carrier concentration variation:

(f) Depletion layer capacitance:  Consider a p+n, or one-sided junction, for which:  The depletion layer capacitance is calculated using: Measurement setup: W dW ~ V Reverse bias Forward bias vac

(B) Equilibrium analysis of linearly-graded junction: (a) Depletion layer width: (c) Maximum electric field: (d) Depletion layer capacitance: Based on accurate numerical simulations, the depletion layer capacitance can be more accurately calculated if Vbi is replaced by the gradient voltage Vg:

(2) Ideal Current-Voltage Characteristics: Assumptions: Abrupt depletion layer approximation Low-level injection  injected minority carrier density much smaller than the majority carrier density No generation-recombination within the space-charge region (SCR) (a) Depletion layer:

(b) Quasi-neutral regions: Using minority carrier continuity equations, one arrives at the following expressions for the excess hole and electron densities in the quasi-neutral regions: Forward bias Reverse bias Space-charge region W

No SCR generation/recombination Corresponding minority-carriers diffusion current densities are: No SCR generation/recombination Shockley model

(c) Total current density: Total current equals the sum of the minority carrier diffu-sion currents defined at the edges of the SCR: Reverse saturation current IS: I V Ge Si GaAs

(d) Origin of the current flow: Forward bias: Reverse bias: Ln Lp Reverse saturation current is due to minority carriers being collected over a distance on the order of the diffusion length.

(e) Majority carriers current: Consider a forward-biased diode under low-level injection conditions: Total hole current in the quasi-neutral regions: Quasi-neutrality requires: This leads to:

Electron drift current in the quasi-neutral region:

(f) Limitations of the Shockley model: The simplified Shockley model accurately describes IV-characteristics of Ge diodes at low current densities. For Si and Ge diodes, one needs to take into account several important non-ideal effects, such as:  Generation and recombination of carriers within the depletion region.  Series resistance effects due to voltage drop in the quasi-neutral regions.  Junction breakdown at large reverse biases due to tun-neling and impact ionization effects.

3. Non-Idealities in PN-junctions: (A) Generation and Recombination Currents  Continuity equation for holes:  Steady-state and no light genera- tion process: Space-charge region recombination current:

Reverse-bias conditions: Concentrations n and p are negligible in the depletion region: Space-charge region current is actually generation current: Total reverse-saturation current: Generation lifetime

Generation current dominates when ni is small, which is always the case for Si and GaAs diodes. I (log-scale) W V (log-scale) IV-characteristics under reverse bias conditions Generated carriers are swept away from the depletion region.

Recombination lifetime Forward-bias conditions: Concentrations n and p are large in the depletion region: Condition for maximum recombination rate: Estimate of the recombination current: Recombination lifetime

Exact expression for the recombination current: Corrections to the model: Total forward current:   ideality factor. Deviations of  from unity represent an important measure for the recombination current.

Importance of recombination effects: Low voltages, small ni  recombination current dominates Large voltages  diffusion current dominates log(I) V

(B) Breakdown Mechanisms Junction breakdown can be due to:  tunneling breakdown  avalanche breakdown One can determine which mechanism is responsible for the breakdown based on the value of the breakdown voltage VBD :  VBD < 4Eg/q  tunneling breakdown  VBD > 6Eg/q  avalanche breakdown  4Eg/q < VBD < 6Eg/q  both tunneling and avalanche mechanisms are responsible

Tunneling breakdown: Tunneling breakdown occurs in heavily-doped pn-junctions in which the depletion region width W is about 10 nm. Zero-bias band diagram: Forward-bias band diagram: EFn EF EFp EC EC EV EV W W

Reverse-bias band diagram: Tunneling current (obtained by using WKB approximation): Fcr  average electric field in the junction The critical voltage for tunneling breakdown, VBR, is estimated from: With T, Eg and It . EFp EFn EC EV

Avalanche breakdown: Most important mechanism in junction breakdown, i.e. it imposes an upper limit on the reverse bias for most diodes. Impact ionization is characterized by ionization rates an and ap, defined as probabilities for impact ionization per unit length, i.e. how many electron-hole pairs have been generated per particle per unit length: - Ei  critical energy for impact ionization to occur - Fcr  critical electric field - l  mean-free path for carriers

Generation of the excess electron-hole Avalanche mechanism: EFp EFn EC EV Generation of the excess electron-hole pairs is due to impact ionization. Expanded view of the depletion region

Description of the avalanche process: dx Impact ionization initiated by electrons. Multiplication factors for electrons and holes: dx Impact ionization initiated by holes.

The breakdown condition does not depend on which Breakdown voltage  voltage for which the multiplication rates Mn and Mp become infinite. For this purpose, one needs to express Mn and Mp in terms of an and ap: The breakdown condition does not depend on which type of carrier initiated the process.

Limiting cases: (a) an=ap (semiconductor with equal ionization rates): (b) an>>ap (impact ionization dominated by one carrier):

Breakdown voltages: (a) Step p+n-junction For one sided junction we can make the following approximation: Voltage drop across the depletion region on the n-side: Maximum electric field: Empirical expression for the breakdown voltage VBD:

(b) Step p+-n-n+ junction Extension of the n-layer large: Extension of the n-layer small: Final expression for the punch-through voltage VP:

(4) AC-Analysis and Diode Switching (a) Diffusion capacitance and small-signal equivalent circuit This is capacitance related to the change of the minority carriers. It is important (even becomes dominant) under forward bias conditions. The diffusion capacitance is obtained from the device impedance, and using the continuity equation for minority carriers: Applied voltages, currents and solution for Dpn:

Equation for pn1(x): Boundary conditions: Final expression for pn1(x):

Small-signal hole current: Low-frequency limit for the admittance Y: RC-constant: The characteristic time constant is on the order of the minority carriers lifetime.

Equivalent circuit model for forward bias: Bias dependence:

Qp(t) = excess hole charge (b) Diode switching For switching applications, the transition from forward bias to reverse bias must be nearly abrupt and the transit time short. Diode turn-on and turn-off characteristics can be obtained from the solution of the continuity equations: Qp(t) = excess hole charge Valid for p+n diode

Final expression for the excess hole charge: Diode turn-on: For t<0, the switch is open, and the excess hole charge is: At t=0, the switch closes, and we have the following boundary condition: p+ n t=0 IF Final expression for the excess hole charge:

Graphical representation: Steady state value for the bias across the diode: t increasing Slope almost constant

The current through the diode until time t1 is: Diode turn-off: For t<0, the switch is in position 1, and a steady-state situation is established: At t=0, the switch is moved to position 2, and up until time t=t1 we have: The current through the diode until time t1 is: p+ n t=0 VF R VR 1 2

To solve exactly this problem and find diode switching time, is a rather difficult task. To simplify the problem, we make the crucial assumption that IR remains constant even beyond t1. The differential equation to be solved and the initial condition are, thus, of the form: This gives the following final solution: Diode switching time:

Graphical representation: Slope almost constant t=0 t=ts ttrr ts  switching time trr  reverse recovery time