doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 1 Project: IEEE P Working Group for Wireless Personal Area Networks (WPANs) Submission Title: [Multi-band OFDM Physical Layer Proposal] Date Submitted: [17 September, 2003] Source: [Presenter: Anuj Batra] Company [Texas Instruments] [see page 2,3 for the complete list of company names and authors] Address [12500 TI Blvd, MS 8649, Dallas, TX 75243] Voice:[ ], FAX: [ ], Re: [This submission is in response to the IEEE P Alternate PHY Call for Proposal (doc. 02/372r8) that was issued on January 17, 2003.] Abstract:[This document describes the Multi-band OFDM proposal for IEEE TG3a.] Purpose:[For discussion by IEEE TG3a.] Notice:This document has been prepared to assist the IEEE P It is offered as a basis for discussion and is not binding on the contributing individual(s) or organization(s). The material in this document is subject to change in form and content after further study. The contributor(s) reserve(s) the right to add, amend or withdraw material contained herein. Release:The contributor acknowledges and accepts that this contribution becomes the property of IEEE and may be made publicly available by P

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 2 This contribution is a technical merger between*: Texas Instrument [03/141]: Batra \ and femto Devices [03/101]: Cheah FOCUS Enhancements [03/103]: Boehlke General Atomics [03/105]: Ellis Institute for Infocomm Research [03/107]: Chin Intel [03/109]: Brabenac Mitsubishi Electric [03/111]: Molisch Panasonic [03/121]: Mo Philips [03/125]: Kerry Samsung Advanced Institute of Technology [03/135]: Kwon Samsung Electronics [03/133]: Park SONY [03/137]: Fujita Staccato Communications [03/099]: Aiello STMicroelectronics [03/139]: Roberts Time Domain [03/143]: Kelly University of Minnesota [03/147]: Tewfik Wisair [03/151]: Shor * For a complete list of authors, please see page 3.

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 3 Authors femto Devices: J. Cheah FOCUS Enhancements: K. Boehlke General Atomics: J. Ellis, N. Askar, S. Lin, D. Furuno, D. Peters, G. Rogerson, M. Walker Institute for Infocomm Research: F. Chin, Madhukumar, X. Peng, Sivanand Intel: J. Foerster, V. Somayazulu, S. Roy, E. Green, K. Tinsley, C. Brabenac, D. Leeper, M. Ho Mitsubishi Electric: A. F. Molisch, Y.-P. Nakache, P. Orlik, J. Zhang Panasonic: S. Mo Philips: C. Razzell, D. Birru, B. Redman-White, S. Kerry Samsung Advanced Institute of Technology: D. H. Kwon, Y. S. Kim Samsung Electronics: M. Park SONY: E. Fujita, K. Watanabe, K. Tanaka, M. Suzuki, S. Saito, J. Iwasaki, B. Huang Staccato Communications: R. Aiello, T. Larsson, D. Meacham, L. Mucke, N. Kumar STMicroelectronics: D. Hélal, P. Rouzet, R. Cattenoz, C. Cattaneo, L. Rouault, N. Rinaldi,, L. Blazevic, C. Devaucelle, L. Smaïni, S. Chaillou Texas Instruments: A. Batra, J. Balakrishnan, A. Dabak, R. Gharpurey, J. Lin, P. Fontaine, J.-M. Ho, S. Lee, M. Frechette, S. March, H. Yamaguchi Time Domain: J. Kelly, M. Pendergrass University of Minnesota: A. H. Tewfik, E. Saberinia Wisair: G. Shor, Y. Knobel, D. Yaish, S. Goldenberg, A. Krause, E. Wineberger, R. Zack, B. Blumer, Z. Rubin, D. Meshulam, A. Freund

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 4 In addition, the following individuals/companies support this proposal: Fujitsu Microelectronics America, Inc: A. Agrawal Hewlett Packard: M. Fidler Infineon: Y. Rashi NEC Electronics: T. Saito SVC Wireless: A. Yang TDK: P. Carson TRDA: M. Tanahashi UWB Wireless: R. Caiming Qui Wisme: N. Y. Lee Microsoft: A. Hassan Jaalaa: A. Anandakumar Tzero: O. Unsal

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 5 Overview of OFDM  OFDM was invented more than 40 years ago.  OFDM has been adopted for several technologies:  Asymmetric Digital Subscriber Line (ADSL) services.  IEEE a/g.  IEEE a.  Digital Audio Broadcast (DAB).  Digital Terrestrial Television Broadcast: DVD in Europe, ISDB in Japan  OFDM is also being considered for 4G, IEEE n, IEEE , and IEEE

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 6 Strengths of OFDM  OFDM is spectrally efficient.  IFFT/FFT operation ensures that sub-carriers do not interfere with each other.  OFDM has an inherent robustness against narrowband interference.  Narrowband interference will affect at most a couple of tones.  Information from the affected tones can be erased and recovered via the forward error correction (FEC) codes.  OFDM has excellent robustness in multi-path environments.  Cyclic prefix preserves orthogonality between sub-carriers.  Cyclic prefix allows the receiver to capture multi-path energy more efficiently.

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 7 Details of the Multi-band OFDM System *More details about the Multi-band OFDM system can be found in the latest version of 03/268.

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 8 Overview of Multi-band OFDM  Basic idea: divide spectrum into several 528 MHz bands.  Information is transmitted using OFDM modulation on each band.  OFDM carriers are efficiently generated using an 128-point IFFT/FFT.  Internal precision is reduced by limiting the constellation size to QPSK.  Information bits are interleaved across all bands to exploit frequency diversity and provide robustness against multi-path and interference.  60.6 ns prefix provides robustness against multi-path even in the worst channel environments.  9.5 ns guard interval provides sufficient time for switching between bands.

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 9 Multi-band OFDM: TX Architecture  Block diagram of an example TX architecture:  Architecture is similar to that of a conventional and proven OFDM system. Can leverage existing OFDM solutions for the development of the Multi-band OFDM physical layer.

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 10 Multi-band OFDM System Parameters  System parameters for mandatory and optional data rates: Info. Data Rate55 Mbps*80 Mbps**110 Mbps*160 Mbps**200 Mbps*320 Mbps**480 Mbps** Modulation/ConstellationOFDM/QPSK FFT Size128 Coding Rate (K=7)R = 11/32R = 1/2R = 11/32R = 1/2R = 5/8R = 1/2R = 3/4 Frequency-domain SpreadingYes No Time-domain SpreadingYes No Data Tones100 Zero-padded Prefix60.6 ns Guard Interval9.5 ns Symbol Length312.5 ns Channel Bit Rate640 Mbps Multi-path Tolerance60.6 ns * Mandatory information data rate, ** Optional information data rate

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 11 Frequency-Domain and Time-Domain Spreading  Frequency-domain spreading:  Spreading is achieved by choosing conjugate symmetric inputs for the input to the IFFT.  Exploits frequency diversity and helps reduce the transmitter complexity/power consumption.  Time-domain spreading:  Spreading is achieved in the time-domain by repeating the same information in an OFDM symbol on two different sub-bands.  Exploits frequency diversity as well as enhances SOP performance.

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 12 Simplified TX Analog Section  For rates up to 80 Mb/s, the input to the IFFT is forced to be conjugate symmetric (for spreading gains  2).  Output of the IFFT is REAL.  The analog section of TX can be simplified when the input is real:  Need to only implement the “I” portion of DAC and mixer.  Only requires half the analog die size of a complete “I/Q” transmitter.  For rates > 80 Mb/s, need to implement full “I/Q” transmitter.

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 13 More Details on the OFDM Parameters  128 total tones:  100 data tones used to transmit information (constellation: QPSK)  12 pilots tones used for carrier and phase tracking  10 guard tones (used to be known as dummy tones)  6 NULL tones  Exact use of guard tones is left to implementer – adds a level of flexibility in the standard.  Advantages of using guard tones:  Can relax the analog transmit and receive filters.  Helps to relax filter specifications for adjacent channel rejection.  Can be used to help reduce peak-to-average power ratio (PARP).  Could be used to transmit proprietary information (data/signaling).  If data is mapped onto the guard tones, then this scheme is analogous to the concept of Excess Bandwidth as used in Single-carrier Systems.  Received signal in guard tones can be combined appropriately with the remaining information data tones to improve performance.

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 14 Zero-padded Prefix (1)  Ripple in the transmitted spectrum can be eliminated by using a zero- padded prefix.  Using a zero-padded (ZP) prefix instead of a cyclic prefix is a well- known and well-analyzed technique.  Almost no ripple in PSD.

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 15 Zero-Padded Prefix (2)  A Zero-Padded Multi-band OFDM has the same multi-path robustness as a system that uses a cyclic prefix (60.6 ns of protection).  The receiver architecture for a zero-padded multi-band OFDM system requires ONLY a minor modification (less than < 200 gates).  Added flexibility to implementer: multi-path robustness can be dynamically controlled at the receiver, from 1.9 ns up to 60.6 ns.

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 16 Band Plan (1)  Group the 528 MHz bands into 4 distinct groups.  Group A: Intended for 1 st generation devices (3.1 – 4.9 GHz).  Group B: Reserved for future use (4.9 – 6.0 GHz).  Group C: Intended for devices with improved SOP performance (6.0 – 8.1 GHz).  Group D: Reserved for future use (8.1 – 10.6 GHz).

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 17 Band Plan (2)  The relationship between the center frequency f c and the band number n b is: BAND_ID (n b )Lower Frequency (f l ) Center Frequency (f c ) Higher Frequency (f h ) BAND_ID (n b )Lower Frequency (f l ) Center Frequency (f c ) Higher Frequency (f h ) MHz3432 MHz3696 MHz87128 MHz7392 MHz7656 MHz MHz3960 MHz4224 MHz97656 MHz7920 MHz8184 MHz MHz4488 MHz4752 MHz MHz8448 MHz8712 MHz MHz5016 MHz5280 MHz MHz8976 MHz9240 MHz MHz5808 MHz6072 MHz MHz9504 MHz9768 MHz MHz6336 MHz6600 MHz MHz10032 MHz10296 MHz MHz6864 MHz7128 MHz

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 18 Multi-mode Multi-band OFDM Devices (1)  Having multiple groups of bands enables multiple modes of operations for multi-band OFDM devices.  Different modes for multi-band OFDM devices are:  Future expansion into groups B and D will enable an increase in the number of modes. ModeFrequency of OperationNumber of BandsMandatory / Optional 1Bands 1–3 (A)3Mandatory 2Bands 1–3, 6–9 (A,C)7Optional

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 19 Multi-mode Multi-band OFDM Devices (2)  Frequency of operation for a Mode 1 device:  Frequency of operation for a Mode 2 device:

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 20 Frequency Synthesis (1)  Example: frequency synthesis for Mode 1 (3-band) device:  A single PLL can also be used to generate the center frequencies for a Mode 2 (7-band) device.

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 21 Frequency Synthesis (2)  Circuit-level simulation of frequency synthesis:  Nominal switching time = ~2 ns.  Need to use a slightly larger switching time to allow for process and temperature variations.

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 22 Multi-band OFDM: PLCP Frame Format  PLCP frame format:  Rates supported: 55, 80, 110, 160, 200, 320, 480 Mb/s.  Support for 55, 110, and 200 Mb/s is mandatory.  Mode 1 (3-band):  Preamble + Header =  s.  Burst preamble + Header =  s.  Mode 2 (7-band):  Preamble + Header + Band Extension =  s.  Burst preamble + Header + Band Extension =  s.  Header is sent at an information data rate of 55 Mb/s using Mode 1.  Maximum frame payload supported is 4095 bytes.

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 23 More Details on the PHY Header  PHY Header:  Band Extension (3 bit field):  Indicates the mode of transmission for the payload (Mode 1 or Mode 2).  Rate (4 bit field):  Indicates the rate of transmission for the payload.  Rate field also specifies the coding rate, puncturing pattern, and spreading technique.  Length (12 bit field):  Indicates the number of bytes in the payload (excludes the FEC).  Scrambler (2 bit field):  Conveys information about the scrambler state.

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 24 Multiple Access  Multiple piconet performance is governed by the bandwidth expansion factor.  Bandwidth expansion can be achieved using any of the following techniques or combination of techniques:  Spreading, Time-frequency interleaving, Coding  Ex: Multi-band OFDM obtains its BW expansion by using all 3 techniques.  Time Frequency Codes: Channel Number Preamble Pattern Mode 1 DEV: 3-band Length 6 TFC Mode 1 DEV: 7-band Length 7 TFC

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 25 PLCP Preamble (1)  Multi-band OFDM preamble is composed of 3 sections:  Packet sync sequence: used for packet detection.  Frame sync sequence: used for boundary detection.  Channel estimation sequence: used for channel estimation.  Packet and frame sync sequences are constructed from the same hierarchical sequence.  Correlators for hierarchical sequences can be implemented efficiently:  Low gate count.  Extremely low power consumption.  Preamble sequences are designed to be extremely robust.

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 26 PLCP Preamble (2)  In the multiple overlapping piconet case, it is desirable to use different hierarchical preambles for each of the piconets.  Basic idea: define 4 hierarchical preambles, with low cross-correlation values.  Preambles are generated by spreading a length 16 sequence by a length 8 sequence. Preamble PatternSequence A Preamble PatternSequence B

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 27 Link Budget and Receiver Sensitivity  Assumption: Mode 1 DEV (3-band), AWGN, and 0 dBi gain at TX/RX antennas. ParameterValue Information Data Rate110 Mb/s200 Mb/s480 Mb/s Average TX Power-10.3 dBm Total Path Loss64.2 dB 10 meters) 56.2 dB 4 meters) 50.2 dB 2 meters) Average RX Power-74.5 dBm-66.5 dBm-60.5 dBm Noise Power Per Bit-93.6 dBm-91.0 dBm-87.2 dBm CMOS RX Noise Figure6.6 dB Total Noise Power-87.0 dBm-84.4 dBm-80.6 dBm Required Eb/N04.0 dB4.7 dB4.9 dB Implementation Loss2.5 dB 3.0 dB Link Margin6.0 dB10.7 dB12.2 dB RX Sensitivity Level-80.5 dBm-77.2 dBm-72.7 dB

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 28 Link Budget and Receiver Sensitivity  Assumption: Mode 2 DEV (7-band), AWGN, and 0 dBi gain at TX/RX antennas. ParameterValue Information Data Rate110 Mb/s200 Mb/s480 Mb/s Average TX Power-6.6 dBm Total Path Loss66.6 dB 10 meters) 58.6 dB 4 meters) 52.6 dB 2 meters) Average RX Power-73.2 dBm-65.2 dBm-59.2 dBm Noise Power Per Bit-93.6 dBm-91.0 dBm-87.2 dBm CMOS RX Noise Figure8.6 dB Total Noise Power-85.0 dBm-82.4 dBm-78.6 dBm Required Eb/N04.0 dB4.7 dB4.9 dB Implementation Loss2.5 dB 3.0 dB Link Margin5.3 dB10.0 dB11.5 dB RX Sensitivity Level-78.5 dBm-75.2 dBm-70.7 dB

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 29 System Performance (Mode 1: 3-band )  The distance at which the Multi-band OFDM system can achieve a PER of 8% for a 90% link success probability is tabulated below: * Includes losses due to front-end filtering, clipping at the DAC, ADC degradation, multi-path degradation, channel estimation, carrier tracking, packet acquisition, etc. Range * AWGNCM1CM2CM3CM4 110 Mbps20.5 m11.4 m10.7 m11.5 m10.9 m 200 Mbps14.1 m6.9 m6.3 m6.8 m4.7 m 480 Mbps7.8 m2.9 m2.6 mN/A

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 30 System Performance (Mode 2: 7-band )  The distance at which the Multi-band OFDM system can achieve a PER of 8% for a 90% link success probability is tabulated below: * Includes losses due to front-end filtering, clipping at the DAC, ADC degradation, multi-path degradation, channel estimation, carrier tracking, packet acquisition, etc. Range * AWGNCM1CM2CM3CM4 110 Mbps18.9 m10.0 m9.0 m9.9 m9.7 m 200 Mbps13.0 m6.4 m5.7 m6.4 m4.2 m 480 Mbps7.2 m2.4 m2.2 mN/A

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 31 Simultaneously Operating Piconets (1)  Assumptions:  Mode 1 DEV (3-band) operating at a data rate of 110 Mbps.  Simultaneously operating piconet performance as a function of the multipath channel environments:  Results incorporate SIR and erasure estimation at the receiver. Channel Environment1 piconet*2 piconets**3 piconets** CM1 (d int /d ref ) CM2 (d int /d ref ) CM3 (d int /d ref ) CM4 (d int /d ref ) * Acquisition limited. ** Numbers based on July results. Currently running simulations to obtain updated numbers.

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 32 Simultaneously Operating Piconets (2)  Assumptions:  Mode 2 DEV (7-band) operating at a data rate of 110 Mbps.  Simultaneously operating piconet performance as a function of the multipath channel environments:  Results incorporate SIR estimation at the receiver. Channel Environment1 piconet*2 piconets**3 piconets** CM1 (d int /d ref ) CM2 (d int /d ref ) CM3 (d int /d ref ) CM4 (d int /d ref ) * Acquisition limited. ** Numbers based on July results. Currently running simulations to obtain updated numbers.

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 33 Simultaneously Operating Piconets (3)  Assumptions:  Mode 2 DEV (7-band) operating at a data rate of 200 Mbps.  Simultaneously operating piconet performance as a function of the multipath channel environments:  Results incorporate SIR estimation at the receiver. Channel Environment1 piconet*2 piconets**3 piconets** CM1 (d int /d ref ) CM2 (d int /d ref ) CM3 (d int /d ref ) CM4 (d int /d ref ) * Acquisition limited. ** Numbers based on July results. Currently running simulations to obtain updated numbers.

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 34 Signal Robustness/Coexistence  Assumption: Received signal is 6 dB above sensitivity.  Value listed below are the required distance or power level needed to obtain a PER  8% for a 1024 byte packet at 110 Mb/s and a Mode 1 DEV (3-band).  Coexistence with a/b and Bluetooth is straightforward because these bands can be completely avoided. InterfererValue IEEE 2.4 GHz d int  0.2 meter IEEE 5.3 GHz d int  0.2 meter Modulated interferer SIR  -9.0 dB Tone interferer SIR  -7.9 dB

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 35 PHY-SAP Throughput  Assumptions:  MPDU (MAC frame body + FCS) length is 1024 bytes.  SIFS = 10  s.  MIFS = 2  s.  Assumptions:  MPDU (MAC frame body + FCS) length is 4024 bytes. Number of Mb/s 1Mode 1: 84.8 Mb/s Mode 2: 81.3 Mb/s Mode 1: Mb/s Mode 2: Mb/s Mode 1: Mb/s Mode 2: Mb/s 5Mode 1: 94.8 Mb/s Mode 2: 90.5 Mb/s Mode 1: Mb/s Mode 2: Mb/s Mode 1: Mb/s Mode 2: Mb/s Number of Mb/s 1Mode 1: Mb/s Mode 2: Mb/s Mode 1: Mb/s Mode 2: Mb/s Mode 1: Mb/s Mode 2: Mb/s 5Mode 1: Mb/s Mode 2: Mb/s Mode 1: Mb/s Mode 2: Mb/s Mode 1: Mb/s Mode 2: Mb/s

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 36 Complexity (1)  Unit manufacturing cost (selected information):  Process: CMOS 90 nm technology node in  CMOS 90 nm production will be available from all major SC foundries by early  Die size for Mode 1 (3-band) device:  Die size for Mode 2 (7-band) device: Complete Analog*Complete Digital 90 nm3.0 mm mm nm3.3 mm mm 2 * Component area. Complete Analog*Complete Digital 90 nm3.2 mm mm nm3.5 mm mm 2 * Component area.

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 37 Complexity (2)  Active CMOS power consumption for Mode 1 (3-band) and Mode 2 (7-band) devices: Block 90 nm130 nm Mode1Mode 2Mode 1Mode 2 TX (55 Mb/s)85 mW151 mW104 mW173 mW TX (110, 200 Mb/s)128 mW212 mW156 mW240 mW RX (55 Mb/s)147 mW201 mW192 mW258 mW RX (110 Mb/s)155 mW209 mW205 mW271 mW RX (200 Mb/s)169 mW223 mW227 mW293 mW

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 38 Complexity (3)  Manufacturability:  Leveraging standard CMOS technology results in a straightforward development effort.  OFDM solutions are mature and have been demonstrated in ADSL and a/g solutions.  Scalability with process:  Digital section complexity/power scales with improvements in technology nodes (Moore’s Law).  Analog section complexity/power scales slowly with technology node.  Time to market: 1H  Size: Solutions for PC card, compact flash, memory stick, SD memory in 2005.

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 39 Scalability of Multi-band OFDM  Data rate scaling:  Data rates from 55 Mb/s to 480 Mb/s has been defined in the current proposal.  Frequency scaling:  Mode 1 (3-bands) and optional Mode 2 (7-band) devices.  Guaranteed interoperability between different mode devices.  Power scaling:  Implementers could always trade-off power consumption for range and information data rate.  Complexity scaling:  Digital section will scale with future CMOS process improvements.  Implementers could always trade-off complexity for performance.

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 40 Comparison of OFDM Technologies  Qualitative comparison between Multi-band OFDM and IEEE a OFDM: Criteria Multi-band OFDM Strong Advantage Multi-band OFDM Slight Advantage Neutral a Slight Advantage a Strong Advantage PA Power Consumption ADC Power Consumption FFT Complexity Viterbi Decoder Complexity Band Select Filter Power Consumption Band Select Filter Area ADC Precision Digital Precision Phase Noise Requirements Sensitivity to Frequency/Timing Errors Design of Radio Power / Mbps 1. Assumes a 256-point FFT for IEEE a device. 2. Assumes a 128-point FFT for IEEE a device. 3. Even though the Multi-band OFDM ADC runs faster than the IEEE a ADC, the bit precision requirements are significantly smaller, therefore the Multi-OFDM ADC will consume much less power.

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 41 Multi-band OFDM  Advantages (1)  Suitable for CMOS implementation (all components).  Antenna and pre-select filter are easier to design (can possibly use off-the-shelf components).  Early time to market!  Low cost, low power, and CMOS integrated solution leads to:  Early market adoption!

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 42 Multi-band OFDM  Advantages (2)  Inherent robustness in all the expected multipath environments.  Excellent robustness to ISM, U-NII, and other generic narrowband interference.  Ability to comply with world-wide regulations:  Bands and tones can be dynamically turned on/off to comply with changing regulations.  Coexistence with current and future systems:  Bands and tones can be dynamically turned on/off for enhanced coexistence with the other devices.  Scalability with process:  Digital section complexity/power scales with improvements in technology nodes (Moore’s Law).  Analog section complexity/power scales slowly with technology node.

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 43 Summary  The proposed system is specifically designed to be a low power, low complexity all CMOS solution.  Expected range for 110 Mb/s (90% link success probability): 20.5 meters in AWGN, and approximately 11 meters for a Mode 1 device and greater than 9 meters for a Mode 2 device in realistic multi-path environments.  Expected power consumption for 110 Mb/s using 130 nm CMOS process:  Mode 1 DEV: 117 mW (TX), 205 mW (RX), 18  W (deep sleep).  Mode 2 DEV: 186 mW (TX), 271 mW (RX), 18  W (deep sleep).  Multi-band OFDM is coexistence friendly and complies with world-wide regulations.  Multi-band OFDM offers multi-mode devices (scalability).  Multi-band OFDM offers the best trade-off between the various system parameters.

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 44 Backup slides

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 45 Self-evaluation Matrix (1)

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 46 Self-evaluation Matrix (2)

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 47 Convolutional Encoder  Assume a mother convolutional code of R = 1/3, K = 7. Having a single mother code simplifies the implementation.  Generator polynomial: g 0 = [133 8 ], g 1 = [145 8 ], g 2 = [175 8 ].  Higher rate codes are achieved by puncturing the mother code. Puncturing patterns are specified in latest revision of 03/268.

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 48 Bit Interleaver: Mode 1 (3-band)  Bit interleaving is performed across the bits within an OFDM symbol and across at most three OFDM symbols.  Exploits frequency diversity.  Randomizes any interference  interference looks nearly white.  Latency is less than 1  s.  Bit interleaving is performed in three stages:  First, 3N CBPS coded bits are grouped together.  Second, the coded bits are interleaved using a N CBPS  3 block symbol interleaver.  Third, the output bits from 2 nd stage are interleaved using a (N CBPS /10)  10 block tone interleaver.  The end results is that the 3N CBPS coded bits are interleaved across 3 symbols and within each symbol.  If there are less than 3N CBPS coded bits, which can happen at the end of the header or near the end of a packet, then the second stage of the interleaving process is skipped.

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 49 Bit Interleaver: Mode 1 (3-band)  Ex: Second stage (symbol interleaver) for a data rate of 110 Mbps  Ex: Third stage (tone interleaver) for a data rate of 110 Mbps

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 50 Multi-band OFDM: RX Architecture  Block diagram of an example RX architecture:  Architecture is similar to that of a conventional and proven OFDM system. Can leverage existing OFDM solutions for the development of the Multi-band OFDM physical layer.

doc.: IEEE /267r6 Submission September 2003 A. Batra, Texas Instruments et al.Slide 51 Simulation Parameters  Assumptions:  System as defined in 03/268.  Clipping at the DAC (PAR = 9 dB).  Finite precision ADC (4 110/200 Mbps).  Degradations incorporated:  Front-end filtering.  Multi-path degradation.  Clipping at the DAC.  Finite precision ADC.  Crystal frequency mismatch (  20 TX,  20 RX).  Channel estimation.  Carrier/timing offset recovery.  Carrier tracking.  Packet acquisition.