Silicon  -Calorimeters at Saclay Main Architecture: All-Si STANDARD Technologies including collective approach for large (1024 pixels) buttable X-rays.

Slides:



Advertisements
Similar presentations
Bolometric astronomical imaging at mm wavelengths
Advertisements

A Bolometer Array Instrument for Millimeter Wavelength Philippe Camus, CNRS-CRTBT (Grenoble) Milano, July 6th, 2001.
Dark Matter search with EDELWEISS and beyond Gilles Gerbier CEA Saclay – IRFU Rencontres de Moriond- VHEPU march 15 th Expérience pour DEtecter.
Recent progress with TES microcalorimeters and signal multiplexing J. Ullom NIST NASA GSFC SRON J. Beall R. Doriese W. Duncan L. Ferreira G. Hilton R.
Semiconductor Light Detectors ISAT 300 Foundations of Instrumentation and Measurement D. J. Lawrence Spring 1999.
R. Lemrani CEA Saclay Search for Dark Matter with EDELWEISS Status and future NDM ’06 Paris, September 3-9, 2006.
CCD-style imaging for the JCMT. SCUBA-2 technology  the ability to construct large format detector arrays  signal readouts that can be multiplexed To.
TES Bolometer Array with SQUID readout for Apex
X-Ray Spectroscopy. 1 eV 100 eV 10 eV Energy (keV) The need for high resolution X-ray spectroscopy Astrophysical Plasmas: Simulation of the emission from.
28 June 2002Santa Cruz LC Retreat M. Breidenbach1 SD – Silicon Detector EM Calorimetry.
June X-Ray Spectroscopy with Microcalorimeters1 X-Ray Spectrometry with Microcalorimeters.
IR (Infrared) Night Vision Weapon Detection Security Monitoring Firefighting.
J. Salonen, “Flip Chip Bumping Process at VTT" [presentation for GPG], 16-March-2007 Flip Chip/Bumping Process at VTT Last modified March 16, 2007 By Jaakko.
McGill Nanotools Microfabrication Processes
Fabrication of Active Matrix (STEM) Detectors
Si Pixel Tracking Detectors Introduction Sensor Readout Chip Mechanical Issues Performance -Diamond.
Development of Low Temperature Detector S.C. Kim (SNU, DMRC)
Netherlands Institute for Space Research Development of TES-microcalorimeter arrays and Frequency Domain Multiplexed read-out Henk Hoevers Division Sensor.
10 Dec 2004, Mid-term Review in Milano Applied Cryodetectors Research Training Network funded by the European Commission's 5th Framework programme Improving.
T. Frank for the CRESST collaboration Laboratori Nazionali del Gran Sasso C. Bucci Max-Planck-Institut für Physik M. Altmann, M. Bruckmayer, C. Cozzini,
MANU2: status report Maria Ribeiro Gomes* for the Genoa Group IAP, 14-Nov-05 * pos-doc under TRN HPRN-CT
DDEP 2012 | C. Bisch – Study of beta shape spectra 1 Study of the shape of  spectra Development of a Si spectrometer for measurement of  spectra 
Semiconductor Manufacturing Technology Michael Quirk & Julian Serda © October 2001 by Prentice Hall Chapter 9 IC Fabrication Process Overview.
Recent Progress in Silicon Microcalorimeters and Their Prospects for NeXT (and other missions) Caroline A. Kilbourne NASA Goddard Space Flight Center.
Large Area Microcalorimeters of the Diffuse X-ray Background Sarah Bank Towson University August 5, 2004.
Surface events suppression in the germanium bolometers EDELWEISS experiment Xavier-François Navick (CEA Dapnia) TAUP Sendai September 07.
1 Adam Woodcraft SUPA, University of Edinburgh Instrumentation for sub-mm astronomy.
Silicon detector processing and technology: Part II
Metallic magnetic calorimeters (MMC) for high resolution x-ray spectroscopy Loredana GASTALDO, Markus LINCK, Sönke SCHÄFER, Hannes ROTZINGER, Andreas BURCK,
The European Future of Dark Matter Searches with Cryogenic Detectors H Kraus University of Oxford EURECA.
PAUL SCHERRER INSTITUT M. Furlan I. Jerjen E. Kirk Ph. Lerch A. Zehnder Cryogenic Detectors Development at PSI.
2 Silicon pixel part Done and to be written Written! Under way To be done Introduction 1.Hybrid Pixel Assembly Concept 2.Silicon sensor 1.First thinned.
Min Kyu Lee ( 이민규 ) Kyoung Beom Lee ( 이경범 ) Yong-Hamb Kim ( 김용함 ) Low Temperature Detectors 2006 Workshop on the Underground Experiment at Yangyang TEXONO-KIMS.
Véronique SANGLARD Université de Lyon, UCBL1 CNRS/IN2P3/IPNLyon Status of EDELWEISS-II.
HIGH QUANTUM EFFICIENCY NEUTRON DETECTOR WITH A SPATIAL RESOLUTION IN THE MICROMETER RANGE GÖRAN THUNGSTRÖM.
Radiation hardness of Monolithic Active Pixel Sensors (MAPS)
Fundamentals of Semiconductor Physics 万 歆 Zhejiang Institute of Modern Physics Fall 2006.
XEUS Cryogenic Instrument October 2004 Cryogenic X-ray sensor development in US, Europe and Japan Micro-calorimeters Doped - thermistors Astro-E2.
Metallic Magnetic Calorimeters for High-Resolution X-ray Spectroscopy D. Hengstler, C. Pies, S. Schäfer, S. Kempf, M. Krantz, L. Gamer, J. Geist, A. Pabinger,
Yong-Hamb Kim Low Temperature Detectors for Rare Event Search 2 nd Korea-China Joint Seminar on Dark Matter Search.
Simbol–X workshopMay 14th, 2007 The Simbol-X Detector Payload P. Laurent CEA/Saclay & APC.
Prof. Christer Fröjdh Radiation detector research at Mid Sweden University.
MPI Semiconductor Laboratory, The XEUS Instrument Working Group, PNSensor The X-ray Evolving-Universe Spectroscopy (XEUS) mission is under study by the.
MARE Microcalorimeter Arrays for a Rhenium Experiment A DETECTOR OVERVIEW Andrea Giuliani, University of Insubria, Como, and INFN Milano on behalf of the.
Fab - Step 1 Take SOI Wafer Top view Side view Si substrate SiO2 – 2 um Si confidential.
Side ViewTop View Beginning from a silicon wafer.
ICT 1 SINTEF Edge-On Sensor with Active Edge Fabricated by 3D-Technology T. E. Hansen 1), N. Ahmed 1), A. Ferber 2) 1) SINTEF MiNaLab 2) SINTEF Optical.
Status report Pillar-1: Technology. The “Helmholtz-Cube” Vertically Integrated Detector Technology Replace standard sensor with: 3D and edgeless sensors,
K.Wyllie, CERNIWORID 2004 Readout of the LHCb pixel hybrid photon detectors Ken Wyllie on behalf of the LHCb collaboration and industrial partners The.
CdTe prototype detector testing Anja Schubert The University of Melbourne 9 May 2011 Updates.
STATUS OF R&D AT UCSB Paul Szypryt Mazin Lab August 26, 2013.
Low Cost Silicon Sensor Y. Kwon in exploration with J. Lajoie, E. Kistenev, A. Sukhanov, and Z. Li as part of MPC-EX R&D.
CRESST Cryogenic Rare Event Search with Superconducting Thermometers Max-Planck-Institut für Physik University of Oxford Technische Universität München.
Thermal Kinetic Inductance Detectors for x-rays Orlando Quaranta Thomas Cecil Lisa Gades Antonino Miceli Advanced Photon Source.
Yong-Hamb Kim Development of cryogenic CaMoO 4 detector 2nd International Workshop on double beta decay search Oct. 7~ Oct. 8, 2010.
Low Temperature Detector Design for the particle search Kim Seung Cheon (DMRC,SNU)
PIXEL 2000 P.Netchaeva INFN Genova 0 Results on 0.7% X0 thick Pixel Modules for the ATLAS Detector. INFN Genova: R.Beccherle, G.Darbo, G.Gagliardi, C.Gemme,
From Edelweiss I to Edelweiss II
Cryogenic Particle Detectors in Rare event Searches
New Mask and vendor for 3D detectors
Development of LAMBDA: Large Area Medipix-Based Detector Array
Temperature Sensors on Flexible Substrates
SCUBA-2 Detector Technology Development
Silicon Wafer cm (5’’- 8’’) mm
MEMS Two-Phase Vapor Escape Heat Exchanger
LSST Camera Detector Status
Layer Transfer Using Plasma Processing for SMART-Wafer
BONDING The construction of any complicated mechanical device requires not only the machining of individual components but also the assembly of components.
MARE (microcalorimeter array for a rhenium experiment)
Presentation transcript:

Silicon  -Calorimeters at Saclay Main Architecture: All-Si STANDARD Technologies including collective approach for large (1024 pixels) buttable X-rays arrays. (Based on Herschel Development at LETI/LIR) “MESA process” for Thermometer realization. High temperature diffusion after implantation  reliable homogeneous thermometer (as NTD Ge). Known and reliable Technologies. Extrapolation from High impedance (cf. IR exp.) to low impedance sensors. High Impedance Readout Circuitry (MUX based on Herschel Development) cryogenic followers, pixel read-out on trigger. R&D now : Tantalum Absorber : Metallurgy and modeling. Absorber on the thermometers matrices. –Gluing of the absorber membrane on a silicon holder and micromachining –Hybridization through Indium Versus Gluing Proximity Electronics : Cryogenic Followers (HEMT or MOSFET)

Silicon  -Calorimeters at Saclay

Figure 2 : under-bump metallurgy Photoresist Figure 3 : Photolithography defining Indium volume Figure 4 : Indium deposition Figure 5: Photoresist lift-off Figure 6 : Indium reflow Mesa Thermometer Figure 1 : Reception of the absorber Passivation Indium Bump Hybridisation Silicon  -Calorimeters at Saclay

The indium bump process allows for a self alignment (through the full array) between the absorbers and the sensors which contrasts with a classical gluing process. Figure 9 : self alignment x Figure 8 : placing and heating  Figure 7 : alignment  Silicon  -Calorimeters at Saclay

General Layout on double-SOI substrate. X-ray Array and Followers Array on the same wafer at 2 different Temperatures.  -calorimeters around 100 mK and Followers around 2K.  Thermal insulation via superconducting leads, etching of the substrate and IR insulation. Buttable on 2 sides allowing to fill any FOV.

Silicon  -Calorimeters at Saclay LETI/LIR (Grenoble) develops the Si Technologies. (P. Agnese) Prototypes tested at CEA-Saclay/Dapnia/Sap in coll. with Dapnia/SEDI (X.F. Navick) 2 test cryostats available (dilution, down to 10 mK) HEMT developed in coll with LPN/CNRS. (Young-Jin) Common development with EDELWEISS Absorber developed in collaboration with CSNSM/CNRS (L. Dumoulin) Thermal treatment, coating and measurement of thermal characteristics at CSNSM Thermal Modellization of Absorber and Links by Palermo (G. Vaiana). General Architecture and MUX at Sap (C. Cara). First Fundings from CEA/Sap and CNES

Main Characteristics & Conclusions: Full Energy Coverage (up to 30 keV) Spectral Resolution (~ keV) Quasi-Classical MUX Low Count rate (up to 10 Hz) Large covering of FOV Good (Excellent) filling Factor Silicon  -Calorimeters at Saclay