Career Paths for Materials Science and Engineering Graduates Dr. Laura J. Turbini Chemistry Lab Manager and Principal Scientist Research in Motion

Materials Advantage University of Toronto 2 My Checkered Career AB, Chemistry MS and PhD, Inorganic Chemistry High School Teacher Industry Researcher and Manager Technical Editor University Professor Research Centre Director Lab Manager Principal Scientist Octobeer 14, 2010

Materials Advantage, University of Toronto 3 Engineer Octobeer 14, 2010

Materials Advantage, University of Toronto 4 MS/PhD Octobeer 14, 2010

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Materials Advantage, University of Toronto 8 Design Engineer Octobeer 14, 2010

Project Management Octobeer 14, 2010Materials Advantage University of Toronto 9

Materials Advantage, University of Toronto 10 Industry Management Octobeer 14, 2010

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Materials in Microelectronics Octobeer 14, 2010Materials Advantage, University of Toronto 13

Head on Pillow Octobeer 14, 2010Materials Advantage University of Toronto 14

April 17, 2007SMTA Toronto Workshop Dendritic Growth Copper dendrite growing from cathode. Forms only when copper-complexing reagent present

April 17, 2007SMTA Toronto Workshop Depletion of Anode: Open Circuit

Tin Dendrites Octobeer 14, 2010Materials Advantage University of Toronto 17

April 17, 2007SMTA Toronto Workshop Important Electrical Parameters Electric Field E = V/d Ohms Law V = IR Resistance R =  (d/A) Conductivity  = 1/  OH - Br - H+H+ Pb + Cu +2 Cl - Sn +4

March 10, 2008TMS Annual Meeting19 A Closer Look at CAF Conductive Anodic Filaments are copper-containing corrosion by- products that emanate from the anode of a circuit and “grow” subsurface toward the cathode, frequently along the fibre-epoxy interface. CAF + Anode - Cathode

March 10, 2008TMS Annual Meeting20 Conductor Configurations Hole-to-hole Hole-to-trace Trace-to-trace + _ + Trace-to-hole + _

March 10, 2008TMS Annual Meeting21 Catastrophic CAF Failure AnodeCathode

27 Corrosion of Copper in Chloride Media Formation of CuCl  Cu + Cl -  CuCl + 1e - Generation of oxygen and hydrogen ions  2H 2 O  O 2 + 4H + + 4e - CAF Formation  12 CuCl + 3O 2 + 6H 2 O  4Cu 2 (OH) 3 Cl + 4Cu Cl - Pourbaix Diagram of Cu-Cl-H 2 O system A. Caputo, L.J. Turbini, and D.D. Perovic, Journal of Electronic Materials, vol. 39, pp , 2010

23 SEM Analysis of PCB cross- section Copper Glass Fibres Filled Epoxy Core Prepreg HDI

Epoxy and fillers characterization 24  Silica is used to reduce the coefficient of thermal expansion (CTE)  Aluminum and magnesium hydroxides are used as flame retardants

Epoxy and fillers characterization 25 PSi O

Time to Delamination 26 MgMg H150 Delamination between epoxy/glass fibers and epoxy/epoxy

27 Temperature to decomposition (T d ) Derivative wt% change/˚C vs. T Overlap curves with all materials Materials with Al(OH) 3 Materials without Al(OH) 3  The presence of Al(OH) 3 causes an increase in the rate of weight loss as this compounds starts decomposing at 200 ˚C 27

Materials Advantage, University of Toronto 28 Questions? Octobeer 14, 2010