IMAPS POLAND - 2002 The 26-th International Conference of International Microelectronics and Packaging Society – Poland Chapter Warshaw, 25-27 Sept. 2002.

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Presentation transcript:

IMAPS POLAND The 26-th International Conference of International Microelectronics and Packaging Society – Poland Chapter Warshaw, Sept. 2002

ORGANISERS: - Warshaw University of Technology,Poland - Institute of Electronic MaterialsTechnology (ITME)-Warshaw,Poland with participation of the: - Polish Society of Sensor Technique and - Section of Microelectronics of Committee for Electronics and Telecommunication of Polish Academy of Science

The conference programme consisted in: 9 invited presentations 46 papers presented in : - posters sessions - a special oral session 2 seminars Participants from more countries such as: England,Ucraine,Romania,Germany,USA and Poland

All the papers had a high technical content,in a large range of themes,such as: Behaviour of resistors or capacitors under different conditions (high/low frequency,high voltage load); Thick / thin film technology; Conductive adhesives, electronic pastes, polymer foils; Optimization of high density Boards; Thermal simulations; Software programs used in the field of Electronical Packaging ; Sensors; All the papers had a high technical content,in a large range of themes,such as: Behaviour of resistors or capacitors under different conditions (high/low frequency,high voltage load); Thick / thin film technology; Conductive adhesives, electronic pastes, polymer foils; Optimization of high density Boards; Thermal simulations; Software programs used in the field of Electronical Packaging ; Sensors;

The Romanian IEEE-CPMT Student Branch Chapter had three members who presented 4 papers in the poster session: -D.V.Ene: -”Training in Electronic Packaging Using Software Platforms” - “Modeling and Simulation of Capacitors at High Frequency” -I.Adjudeanu : -”Modeling and Simulation of Resistors at High Frequency”; -C.Toma : - “Microcontroller Based Electronic Control Unit for High Vacuum Pumps”

”Training in Electronic Packaging Using Software Platforms” – D.V.Ene,C.Ionescu,V.Golumbeanu: -presented software platforms for training in the field of electronic components,developed,tested and used by the students themselves.

”Modeling and Simulation of Resistors at High Frequency” I.Adjudeanu,P.Svasta,V.Golumbeanu,M.Davidescu -analyzed the behaviour of resistors at high frequency using the impedance analyzer (Agillent 4396B) and PSPICE simulations.

“Modeling and Simulation of Capacitor Circuits at High Frequency” P.Svasta,V.Golumbeanu,M.Davidescu,D.V.Ene -presented the impedance of capacitors using the impedance analyzer(Agillent 4396B) and PSPICE simulations. Variable inductance Impedance for three and six standard ceramic chip capacitors in parallel. Impedance for three and six chip capacitors with low ESR and L in parallel

-” Microcontroller Based Electronic Controll Unit for High Vacuum Pumps Applications” P.Svasta, C.Toma, N.D.Codreanu -presented an electronic prototype development meant to control and drive a high vacuum pump(10^9 N/m^2) necessary to be embedded in physics,chemistry,industry. -the equipment was realised around 2 PIC microcontrollers(one controlls a high speed motor rot/min and one is the manager of the electronic unit) -the PCB’s were manufactured using LPKFmechanical engraving technology; -the final solution has 5 PCB’s (2 for power supply,one for digitall and one for power area);

The Conference was a unique opportunity for scientists,engineers and students from universities,research centres and industry laboratories to meet and discuss the newest developments in microelectronics. Thank you for your attention!