Influence of the Gravity, Vacuum and RF on CLIC Module T0 Behavior R. Raatikainen

 Introduction -Overview - Modeling steps - Supporting system -Illustration of thermal dissipations in TMM -TMM cooling concept  Results  Discussion  Introduction -Overview - Modeling steps - Supporting system -Illustration of thermal dissipations in TMM -TMM cooling concept  Results  Discussion INDEX

 Based on the CLIC prototype module to be tested in the laboratory, the TMM was modified to correspond with the CDR module design.  The most significant variation and assumptions made to the lab module in the TMM point of view include:  Vacuum condition,  Differences in the heat dissipation, e.g. waveguides,  Contact modeling; bonded MB AS separated using flexible bellows,  Both operation modes – unloaded and loaded – were taken into account.  The DB Q used is about half of the weigth of the lab mock-up magnet. Overview

 The modelling of parts was created in steps including simplification in CATIA and importation into ANSYS FEA Modelling steps Original 3D model in CATIA Simplified geometry in ANSYS  Simplification composes of suppressing geometrical details such as fillets, chamfers, holes etc.  Simplified models are then assembled and prepared for TMM  Boundary conditions (heat loads, contacts, gravity etc.) are applied in ANSYS pre-processing phase  After thermal FEA, the results are imported into ANSYS structural (coupled simulation)

 The RF structures are supported on the girders via so-called V-supports.  As shown the module includes 4 fixed V-support and 4 sliding V- supports on MB side. PETS are fixed in the middle while the extremities has a sliding support. DB Q is mounted (fixed) on the girder.  RF structures are interlinked with each other and the vacuum system via bellows.  For the first time in TMM also the sliding has been taken into account. Supporting system

Illustration of the interconnections  Vacuum and RF interconnections modelled as flexible joints

DB Q  Steady-state maximum temperature variation of 5°C for the magnet was considered (based on the current reference value) Illustration of thermal dissipations in TMM RF network  Thermal dissipation of 11 W per waveguide was considered Summary of the thermal dissipations in both operation modes

TMM cooling concept Summary of the cooling boundary conditions and loads; HTC: heat transfer coefficient.  The current cooling scheme is based on distributed water channels; 4 SAS in parallel and 4 PETS + 4 Waveguides in series.

Temperature distribution within the module. The highest temperatures are in magnitude of 42 °C (Unloaded operation) and 40 °C (Loaded operation). Thermal results Unloaded Loaded Units, °C

Structural results – RF load Axial (y-direction) deformation of the SAS

Structural results – Vacuum load transversal (x-direction) deformation of the SAS

Summary Thermal results showing the main temperature and heat dissipations into water and air. Structural results showing the behaviour of the module in unloaded case corresponding the worst operation. Once the operation mode is modified, the change is seen primary on the MB side (DB side maintains its stability and no instant deviation is seen at micron level – including the location of the DB BPM) → Summarizing the components as vectors, the total deformations are about 76 µm and 32 µm for the MB and DB, respectively

Conclusion  The thermal results show that during the heating ramp up the temperature of the module rises over 40 °C. The AS experiences the maximum temperature variation.  The water temperature rise is about 10 °C for AS and 5 °C for PETS.  The axial deformation of one super AS due to the temperature variation is 40 μm.  The deformation due to the vacuum forces occurs mainly in the x direction.  Deformations due to the gravity are lower than the ones caused by vacuum and RF.  In reality the deformations due to the thermal effects should be considered larger. Variations in the environment temperature are not taken into account.

Extra– deformation under gravity PETS vertical deformations are about 35 µm SAS vertical deformations are about 30 µm

Extra– Stresses caused by the thermal load