US ATLAS Lehman Review – 22-May-2003George Brandenburg – Page 1 MDT Electronics

US ATLAS Lehman Review – 22-May-2003George Brandenburg – Page 2 On-Chamber Electronics Faraday bottom plate Hedgehog card (passive) 24 MTD array : 3x8 & 4x6 Faraday top plate (sides not shown) Mezzanine card (ASDs, TDC, i/o) Mezzanine card enclosure

US ATLAS Lehman Review – 22-May-2003George Brandenburg – Page 3 PCB Requirements Mezzanine Board ASDs, TDC, --> Mixed signal design Low crosstalk Robust esd/spark protection Maintain thermal noise levels (< 1 fc) -6 layer designs -Split (Analog/Digital) power & ground planes -LVDS for all “real time signaling” Signal Hedgehog 3.2 kV operation, 6kV components Low capacitance (Hi-Z) signal traces (noise, signal quality) Low crosstalk - “widely” separated signal traces Low noise - 4 layers with ground planes on top and bottom

US ATLAS Lehman Review – 22-May-2003George Brandenburg – Page 4 ASD Chip Requirements Low noise/low input impedance for good signal integrity High background rate of up to 300kHz per channel In-situ timing calibration Pulse height measurement for time-slewing correction Eliminate "fake" after-pulsing by programmable dead-time Low cost, reliable, rad-tolerant, analog CMOS technology –HP 0.5u CMOS

US ATLAS Lehman Review – 22-May-2003George Brandenburg – Page 5 Component Connections Mezz Chamber Service Module Data (fiber) MROD TTC 40 conductor Mezz-CSM ribbon calbles carry : Clk, trigger,calibration (fiber) Power, Gnd Data Clk Timing calibration V,T monitoring DCS

US ATLAS Lehman Review – 22-May-2003George Brandenburg – Page 6 CSM Design Highlights Motherboard has connectors to service up to 18 Mezz Boards Daughterboard has multiplexor and communications chips Initialization - Cat5 Cable JTAG from MROD (Opto-isolate) Environment Monitoring - ELMB Analog Mux (64 channels) Calibration - Standard TTC System Link to ROD - Low Power Optical G-Link at 53.3MHz Simple time division multiplexing 1.8 volt LVDS capable FPGA

US ATLAS Lehman Review – 22-May-2003George Brandenburg – Page 7 CSM-1 Daughter/Mother

US ATLAS Lehman Review – 22-May-2003George Brandenburg – Page 8 Design Responsibilities HedgeHog Boards –EndCap: MIT (HV), Boston U (signal) –Barrel: Pavia (HV), Rome III (signal) MDT-ASD Chip - Boston U and Harvard AMT-TDC Chip - KEK Mezzanine Boards - Harvard and Boston U Mezz-CSM Cables - Boston U and Harvard Chamber Service Module - Michigan ROD - NIKHEF

US ATLAS Lehman Review – 22-May-2003George Brandenburg – Page 9 Production Responsibilities HedgeHogs (common production in Italy) –Signal - Boston (EndCap), Chamber-Builders (Barrel) –HV - INFN (all types) ASD - Boston U and Harvard AMT-TDC - KEK Mezzanine Boards - Israel ( Harvard : coord./testing) Mezz-CSM Cables - Harvard and BU (EndCap) Chamber Service Module - Michigan (EndCap) ROD - Nijmegen plus several European institutions

US ATLAS Lehman Review – 22-May-2003George Brandenburg – Page 10 HV Hedgehog Status Production responsibility: Pavia -Agostino Lanza Manufacturer: SEI Systems in Genoa, Italy First batch of 600 boards arrived in March 2003 –220 Type I, 280 Type II, 40 Type III, 60 Type IV Will deliver 2000 (one eighth) every 2 months EndCap boards will be distributed from Harvard Board to board jumpers all delivered

US ATLAS Lehman Review – 22-May-2003George Brandenburg – Page 11 Signal Hedgehog Status Production responsibility: BU for EndCap Manufacturer: SEI Systems in Genoa, Italy Eleuterio Spiriti (Rome III) will oversee First small batch arrived in March 2003 Next batch of ~500 being distributed now Then deliver 1000 (1/16th) every month Harvard will also distribute the EndCap boards Improvements in delivery rate needed to keep pace (see next transparency)

US ATLAS Lehman Review – 22-May-2003George Brandenburg – Page 12 Signal Hedgehog (cont.) Delivery rate for EndCaps must improve –Need 50% by Dec 03, remaining 50% by April 04 SEI Systems visit last week: –Test rig bugs worked out (humidity control etc.) –Rate will now exceed 1000/mo (1200/mo?) –R. Richter says it can be improved --> 2000/mo –Progress will be tracked bi-weekly Accelerated delivery schedule for EndCap? –R. Ricter says Barrel builders not ready for full rate –Distribution re-balancing favoring EC to be discussed

US ATLAS Lehman Review – 22-May-2003George Brandenburg – Page 13 ASD and AMT Chip Status ASD production responsibility: BU (+Harvard) –80K ASD chips delivered in January –90% tested (Harvard) and ready for shipment to Israel –Yield: 70% top quality + 15% additional OK quality –Main problem: chan to chan variation in threshold offset AMT production responsibility: KEK -Yasuo Arai –24 channel TDC chip with trigger windowing –100 AMT3 chips already delivered to Israel for Mezz –Remaining 17K will be delivered early June

US ATLAS Lehman Review – 22-May-2003George Brandenburg – Page 14 Mezz Board Status Original production responsibility: Harvard + BU Israel (G.M.) offered to produce using special funds! 100 “pre-production” boards installed at H8 test beam “Final” layout sent to Israeli vendors in April –Eltek (PCBs), Arotek and PMI (fab) –Expect first production batch of 100 boards in June –Next batch of 5K boards in August, tested by September –Remainder (12K) delivered by Nov, tested by Feb 04 Testing will take place at Harvard –Test 1000/wk using 16 board test stand –Possible second test site at CERN?

US ATLAS Lehman Review – 22-May-2003George Brandenburg – Page 15 Mezz-CSM Cable Status Design responsibility: Harvard (and BU) Production responsibility: Harvard (for EndCap) Shielded, halogen-free, round ribbon cable Locking connectors used - shield grounded at FC Prototype cables being used/tested at H8 5000’ of cable (~1/3 of EC total) due May (.5m f-f) Another 5000’ of cable due July (.33m f-f) First big batch of fabricated cables available July Will stay ahead of Mezz Board production / testing

US ATLAS Lehman Review – 22-May-2003George Brandenburg – Page 16 CSM Status Production responsibility: Michigan (for EndCap) CSM-1 prototypes being used at H8 –Motherboard production can begin September –Install on chambers to “terminate” Mezz-CSM cables –Daughter boards with fiber optics produced in early 04 –Easy to plug into already mounted motherboards “CSM-0.5” daughter board (BU) for chamber tests –Uses CSM-1 motherboard for chamber mount –Final Mezz-CSM cabling can be installed –Patches JTAG and data to CSM-0 using Cat 5 cables –Can use existing prototype test stands

US ATLAS Lehman Review – 22-May-2003George Brandenburg – Page 17 Production Schedule

US ATLAS Lehman Review – 22-May-2003George Brandenburg – Page 18 Est. Cost to Complete

US ATLAS Lehman Review – 22-May-2003George Brandenburg – Page 19 Est. Cost Comments