Investigation of Multi-Layer Actuation Carlos R. Jimenez. California State Polytechnic University, Pomona. Electrical Engineering, Fall 2006 Faculty Mentor:

Slides:

Advertisements

Similar presentations

MICROELECTROMECHANICAL SYSTEMS ( MEMS )

Advertisements

Miniature Tunable Antennas for Power Efficient Wireless Communications Darrin J. Young Electrical Engineering and Computer Science Case Western Reserve.

1 Testing an Inkjet Printer for Use in MEMS Fabrication Marvin Cruz Home Institution: University of California, Santa Cruz Principal Investigator: Joel.

Geometrically Optimized mPAD Device for Cell Adhesion Professor Horacio Espinosa – ME 381 Final Project Richard Besen Albert Leung Feng Yu Yan Zhao Fall.

MetalMUMPs Process Flow

MEMS Rigid Diaphragm Speaker

Design and Simulation of a MEMS Piezoelectric Micropump Alarbi Elhashmi, Salah Al-Zghoul, Advisor: Prof. Xingguo Xiong Department of Biomedical Engineering,

Simulation and Analysis of Equally Distributed Flow for Use in Ultrasonic Atomization Lindsay Rogers University of Wisconsin, Platteville Mechanical Engineering.

UCF Thru the Eyes of a Bug: MEMS for Beginners I am not a bug. I am an ant!

Assignment#01: Literature Survey on Sensors and Actuators ECE5320 Mechatronics Assignment#01: Literature Survey on Sensors and Actuators Electrostatic.

Arizona State University 2D BEAM STEERING USING ELECTROSTATIC AND THERMAL ACTUATION FOR NETWORKED CONTROL Jitendra Makwana 1, Stephen Phillips 1, Lifeng.

MEMS Gyroscope with Electrostatic Comb Actuation and Differential Capacitance Sensing Haifeng Dong, Zheng Yao, Advisor: Xingguo Xiong Department of Electrical.

MEMS Tuning-Fork Gyroscope Group 8: Amanda Bristow Travis Barton Stephen Nary.

John D. Williams, Wanjun Wang Dept. of Mechanical Engineering Louisiana State University 2508 CEBA Baton Rouge, LA Producing Ultra High Aspect Ratio.

INTEGRATED CIRCUITS Dr. Esam Yosry Lec. #6.

Microfluidic Valve Innovation Jo Falls Porter, RET Fellow 2009 West Aurora High School RET Mentor: Dr. David T. Eddington, PhD NSF- RET Program Introduction.

Fabrication of p-n junction in Si Silicon wafer [1-0-0] Type: N Dopant: P Resistivity: Ω-cm Thickness: µm.

New Trends and Technologies for (N)MEMS

© Maximillian A Perez 2005 IM-SURE Irvine, CA (13) Max Perez MicroSystems Lab Mechanical and Aerospace Engineering University of California,

Carbon Nanotube Electronics

Study of Factors Affecting Performance of Spin-Polarized Atomic Gyroscopes Uyen Nguyen Huynh Dr. Andrei M. Shkel Max Perez Jesper Eklund Monty Rivers Ilya.

1 WIREBONDING CHARACTERIZATION AND OPTIMIZATION ON THICK FILM SU-8 MEMS STRUCTURES AND ACTUATORS LIGA and Biophotonics Lab NTHU Institute of NanoEngineering.

The Resistive Properties of Thin Carbon Films from Pyrolized SU-8 Justin Little Department of Mechanical and Aerospace Engineering University of California,

Micro-Technologies for Implantable Strain Gauge Arrays

Applications: Angular Rate Sensors (cont’d)

Assembly and Testing of a MEMS Mirror for Endoscopic OCT IMSURE Fellow: Dolly Creger Mentor: William Tang Graduate Student: Jessica Ayers.

The Effects of Manufacturing Imperfections on Distributed Mass Gyroscopes Professor Andrei Shkel Adam Schofield and Alexander Trusov Department of Mechanical.

ME-381 Dec. 5Xiaohui Tan, Rui Qiao A STUDY ON CELL ADHESION BY USING MEMS TECHNOLOGY Rui Qiao Xiaohui Tan ME-381 Dec. 5.

MEMS Cell Adhesion Device Andrea Ho Mark Locascio Owen Loh Lapo Mori December 1, 2006.

Simulation and Experimental Studies of Biomechanics at the Micro-Scale Elizabeth Nettleton, Undergraduate: Chemistry, University of South Dakota IM SURE.

Sample Devices for NAIL Thermal Imaging and Nanowire Projects Design and Fabrication Mead Mišić Selim Ünlü.

CREATING SILICON NANOSTRUCTURES WITH CONTROLLABLE SIDEWALL PROFILES BY USING FLUORINE-ENHANCED OXIDE PASSIVATION Sensing and Actuation in Miniaturized.

SOIMUMPs Process Flow Keith Miller Foundry Process Engineer.

YoHan Kim  Thin Film  Layer of material ranging from fractions of nanometer to several micro meters in thickness  Thin Film Process 

RF MEMS devices Prof. Dr. Wajiha Shah. OUTLINE  Use of RF MEMS devices in wireless and satellite communication system. 1. MEMS variable capacitor (tuning.

MEMS Fabrication and Applications Brought to you by: Jack Link & Aaron Schiller Date delivered on: Friday the third of May, 2013 ABSTRACT: Taking a brief.

MEMS Fabrication By Thomas Szychowski.

NANO-ELECTRO-MECHANICAL SYSTEM(NEMS)

CS/EE 6710 CMOS Processing. N-type Transistor + - i electrons Vds +Vgs S G D.

Why do we put the micro in microelectronics?. Why Micro? 1.Lower Energy and Resources for Fabrication 2.Large Arrays 3.Minimally Invasive 4.Disposable.

Comparison of various TSV technology

Nano/Micro Electro-Mechanical Systems (N/MEMS) Osama O. Awadelkarim Jefferson Science Fellow and Science Advisor U. S. Department of State & Professor.

Jason Choi Professor Andrei Shkel Adam Schofield, Alex Trusov, Ozan Anac.

Alignment Algorithm for the Vestibular Prosthesis

© Pearson & GNU Su-Jin Kim MEMS Manufacturing Processes MEMS Devices The MEMS(Microelectromechanical systems) devices can be made through the IC Process:

Interferometric Modulator Display Presentation 4: Anatomy of an iMod

Top Down Manufacturing

 Lyon, France  June 12, 2007 | Christophe Yamahata  Electrical & Mechanical characteristics of DNA bundles revealed by Silicon Nanotweezers C. Yamahata,

Center for Materials for Information Technology an NSF Materials Science and Engineering Center Optical Lithography Lecture 13 G.J. Mankey

CORPORATE INSTITUTE OF SCIENCE & TECHNOLOGY, BHOPAL DEPARTMENT OF ELECTRONICS & COMMUNICATIONS NMOS FABRICATION PROCESS - PROF. RAKESH K. JHA.

Page 1 Active MEMS for Wireless and Optical Space Communications Principal Investigators: Frank Merat, Stephen Phillips Task Number: NAG Case Western.

LITHOGRAPHY IN THE TOP-DOWN PROCESS - BASICS

A MEMS Micro Flow-cytometer Based on Dielectric Particle Focusing and Integrated Optical and Impedance Detection Peter R.C. Gascoyne Department of Molecular.

Fab - Step 1 Take SOI Wafer Top view Side view Si substrate SiO2 – 2 um Si confidential.

Micro Electro Mechanical Systems (MEMS) Device Fabrication

Speaker: Shiuan-Li Lin Advisor : Sheng-Lung Huang

MEMS Tuning-Fork Gyroscope Group 8: Amanda Bristow Travis Barton Stephen Nary.

Wisconsin Center for Applied Microelectronics

Making a Capacitive Accelerometer

Fabrication By Thomas Szychowski.

MEMS, Fabrication Cody Laudenbach.

by C. Sun, N. Fang, D.M. Wu, X. Zhang∗

Memscap - A publicly traded MEMS company

MicroElectroMechanical Systems

SILICON MICROMACHINING

LITHOGRAPHY Lithography is the process of imprinting a geometric pattern from a mask onto a thin layer of material called a resist which is a radiation.

Applications and Acknowledgements

Making a Capacitive Accelerometer

Presentation transcript:

Investigation of Multi-Layer Actuation Carlos R. Jimenez. California State Polytechnic University, Pomona. Electrical Engineering, Fall 2006 Faculty Mentor: Professor Andrei Shkel. Graduate Student Mentors: Max Perez, Adam R. Schofield. Department of Mechanical Aerospace Engineering

© C. Jimenez 2005, IM-SURE Motivations for out of plane actuation. Currently fabricated X-Y axis gyroscope driven by in-plane actuation. Desired X-Y-Z axis gyroscopes driven by in-plane and out-of- plane actuation. X Y sense direction Y Z X Driving direction Additional Sense capabilities

© C. Jimenez 2005, IM-SURE Out of Plane Actuation has a wide range of applications MEMS micro mirrors For optical switching. X-Y-Z Gyroscopes for the aerospace and automotive industry.

© C. Jimenez 2005, IM-SURE How are lateral combs actuated? Regular lateral combs for in- plane actuation driven by an AC voltage signal. Experimental concept for out-of- plane actuation driven by an AC voltage signal. VoVo +Vo-+Vo- t VoVo +Vo-+Vo- t

© C. Jimenez 2005, IM-SURE Motivations on using offset combs for out-of-plain actuation vs. parallel plates. Limitations when fabricating structures in Silicon- On-Insulator for out-of-plane actuations. Si Electrode V SiO 2 Unfortunately current fabricating techniques do not allow placing an electrode under a microstructure.

© C. Jimenez 2005, IM-SURE Target objectives for the research. Model various lateral comb architectures in Finite Element Analysis Software along with MATLAB. Design fabrication techniques to achieve lateral combs with different heights. Fabricate test structures to observe the deepness differences in the combs. Attempt to characterize structures.

© C. Jimenez 2005, IM-SURE Modeling Results contd.. Force in the Z direction Vs Height of Ground Comb. Changing Height 0-70um Constant 70 um

© C. Jimenez 2005, IM-SURE Modeling Results contd.. Force in the Z Direction Vs. Potential across Offset Combs Ground Variable Potential From 0 to 100V

© C. Jimenez 2005, IM-SURE Modeling Contd.. Out of Plane Force Vs. Comb Displacement. Displacement. Force becomes Negative after A 25um rise. -1.4e-12 N/um levitated

© C. Jimenez 2005, IM-SURE Fabrication parameters for force Maximization Sensitivity Analysis from the standard model. Tests: 15, 35, & 55um Standard Tests: 5,10 & 15 um Standard Tests: 5, 10 & 15um

© C. Jimenez 2005, IM-SURE Designing test structures Making and evaluating masks. First approach: Opaque combs were thought to partially protect combs from UV light when exposed. Second approach: Create Structures with a two mask deposition. This mask was not successful for its Unexpected roughness Successful mask with 250um. resolution Smooth mask used to fabricate the structure

© C. Jimenez 2005, IM-SURE Manufacturing devices Lithography and etch for two mask process. Apply a thick layer of Photo-Resist. Protect the high combs with a first mask and develop the wafer. Hard Bake the wafer. Apply a thin layer of Photo-resist. Protect all combs with a second mask and develop again Deep etch for 90 minutes Si Deep etch for 45 more minutes.

© C. Jimenez 2005, IM-SURE Manufacturing Results Evaluating the etching process Despite the significant height decrease, the final etch was not evenly across the exposed combs. A Dektek 3 surface profiler was used to estimate the roughness on the small comb surfaces. Very rough

© C. Jimenez 2005, IM-SURE Pre-Characterization Isolating the Moving Structure Between the combs we deposited Sylgard182, an elastomer with flexible and isolating properties. Three days after, the elastomer cured, giving the possibility for electrical isolation. The Characterization of the test device was started but not fully completed.

© C. Jimenez 2005, IM-SURE How likely are offset combs to lift a structure? Standard in-plane vs. out-of plane forces.

© C. Jimenez 2005, IM-SURE Full MEMS experience. 2.Concept. 3.Modeling 4.Design Layout 6.Characterization 1.Idea 5.Fabrication

© C. Jimenez 2005, IM-SURE Acknowledgments Thanks to: Faculty Mentor: Prof. Andrei Shkel Graduate Student Mentors: Max Perez, Adam Schofield. Lab: Jesper Eklund, Max Perez, Adam R. Schofield, Alexander Trusov, Chandra S. Tupelly. IM SURE: Said Shokair. Calit2: Goran Matijasevic. Funded by: *National Science Foundation (NSF). *Undergraduate Research Opportunity Program (UROP).

© C. Jimenez 2005, IM-SURE Questions?

© C. Jimenez 2005, IM-SURE