Analysis of Thermal Transient Data Semiconductor Package Synthetic Models Provide: Insight into the thermal performance of various package designs and improvements “Why isn’t the performance of this new package much better than that of the old design?” “Why has the change in die size had such a large effect on package ‘A’ and so little effect on package ‘B’?”

Analysis of Thermal Transient Data Semiconductor Package Synthetic Models Provide: The basis for intelligent selection of alternate package thermal enhancement approaches “Would a heat spreader or heat sink provide greater package enhancement?” “Would a different die attachment provide significant enhancement?”

Analysis of Thermal Transient Data Semiconductor Package Synthetic Models Provide: The basis for estimation of probable results for proposed enhanced package-designs “What is the greatest improvement in thermal performance that can be expected from this new package enhancement?”

Analysis of Thermal Transient Data Semiconductor Package Synthetic Models Provide: Direct simulation of the thermal behavior of devices to non- steady or cyclic powering conditions “What is the thermal impedance of this device for a 50 hertz power waveform?” “What is the peak junction temperature expected during the high-power start-up and initializing cycle?”

Analysis of Thermal Transient Data Mock Empirical Data from Hypothetical Mechanical System

Analysis of Thermal Transient Data Selected Candidate Model for Mechanical System Example Optimal Assignments Based on Response Data: MASS: 0.03 grams SPRING: 10 dynes/cm DAMPER: 0.02 dynes/cm/sec

Analysis of Thermal Transient Data Junction Temperature Step-Response Plotted Using Linear-Time Axis

Analysis of Thermal Transient Data Junction Temperature Step-Response Plotted Using Log-Time Axis

Analysis of Thermal Transient Data Candidate Thermal Model for Semiconductor Packages, Third Order

Analysis of Thermal Transient Data Model Step-Response Expressed as Impedance Versus Log-Time

Analysis of Thermal Transient Data Test Response of Plastic 24 Lead DIP with Overlaid Synthesized Model

Analysis of Thermal Transient Data Test Response of Ceramic 24 Lead DIP with Overlaid Synthesized Model

Analysis of Thermal Transient Data Comparison of Plastic Package vs. Ceramic Package

Analysis of Thermal Transient Data Assumed Segmentation Boundaries

Analysis of Thermal Transient Data Heat Capacity Comparison Estimated Heat Capacities Relative to Synthetic Model Values

Analysis of Thermal Transient Data Test Response of 208 Lead Copper-Slug Package with Overlaid Model (good die attachment, second order model)

Analysis of Thermal Transient Data Conditions Indicative of Model Degeneration: The multiple between two time constants is less than One constituent resistance or heat capacitance is insignificantly small One time constant is larger than the duration spanned by the test data Solutions for Model Degeneration Reduce the order of the candidate model (number of RC pairs) Expand the test duration

Analysis of Thermal Transient Data Test Response of 208 Lead Copper-Slug Package with Overlaid Model (failed die attachment, third order model)

Analysis of Thermal Transient Data Test Response of 208 Lead Copper-Slug Package with Overlaid Model (failed die attachment, second order model)

Analysis of Thermal Transient Data Comparison of Failed Die Attach to Good Die Attach

Analysis of Thermal Transient Data TO-247 Test Response, Junction-to-Case, Thermocouple Under Tab

Analysis of Thermal Transient Data Junction-to-Case Candidate Model

Analysis of Thermal Transient Data Model Response of Junction & Thermocouple Nodes, Junction-to-Case Model

Analysis of Thermal Transient Data TO-247 Test Response, Junction-to-Case, With Overlaid Synthetic Model (thermocouple on center lead)

Analysis of Thermal Transient Data Junction-to-Case Synthetic Model Overlaid on TO-247 Test Response Data (thermocouple under tab)

Analysis of Thermal Transient Data TO-247 Test Response with Alternate Synthetic Model which Excludes the Bump Anomaly

Analysis of Thermal Transient Data Model Response for Square Waves of Various Periods and Duty Cycles

Analysis of Thermal Transient Data Test Response of Device #1 with Overlaid Model (3 Time Constants, Linear-Log Plot)

Analysis of Thermal Transient Data Test Response of Device #1 with Overlaid Model (3 Time Constants, Log-Log Plot)

Analysis of Thermal Transient Data Test Response of Device #1 with Overlaid Model (4 Time Constants, Linear-Log Plot)

Analysis of Thermal Transient Data Test Response of Device #1 with Overlaid Model (4 Time Constants, Log-Log Plot)

Analysis of Thermal Transient Data Test Response of Device #2 with Overlaid Model (3 Time Constants, Linear-Log Plot)

Analysis of Thermal Transient Data Test Response of Device #2 with Overlaid Model (4 Time Constants, Linear-Log Plot)

Analysis of Thermal Transient Data Test Response of Device #2 with Overlaid Model (4 Time Constants, Log-Log Plot)