Ceramic Focal Plane Components For SNAP B. C Ceramic Focal Plane Components For SNAP B. C. Bigelow, UM Physics 4/13/05

Ceramic Detector Packages AlN detector package material already demonstrated Ground and space heritage well established Cryo epoxies known, package assembly procedures established See Oluseyi, Bercovitz, et. al. (LBNL) Package assembly to set height, flatness to ~ +/- 5 microns See Miyazaki, et al, PASJ AlN CTE close match to Si, SiC, Invar Natural match to Si CCD sensor material Near-match to HgCdTe Si MUX material Can be machined, polished, epoxy-inserted, etc. AlN -> near match for SiC SiC package material base-lined for GAIA mission More later! 04/13/05 Bruce C. Bigelow -- UM Physics

CTE for Focal Plane Materials CTE plot courtesy of Pat Jelinsky: 04/13/05 Bruce C. Bigelow -- UM Physics

Bruce C. Bigelow -- UM Physics Subaru Suprime Camera On Subaru 8.2m telescope, Mauna Kea, Hi See Miyazaki, et al 5 x 2 mosaic of LL-MIT 2K x 4k CCDs - 83 Megapixels AlN CCD packages AlN cold-plate Assembled mosaic is flat to approx. +/- 5 microns Threaded studs epoxied into AlN packages Flat interface between packages and cold-plate 04/13/05 Bruce C. Bigelow -- UM Physics

Bruce C. Bigelow -- UM Physics Subaru Suprime Camera Miyazaki, et al 04/13/05 Bruce C. Bigelow -- UM Physics

Bruce C. Bigelow -- UM Physics Subaru Suprime Camera AlN cold-plate 120mm x 150mm mosaic 04/13/05 Bruce C. Bigelow -- UM Physics

Bruce C. Bigelow -- UM Physics Subaru Suprime Camera AlN package and “buffer block” Stud is epoxied into AlN buffer block 04/13/05 Bruce C. Bigelow -- UM Physics

Bruce C. Bigelow -- UM Physics Subaru Suprime Camera AlN buffer block and spacer shims in assembly jig 04/13/05 Bruce C. Bigelow -- UM Physics

Bruce C. Bigelow -- UM Physics Subaru Suprime Camera AlN CCD package epoxied to buffer block 04/13/05 Bruce C. Bigelow -- UM Physics

GAIA mission SiC focal plane Boostec SiC material: Sintered fabrication process Less than 3% porosity Pure, alpha phase SiC, no free silicon Boostek SiC Moly Density: 3100 kg/m^3 10,200 kg/m^3 Young’s modulus: 420 GPa 330 GPa Flexural strength: 450 Mpa 415 Mpa CTE (room temp): 4.0 PPM/C 5.35 PPM/C Thermal conductivity: 180 W/m·k 138 W/m·k 04/13/05 Bruce C. Bigelow -- UM Physics

GAIA mission SiC cold-plate Boostec/Astrium GAIA focal plane demonstrator model: Sintered SiC, 770mm by 580mm by 36mm, 8kg. 04/13/05 Bruce C. Bigelow -- UM Physics

GAIA mission SiC cold-plate GAIA cold-plate - detector mounting detail. Note finished bores on mounting holes 04/13/05 Bruce C. Bigelow -- UM Physics

Ceramic CCD Packages for SNAP CCD package features: All dimensions and mounting features per ICD 00065-AC14A (HDH) Hypertonics KA series connectors per ICD All vented hardware – but not always shown! AlN PCB interfaces between detectors and connectors Integral filter/aperture assemblies AlN or SiC package and mount material (interchangeable) 04/13/05 Bruce C. Bigelow -- UM Physics

Bruce C. Bigelow -- UM Physics Ceramic CCD package Invar inserts with internal threads for M3 mounting screws 04/13/05 Bruce C. Bigelow -- UM Physics

Bruce C. Bigelow -- UM Physics Ceramic CCD package Round insert, diamond insert, undersized insert provide kinematic constraint of in-plane DOF – X, Y, and rot Z. Ground pads define tip, tilt, and piston of package 04/13/05 Bruce C. Bigelow -- UM Physics

Bruce C. Bigelow -- UM Physics Ceramic CCD assembly AlN or SiC mount AlN or SiC CCD package epoxy Ribbon cable Invar insert, epoxied in PCB Invar insert, epoxied in Hypertronics KA series, 72 pins 04/13/05 Bruce C. Bigelow -- UM Physics

Bruce C. Bigelow -- UM Physics Ceramic CCD package CTE-matching filter frame, with filter and aperture mask 04/13/05 Bruce C. Bigelow -- UM Physics

Bruce C. Bigelow -- UM Physics Ceramic MCT Packages MCT package features: All dimensions and mounting features per ICD 00065-AC14A (HDH) Hypertonics KA series connectors per ICD All vented hardware – but not always shown! AlN PCB interfaces between detectors and connectors Integral filter/aperture assemblies AlN or SiC package and mount material (interchangeable) 04/13/05 Bruce C. Bigelow -- UM Physics

Bruce C. Bigelow -- UM Physics Ceramic MCT package Near-copy of CCD PCB, but wraps around for wire-bonding to sensor MUX on top surface AlN/SiC PCB isolates detector package from connector thermal stresses 04/13/05 Bruce C. Bigelow -- UM Physics

Bruce C. Bigelow -- UM Physics Ceramic MCT package 04/13/05 Bruce C. Bigelow -- UM Physics

Bruce C. Bigelow -- UM Physics Ceramic MCT package Filter frame clearance for wire-bonds 04/13/05 Bruce C. Bigelow -- UM Physics

Bruce C. Bigelow -- UM Physics Ceramic MCT package 04/13/05 Bruce C. Bigelow -- UM Physics

Bruce C. Bigelow -- UM Physics SNAP ¼ CCD+MCT mosaic CCD MCT 04/13/05 Bruce C. Bigelow -- UM Physics

Bruce C. Bigelow -- UM Physics SNAP ¼ CCD+MCT mosaic Section showing mounting interface details 04/13/05 Bruce C. Bigelow -- UM Physics

Bruce C. Bigelow -- UM Physics SNAP ¼ CCD+MCT mosaic Section showing mounting interface details 04/13/05 Bruce C. Bigelow -- UM Physics

Bruce C. Bigelow -- UM Physics SNAP ¼ CCD+MCT mosaic Back side of FP mosaic showing mounting screws and access to connector 04/13/05 Bruce C. Bigelow -- UM Physics