High Frequency Test Methods for Laminate Materials (HF) Project

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Presentation transcript:

High Frequency Test Methods for Laminate Materials (HF) Project 10/17/10 High Frequency Test Methods for Laminate Materials (HF) Project HDPUG May 18, 2011 ©HDP User Group International, Inc. 1

10/17/10 Project Goals Phase I: Electrically test commonly used high frequency (below IPC 0.010 Df) laminate materials: * Including all commercial “halogen-free” laminate materials, not “new” materials (not in volume production) * Using all viable electrical test methods for speeds above 2 GHz. Phase II: Reliability testing including IST test coupons from common test vehicles made using the “halogen-free” laminate materials. Note: The term “halogen-free” used herein refers to bromine or brominated compounds not being used in the resin formulation. ©HDP User Group International, Inc. 2

10/17/10 Project Details 1) Determine the lower loss laminate materials to be tested. Ref. Slide #5: Draft list of set of these laminate materials to be tested. 2) Phase I testing to include several baseline non-halogen-free laminate(s). Examples: Isola 408HR and/or IS-415. 3) Standardize on available copper foil type with controlled, constant copper roughness and dielectric construction. 4) In a later phase potentially evaluate alternate constructions. 5) Testing a) Loss Tangent(Df)and Er (Dk) at 2 GHz, 10 GHz, up to 40-50 GHz where possible, all completely dried with 0X or 6X 260 C preconditioning. * Test Methods: SPP(IBM), SET2DIL(Intel), Bereskin Stripline, EBW, Stripline (IPC 2.5.5.5), Split Post Dielectric Resonator Cavity (IPC 2.5.5.13), Tri-plate Line Resonator (JPCA-TM001), CISCO. ©HDP User Group International, Inc. 3

Project Details, Cont. 5) Testing, Cont. b) IST Testing (Phase II) 10/17/10 Project Details, Cont. 5) Testing, Cont. b) IST Testing (Phase II) * Preconditioning 6X at 260 C * 500 Cycles, Peak Temp 150 C * Weibull Plot of failures * Crossection checks for delamination ©HDP User Group International, Inc. 4

10/17/10 Laminate Materials Draft list high frequency laminate materials includes the following halogen-free laminate materials; Df (0.007 to 0.015 @ 2 GHz): * EMC EM-828 * EMC EM-285 * EMC EM-370-D * Grace GA-HF-17 * Hitachi 679(HE) * Hitachi 679H * Hitachi 67(G,H) * Hitachi LZ-71G * ITEQ IT-170GRA * ITEQ IT-168G * Panasonic R-1566W * TUC TU-862HF ©HDP User Group International, Inc. 5

10/17/10 Project Milestones 1) Generation of standard test board design and construction stackup. 2) Suppliers commit to supply the laminate materials to be tested. 3) Labs/test sites committed for the before and after 6X at 260 C preconditioning. 4) Labs/test sites committed to perform the Loss Tangent(Df)and Er (Dk) at 2 GHz, 10 GHz, and up to 40-50 GHz where possible. * SPP(IBM) * SET2DIL(Intel) : * Bereskin Stripline(Isola) : * EBW, Stripline (IPC 2.5.5.5) : * Split Post Dielectric Resonator Cavity (IPC 2.5.5.13) : * Tri-plate Line Resonator (JPCA-TM001) : 5) Phase II labs/test sites committed. ©HDP User Group International, Inc. 6

Project Participants 10/17/10 ©HDP User Group International, Inc. 7 Members of this list: alun.morgan@isola-group.com <mailto:alun.morgan@isola-group.com> anderson@iteq.com.tw <mailto:anderson@iteq.com.tw> chris.katzko@meadvillegroup.com <mailto:chris.katzko@meadvillegroup.com> david.love@oracle.com <mailto:david.love@oracle.com> dsenk@cisco.com <mailto:dsenk@cisco.com> eric.scivier@viasystems.com <mailto:eric.scivier@viasystems.com> erkko.helminen@meadvillegroup.com <mailto:erkko.helminen@meadvillegroup.com> fischer@hitachi-chemical.com <mailto:fischer@hitachi-chemical.com> fish5er@hdpug.org <mailto:fish5er@hdpug.org> geying@syst.com.cn <mailto:geying@syst.com.cn> heidi.reynolds@oracle.com <mailto:heidi.reynolds@oracle.com> joseph.smetana@alcatel-lucent.com <mailto:joseph.smetana@alcatel-lucent.com> ken-ikeda@hitachi-chem.co.jp <mailto:ken-ikeda@hitachi-chem.co.jp> kikuchi.shun@jp.fujitsu.com <mailto:kikuchi.shun@jp.fujitsu.com> lhutchin@juniper.net <mailto:lhutchin@juniper.net> mahu@cisco.com <mailto:mahu@cisco.com> marika.immonen@meadvillegroup.com <mailto:marika.immonen@meadvillegroup.com> marsh57@hdpug.org <mailto:marsh57@hdpug.org> michael.freda@oracle.com <mailto:michael.freda@oracle.com> monique.mayr@isola-group.com <mailto:monique.mayr@isola-group.com> mweinhold@eipc.org <mailto:mweinhold@eipc.org> swilkins@juniper.net <mailto:swilkins@juniper.net> sylvia.ehrler@de.multek.com <mailto:sylvia.ehrler@de.multek.com> yangzq@syst.com.cn <mailto:yangzq@syst.com.cn> ©HDP User Group International, Inc. 7

10/17/10 Tentative Schedule Laminate manufacturers commit to providing test materials ’10, 09/01 10/01 2011 02/01 04/01 Work on test board design starts Test board design completed and laminate materials ordered Test boards shipped to labs for Dk, Df testing IST coupon testing completed 06/01 08/01 09/01 10/01 11/01 Laminate materials received at fabricator Dk, Df reports completed and IST testing starts Final reports completed ©HDP User Group International, Inc. 8