CIRTEK ELECTRONICS CORPORATION Company Presentation

Outline Company overview and organization Services and CEC BOM Product Portfolio and Special Capabilities Company strengths Plans and programs Package Technology Roadmap Final Test, Finishing and FAREL Cirtek Electronics Corporation 4/14/2017

Outline Company overview and organization Services and CEC BOM Product Portfolio and Special Capabilities Company strengths Plans and programs Package Technology Roadmap Final Test, Finishing and FAREL Cirtek Electronics Corporation 4/14/2017

Cirtek Electronics Corporation 4/14/2017

Company overview Company Structure Cirtek Holdings Philippines Corporation Cirtek Electronics Corporation (“CEC”) Primary purpose is to engage as an independent subcontractor for semiconductor assembly, test and packaging services Cirtek Electronics International Corporation (“CEIC”) A BVI company which provides marketing, logistical and administrative support, including collection to CEC. Cirtek Electronics Corporation 4/14/2017

Company overview CIRTEK TODAY History Established in 1984 as independent Subcontract Assembly & Test Provider Accredited by International Quality institutions CIRTEK has grown to provide world class turnkey solutions that include services from package design development, wafer probe, wafer back grinding, assembly packaging and final testing of semiconductor devices up to drop shipments to Customer's end users. Competitive pricing and easily adaptable to customers needs CIRTEK TODAY 25 years experience outsourced assembly & testing solution provider High quality products, while providing production flexibility Competitive pricing and adaptable to customers’ needs. Profitable despite several economic downturns, debt free company Growing client base composed of companies located around the world Cirtek Electronics Corporation 4/14/2017

Company overview Cirtek assembles and tests semiconductor devices at its manufacturing complex located on a 20,000 square meter property in Biñan, Laguna. Its manufacturing facility is composed of two buildings, with a total floor area of 14,100 square meters. 1800SQM of clean room environment @ Class 10K. We offer general line and captive line assembly models A Philippine Economic Zone Authority (PEZA) registered company as an ecozone export enterprise at the Laguna Technopark for the manufacture of standard integrated circuits, discrete, hybrid and potential new packages. Cirtek Electronics Corporation 4/14/2017

Company overview Business Strategies 1 To develop partnership with its existing and potential customers to provide world class quality solutions through management expertise focused on specific applications to meet customers specification, high reliability and multi chips products. Partnership with Customer to grow business together 1 To offer dedicated or captive line models for assembly and test services in order to efficiently produce the customer’s mature and stable products through shared investment Captive Line Development 2 To continuously focus on Innovations and re-Engineering in its production and assembly techniques and capabilities, and to co-develop new technologies with customers Technology Development 3 To actively seek strategic investments opportunities such as, alliances, joint ventures, and/or acquisitions that will be consistent with the Company’s overall business strategies Mergers and Acquisitions 4 Cirtek Electronics Corporation 4/14/2017

Organizational Structure PRESIDENT & CEO Jerry Liu CFO Tony Buyawe EXECUTIVE VP/ GEN MANAGER Jorge Aguilar QA DIRECTOR Luz Veril QA / FAREL SECTION MANAGER Zeny Puedan QC/QA SEC.MANAGER Jacqueline Blancaflor VP- Global Business Development Norman Chang HUMAN RESOURCE DIRECTOR Milet Cruzada ACCOUNTING MANAGER Susan Lumba MULTICHIPS BUS. MANAGER MeAnn Canoza IC BUS. MANAGER Miles Besana DISCRETE BUS. MANAGER Medy Chua QFN /DFN BUS. MANAGER Wilson Padre NEW PRODUCT BUS. MANAGER Rosendo Cerezo HERMETICS BUS. MANAGER Laarni Arnesto SENIOR DIRECTOR SALES & MKTG-CS Antonio Callueng VP FOR ENG’G & PURCH, IND’L MGMT, Raul Santiano FINAL TEST MANAGER Walter Alegarme DEVELOPMENT ENG’G. Raymond Tecson FINAL TEST SUPERVISOR Manny Olandria CUST SERVICE TEAM SUSTAINING ENG’G Chona Morales PROBE TEST SUPERVISOR Roderich Ignacio MULTI DIE TEST SUPERVISOR Rey Reyes Cirtek Electronics Corporation 4/14/2017

Outline Company overview and organization Services and CEC BOM Product Portfolio and Special Capabilities Company strengths Plans and programs Package Technology Roadmap Final Test, Finishing and FAREL Cirtek Electronics Corporation 4/14/2017

Cirtek Services Sort + Assy + Test + Drop shipment Wafer backgrinding (8” maximum diameter / 4 mils thick capability) Wafer mapping (8” maximum diameter / ASCII format) Wafer probing (6” & 8” wafer diameter) Die sales inspection (Commercial / Military / Medical level of inspection) Full assembly (Refer to package portfolio) Marking (ink / laser) Final test (Refer to test capabilities) Tape and reel (SOT, 150 / 300 mil SOIC, QFN / DFN) Tape and Ammo (TO-92 straight / spread leads) Drop shipment (To any point as required) Ship to Stock Serve as your HUB/Distribution center Cirtek Electronics Corporation 4/14/2017

Build of Materials Cirtek Standard Materials Molding Compound Leadframe DA Epoxy Gold Wire ( Mils) Stamped LF Copper A194 PPF -NiPdAu Etched LF Plating – Spot Ag Configuration: Matrix HDLF Single/Dual 84-1LMI/SR4 8900- NC 8600 - 2600AT - HT QMI 529HLV CRM 1076NS Eutectic DA Solder paste Sn5Pb95 Sn10Pb90 0.80, 0.90, 1.0 mils Sumitomo – G600, G770 1.2, 1.3, 1.5, 2.0 mils Hitachi 9220HF10 Copper Wire ( Mils) NittoG300LC 1.0 , 1.65, 2.0 Sumitomo 6710/6600 Aluminum Wire ( Mils) Cookson3200LS 1.25, 5.0, 10 Toshiba KE955WY-white Copper Clip Attach Plating – 100% Tin Plating –SnPB (85/15) Cirtek Electronics Corporation 4/14/2017

Outline Company overview and organization Services and CEC BOM Product Portfolio and Special Capabilities Company strengths Plans and programs Package Technology Roadmap Final Test, Finishing and FAREL Cirtek Electronics Corporation 4/14/2017

Product Portfolio QFN/DFN Packages QFN Body Size Small Body Size DFN Body Size 2.00 x 2.00 / 08L 3.00 x 3.00 / 08L 3.00 x 3.00 / 16L 3.50 x 3.50 / 20L 4.00 x 4.00 / 24L 5.00 x 5.00 / 28L 7.00 x 7.00 / 32L 8.00 x 8.00 / 52L 0.50 x 0.25 x 0.30 / 02L 1.00 x 0.60 x 0.46 / 02L 1.10 x 1.60 x 0.46/ 02L 1.27 x 0.76 x 0.76/ 02L 2.20 X 1.78 x 0.76/ 02L 2.50 X 1.70 x 0.76/ 03L Customer Specific 6.00 X 6.00 x 0.90/ 02L 2.90 x 1.80 / 04L 1.70 x 1.35 / 08L 2.00 x 2.00 / 08L 2.50 x 1.35 / 12L 3.00 x 1.35 / 12L 3.30 x 1.35 / 16L 3.00 x 3.00 / 10L 4.00 x 1.60 / 16L Cirtek Holdings Philippines Corporation 4/14/2017

16L Standard – Clip Attach Product Portfolio SOIC Packages 150 Mils Body Packages 300 Mils Body Packages TSOC 6L– 150 x 150 x 55 mils 18L 08L- Stand 20L 16L Standard – Clip Attach 14L - Stand 24/28L 16L - Stand Exposed Pad Version 08L- 150 Mils 16L – 300 Mils 16L – QSOP Cirtek Electronics Corporation 4/14/2017

Product Portfolio Plastic Dual In Line Package 08L 8L, 9L 18L 20L 14L 300 Mils Body Package 600 Mils Body Package Single In Package 08L 18L 8L, 9L 20L 14L 24/28L 16L Cirtek Electronics Corporation 4/14/2017

Product Portfolio SOT Packages 03L SOT223 TO 92 -Stand 05L SOT 143 06L TO 92 Packages 03L SOT223 TO 92 -Stand 05L SOT 143 06L TO 92 - Flat SOT89 Cirtek Electronics Corporation 4/14/2017

Product Portfolio Hermetic Packages Cirtek Electronics Corporation Metal Can ( TO 3- TO 5) T-Hole Oscillator SMT/COB Assy Small Metal Cans Hybrid Assembly Build of Materials Materials Customer Specific Consignment Flexible Arrangement Cirtek Electronics Corporation 4/14/2017

Other Special Assembly Capabilities Multichip on Standard Package Standard silicon die attach cylindrical crystal through resistance welding LF design by Cirtek 300 mil (SOIC) Pack. Multi die on standard 150 mil 2 die up to 32 die, Custom LF design by Cirtek (SOIC) package Cylindrical Crystal Control IC Copper Clip attach on SOIC/QFN ESD and Power Devices Die to Die Bonding Multi die embedded ceramic crystal Mounted die in PCB NC and conductive epoxy Transfer over mold process 300 mil (SOIC) package Copper clip Cirtek Electronics Corporation 4/14/2017

Hermetic Module Assembly Metal lid Non-hermetically sealed using conductive epoxy PCB Passive component attached with solder GaAs dice attached with conductive epoxy Gold wire Cirtek Electronics Corporation 4/14/2017

Prescaler-Static divider Module Assembly 1 1 3 1 2 LEGEND: 1 CHIP CAPACITOR 1 1 2 CHIP RESISTOR 3 PRESCALER DIE Cirtek Electronics Corporation 4/14/2017

Outline Company overview and organization Services and CEC BOM Product Portfolio and Special Capabilities Company strengths Plans and programs Package Technology Roadmap Final Test, Finishing and FAREL Cirtek Electronics Corporation 4/14/2017

Company strengths Certified to the latest quality standards 1 Certified to the latest quality standards 2 Solid management team and expertise 3 Ability to adapt to customers’ needs 4 Full turnkey solutions 5 Growing customer base of diverse clients 6 Strong brand name and proven track record 7 A PEZA-registered entity Cirtek Electronics Corporation 4/14/2017

Company strengths   1 World Class Quality standards Cirtek’s manufacturing practices are designed to be compliant with industry requirements and to exceed customer’s expectation.  Manufacturing applies latest quality system standards, which include ISO 9001, ISO 14001, QS-9000/TS-16949, BABT and DSCC, as well as certified facility by UL Cirtek Electronics Corporation 4/14/2017

Quality Management System map Review Internal Quality Auditing – MOP Customer Service - COP 10 Customers Requirements Purchasing Warehousing QA /IQA Inspection Billing Customers Satisfaction 9 Sales and Marketing Process Design and Dev’t Production Planning Control Process Control Inst / Doc’n Assembly Mfg FA-REL Final Test Delivery 1 2 3 4 6 7 8 5 Calibration Maintenance Process Engineering Support Process Facilities MIS Training HR EMS Main Process COP NOTE: Support process that has no arrows meaning it will support the whole organization. MOP Product Realization Cirtek Electronics Corporation 4/14/2017

Continual Improvement Process Cirtek Quality Management System R E Q U I R E M E N T S C U S T O M E R S C U S T O M E R S S A T I S F A C T I O N Information Input Output Cirtek Electronics Corporation 4/14/2017

Outstanding Quality System QUALITY MILESTONE IN SYSTEM AUDITS PERFORMED BY CUSTOMERS AND INDEPENDENT AUDITORS ACCREDITTED AS QUALIFIED SUPPLIER BY OEM’s CUSTOMER/END USER SPONSOR YEAR QUALIFIED APPLICATION HUAWEI – CHINA PANASONIC MOBILE COMM–JAPAN CANON INC - JAPAN GE HEALTH CARE MICRONAS AUTOMOTIVE PANASONIC ELECTRONIC-JAPAN IBM-JAPAN INTERNATIONAL RECTIFIER ST MICROLECTRONICS CMD EMERSON (ASTEC) MEDTRONICS GENNUM SEMTECH INC ANALOG DEVICES INC SUNPOWER MICRONAS DALLAS-MAXIM IR DIVISION ST MICRO SILICON LINK MICROSEMI GENNUM-CANADA 2009 2008 2007 2006 2005 2003 2002 POWER SUPPLY - CE REPEATER/BASE STATION ELECTRONIC DEVICES CT SCANNER HAL SENSOR FLAT SCREEN TV ENTERPRISE/OFFICES DATA NETWORKING POWER SUPPLY / CHARGERS MOBILE APPLICATION POWER SUPPLY - CE MEDICAL IMPLANTABLE HEARING AID Cirtek Electronics Corporation 4/14/2017

Company strengths     2 Solid Management Team and Expertise Management team is composed of highly experienced individuals from various semiconductor and OSAT companies.  The Cirtek Team has over 150 years of combined management and engineering package design expertise specific to semiconductor industry.  Lean organization and prudent decision making.  Focused and goal oriented. Cirtek Electronics Corporation 4/14/2017

Customer requirements Company strengths 3 Ability to adapt to customer’s needs  Technical abilities which provide customers a full range of turnkey solutions Customer satisfaction as evidenced by the awards received from several customers  Customer requirements World class quality standards Excellence in manufacturing Clean room (Class 10K) facility and practice 5S (Japanese) Discipline On-time Delivery Competitive pricing Flexibility / Responsiveness Cirtek Electronics Corporation 4/14/2017

Package Design & Development Higher productivity / efficiency Company strengths 4 Full Turnkey Solution  Provide vertically integrated manufacturing solutions to its customers. Package Design & Development Assembly & Packaging Test, Pack & drop ship to end Customers + Higher productivity / efficiency Lower cost Faster time to market Cirtek Electronics Corporation 4/14/2017

Company strengths   5 Growing customer base of diverse clients A growing portfolio of customers. CHPI currently has 42 customers around the world  The Company’s customers are located in various countries, with the bulk of revenues contributed by customers located in Europe and the USA % Contribution to revenues per region USA Europe Asia Cirtek Electronics Corporation 4/14/2017

Company strengths    6 25 Years Proven Track Record Continuous production growth and generating employment.  Financially strong.  Delivering profit and dividend every year. Cirtek Electronics Corporation 4/14/2017

Ability to price products competitively Company strengths 7 A PEZA-registered entity  As a PEZA*-registered entity, the Company enjoys certain incentives like tax holidays, duty free importation of materials and reduced power rate vis-a-vis non-registered entities which enables it to price its products competitively. Tax incentives + Ecozone power rate Ability to price products competitively Entitlement to 5% gross income tax (GIT) incentive. Secure new 4 year income tax holiday (ITH) for new projects Reduction of 12.5% to 13.5% on power cost Company savings * The Philippine Economic Zone Authority (PEZA) is an attached agency to the Department of Trade and Industry tasked to promote investments, extend assistance, register, grant incentives to and facilitate the business operations of investors in export-oriented manufacturing and service facilities located inside selected areas throughout the country Cirtek Electronics Corporation 4/14/2017

Outline Company overview and organization Services and CEC BOM Product Portfolio and Special Capabilities Company strengths Plans and programs Package Technology Roadmap Final Test, Finishing and FAREL Cirtek Electronics Corporation 4/14/2017

Plans and Programs 1 Expansion of Manufacturing facility and Capacity 2 Innovation and Re-Engineering 3 Completion of current projects and programs with customers This will enable us to support 400 Million units of additional new business from existing and potential customers. Sustaining cost reduction program, higher quality product and stable process through automation and re-engineering. To develop new packages through innovation to maximize yield and satisfy or exceed customer expectation. Concluding and enabling Cirtek to realize new potential business in the pipe line worth US$11.8 Million by 2012 and to expand product portfolio. New Potential business: Power MOSFET QFN Open cavity moisture / pressure sensor for automotive Opto Couplers Exposed Cavity Power Amplifier – HSOP Current protection devices Cirtek Electronics Corporation 4/14/2017

Outline Company overview and organization Product offerings, Services and CEC BOM Product Portfolio and Special Capabilities Company strengths Plans and programs Package Technology Roadmap Final Test, Finishing and FAREL Cirtek Electronics Corporation 4/14/2017

Package and Technology Roadmap Package Development Roadmap PCB / LGA / SIP FLAT TO92 SMT-COB STD TO92 FLIP CHIP ASSY 0.5X0.25X0.30 DFN PACKAGE HYBRID ASSY AIR CAVITY QFN / DFN CERAMIC ASSY SMT COL / CLEAR PACKAGE DFN 1.0X0.5X0.48 DFN PACKAGE POWER QFN USING CU CLIP WLCSP 1.2X0.76X0.76 DFN PACKAGE JEDEC STD QFN / DFN METAL CAN LED ASSY SOD323 SOT223 SOT23 TSOC SOT23 SOT143 SOT89 MSOP TO272 OPEN CAVITY SENSOR 16 QSOP SOIC NB SOIC WB SOIC W/ CRYSTAL PDIP SOIC EPAD HSOP / DSO 2005 2007 2009 2011 2013 2014 Cirtek Electronics Corporation 4/14/2017

Package and Technology Roadmap Cost Reduction / Development Roadmap Technology Copper wirebond (90% lower than Au) AuAg wirebond (20% lower than Au) BSOB bonding Ribbon bonding AuSn Eutectic die attach Stacked Die attach Soft solder / Eutectic Die attach Die attach film Low loop profile ( 3% lower Au cost) Auto Clip attach Material Korean Cu wire supplier (21% lower cost) Chinese leadframe supplier (20% lower cost) Brass / steel leadframe (10% lower than Cu) High Density Leadframe (12% productivity improvement) Matrix Leadframe Ultra High Density Leadframe ( High Volume) MGP / automold conversion (14% lower cost) Mold compound selection GE300LC2 (21.8% lower cost) Ag plating thickness reduction (5% lower cost) 2005 2007 2009 2011 2012 2013 Cirtek Electronics Corporation 4/14/2017

Outline Company overview and organization Services and CEC BOM Product Portfolio and Special Capabilities Company strengths Plans and programs Package Technology Roadmap Final Test, Finishing and FAREL Cirtek Electronics Corporation 4/14/2017

Wafer Probe and Final Test Cirtek Electronics Corporation 4/14/2017

Final Test Summary WAFER PROBE CAPABILITIES Wafer Prober EG1034 – 4” and 5” EG2001 – 6” EG2080 – 8” Ink/Inkless less Process ASCII format Cirtek Electronics Corporation 4/14/2017

Final Test Summary TEST CAPABILITIES MULTI BIN/POST TEST MARKING Mixed signal device CREDENCE ASL-1000, EAGLE ETS 500D, LTX Discrete device TESEC 881-TT, FROTHINGHAM CV3000B Linear device KEITHLEY, GENESIS RF / IF device HP RACK & STACK, HP84000 Digital /Asic device FAIRCHILD SENTRY, SIEMENS S725 OPTO relay device TESEC, HIPOT Protection device TESEC, KEITHLEY MULTI BIN/POST TEST MARKING SOT 89, 223 TO92 Cirtek Electronics Corporation 4/14/2017

Final Test Summary TEST / TAPE & REEL CAPABILITIES Integrated test and TNR handlers SRM S248 – SOT SRM XD16 – SOT SRM S12 – SOT VECTOR T20 – SOT QMT 1500 – SOT SRM 248XS – TDFN ASM FT2030 FLEXIPACK – SOIC SRM 244XS – SOIC ISMECA –NX16 – DFN ( 0402) Test handlers (SOIC/PDIP) MCT 3608/5100 MT 8305/8588/8704 AETRIUM 2020 DTS TNR handlers (SOIC) G6 Visdynamics Systemation TO 485 with 3D vision STI 8028 / ST 60 Cirtek Electronics Corporation 4/14/2017

FAREL CAPABILITIES Cirtek Electronics Corporation 4/14/2017

Failure Analysis Capability Internal / external inspection High / low power microscope X-RAY SOFTEX 100 Decapsulation DECAP AS2000 Autoclave NAPCO 8110-TD test chamber Open / short test TEXTRONICS curve tracer 85% / 85oC moisture soak ENVIRO SYSTEM chamber Temperature cycle Polisher / grinder (cross sectioning) SBT–MODEL 900 Cirtek Electronics Corporation 4/14/2017

Reliability Test Capability Die shear MIL STD 883-2013 Bond strength MIL STD 883-2011 Mark permanency test MIL STD 883-2015 3 mins soaking time using IPA @ 30 strokes Solderability test MIL STD 883-2003-7 / JESD22-B102D 8 hrs steam aging @ 100oC Temperature cycle MIL STD 883E-1010.7 /JESD22-104B 10 cycles minimum @ 10 minutes / cycle Low temp @ -65oC (+0, -10oC) High temp @ 150oC (+15oC / -0oC) +150oC (+15,-0oC) Stability bake MIL STD 883-1008.2 6 hrs @ 175oC Cirtek Electronics Corporation 4/14/2017

Reliability Test Capability High temp storage JESD22-A103B 500 hrs min @ 150oC Auto clave JEDEC 22A 102-C 15 PSI for 96 hrs @ 121oC Fine leak MIL STD 750D 1071.6 / Test Condition D 30 secs soaking time @ 125oC Moisture soak IPC / JEDEC J-STD-020C 168 hrs soaking time @ 85% RH / 85oC temp Cirtek Electronics Corporation 4/14/2017

WHY CIRTEK as ASSSEMBLY & TEST SUBCONTRACT PARTNER? QUALITY FIRST MIND SET STABLE COMPANY PROVEN TRACK RECORD GROWING COMPANY FLEXIBLE & RESPONSIVE ↗ Cost competitive ↗Continue to Innovate and re-engineer to add value to production and cost ●Abundance of skilled workers ●Very low turn over rate ●Educated workforce → Philosophy - Long Term Relationship → Strategy – Partnership for Business Growth → World Class Quality -External manufacturing of Customer Cirtek Electronics Corporation 4/14/2017

Cirtek Electronics Corporation 4/14/2017