Dr. Joshua M. Pomeroy*, Dr. H. Grube, Dr. A.C. Perrella # #recently deceased (1) (2) (3) Advanced materials synthesis for spin-based.

Slides:



Advertisements
Similar presentations
Seminarul National de Nanostiinta si Nanotehnologie
Advertisements

Chapter 9 Ignition Systems page 147.
AS ICT. Identify suitable uses of common storage media understand the types of access and access speeds required for each use (e.g. serial/sequential,
Chapter 9 Capacitors.
C. Pronk 1 Core Memory Core memory consist of ferrite cores. Core memory is a form of non-volatile memory. Used
Single Electron Devices Single-electron Transistors
Chapter 15 Capacitance and RC Circuits © Goodheart-Willcox Co., Inc.Permission granted to reproduce for educational use only. Objectives Define capacitance.
Materials Research Science and Engineering Center William H. Butler University of Alabama-Tuscaloosa, DMR Update: January, 27, 2005 Commercialization.
Machine Tools And Devices For Special Technologies Plasma machining Slovak University of Technology Faculty of Material Science and Technology in Trnava.
Magnetoresistance, Giant Magnetoresistance, and You The Future is Now.
Energy Storage Devices. Objective of Lecture Describe the construction of a capacitor and how charge is stored. Introduce several types of capacitors.
Energy-Storage Elements Capacitance and Inductance ELEC 308 Elements of Electrical Engineering Dr. Ron Hayne Images Courtesy of Allan Hambley and Prentice-Hall.
Energy Storage Devices. Capacitors Composed of two conductive plates separated by an insulator (or dielectric). Commonly illustrated as two parallel metal.
Super-capacitors Vs. Capacitors  No conventional dielectric  Two layers of the same substrate, result in the effective separation of charge  Lack of.
Magnetic sensors and logic gates Ling Zhou EE698A.
Single Electron Transistor
Magnetic Storage The smallest region with uniform magnetism is called a “domain” Each bit requires two domains to allow for error identification If two.
1 Motivation: Embracing Quantum Mechanics Feature Size Transistor Density Chip Size Transistors/Chip Clock Frequency Power Dissipation Fab Cost WW IC Revenue.
Submicron structures 26 th January 2004 msc Condensed Matter Physics Photolithography to ~1 μm Used for... Spin injection Flux line dynamics Josephson.
12/3/2004EE 42 fall 2004 lecture 391 Lecture #39: Magnetic memory storage Last lecture: –Dynamic Ram –E 2 memory This lecture: –Future memory technologies.
“RESISTORS”. DEFINITION - It is an electronic component that has the ability to resist and/or oppose the flow of free electrons (current).
Presented by: Manjeet Singh. Secondary Storage Devices Magnetic media Tape Disks Optical Media Compact Discs CD-R, WORM (Write Once, Read Many) CD-RW.
Energy Storage Devices Prepared By : Shingala Nital ( ) Paghdal Radhika ( ) Bopaliya Mamta ( ) Guided By : Prof. Tank.
PH 0101 Unit-5 Lecture-91 Introduction Principle, construction and working of Ultracapacitor Advantage, disadvantage and application PH0101 UNIT-5 LECTURE.
© 2003 Microvision, Inc. All rights reserved. Driving Growth from A Platform: “The Ultimate Display!” MICROVISION October, 2004.
1 Unit 4 Selected Topics. 2 Spintronic devices Hard disk drivesHard disk drives –GMR –Spin valve MRAMMRAM –Pseudo-spin valve –Magnetic tunnel junction.
Marcus Rosales 1.  RAM  Main memory storage device  Semiconductor Memory 2
AN INTRODUCTION TO SPINTRONICS
Magnetoresistive Random Access Memory (MRAM)
STORAGE DEVICES Presentation By: Saurabh Mishra. A data storage device is a device for recording (storing) information (data). CD, Hard Disk and Flash.
The Story of Giant Magnetoresistance (GMR)
The Memristor.
 BY: PAWAN JAISWAL En.no: PARTH SHAH En.no: Guided By: Prof. Ullash Gohil 1 st SEM Computer Engineering UNIVERSAL COLLEGE OF.
Spin Valves: - larger MR values then the AMR-based devices - exchange energy should be large (> 0.2 erg/cm -2 ) - blocking temperature > 300C - effective.
SPINTRONICS …… A QUANTUM LEAP PRESENTED BY: DEEPAK 126/05.
Spintronics. Properties of Electron Electron has three properties. Charge Mass Spin.
By : Reem Hasayen. A storage device is a hardware device capable of storing information. There are two types of storage devices used in computers 1. Primary.
Monday, January 31, 2011 A few more instructive slides related to GMR and GMR sensors.
Introduction to Spintronics
That Natural Attraction Inductance and Magnetic Storage.
AAK Video Production Intro to Camcorders. A camcorder (video CAMera reCORDER) is an electronic device that combines a video camera and a video recorder.
Development of radiation hard Sensors & Cables for the CBM Silicon Tracking System Sudeep Chatterji On behalf of CBM-STS Collaboration GSI Helmholtz Centre.
Submitted To: Presented By : Dr R S Meena Shailendra Kumar Singh Mr Pankaj Shukla C.R. No : 07/126 Final B. Tech. (ECE) University College Of Engineering,
What are the magnetic heterolayers good for Basic components of modern spintronic devices Conventional electronics has ignored the spin of the electron.
Sarvajanik College of Engineering & Tech. Project By: Bhogayata Aastha Chamadiya Bushra Dixit Chaula Tandel Aayushi Guided By: Bhaumik Vaidya.
BY ADITYA RAMAKRISHNAN
Chapter 9 Capacitors. Objectives Describe the basic structure and characteristics of a capacitor Discuss various types of capacitors Analyze series capacitors.
SPINTRONICS Submitted by: K Chinmay Kumar N/09/
Magnetic RAM Magnetoresistive Random Access Memory.
Electronic SENSORS.
TOUCH SCREEN TECHNOLOGY
PROPERTIES OF CAPACITOR
Electric Circuits Fall, 2014
Magnetoresistive Random Access Memory (MRAM)
Multiferroics as Data Storage Elements
WORKSHOP PRACTICE WEEK-3 OBJECTIVE OF LAB-2 To be familiar with the capacitor and the inductor.
Welcome.
Magnetic Data Storage and Nanotechnology
Information Storage and Spintronics 10
Spintronics By C.ANIL KUMAR (07AG1A0411).
MEMS TECHNOLOGY.
The Big 6 Research Model Step 2: Information Seeking Strategies
Presented by: Bc. Roman Hollý
SPINTRONICS DIAS XAVY v ROLL NO:27 EC S3.
Capacitance and RC Circuits
Computer Application Waseem Gulsher
Current and Resistance
Chapter 9 Capacitors.
Photographic Image Formation I
Presentation transcript:

Dr. Joshua M. Pomeroy*, Dr. H. Grube, Dr. A.C. Perrella # #recently deceased (1) (2) (3) Advanced materials synthesis for spin-based electronics (a new process approach to hard drive read heads)

Motivating Objective Electronic device performance can be improved by producing materials with “ideal” properties that are not intrinsic to known materials One strategy is to seek new, “undiscovered” materials with specific properties Alternatively, NIST process constructs combinations of known materials such that the “hybrids” have properties not native to the constituents

Specific Market Opportunity MRS Bulletin 31 p. 375 “Moore’s Law” of Magnetic Recording (hard drives) We want more storage capacity, but physically smaller hard drives Literally EVERY computer sold has a hard drive

Hard drives: Three important pieces 1.Write – Get information onto “paper”OK 2.Retain – “Paper” must last a long timeOK 3.Read – Have to restore the informationChallenges Materials Research Society Bulletin 31 p. 379

Resistance Area product Engineers like resistance to stay the same, even if size (area) changes, therefore, need adjustable RA product Resistance x Area (RA) - resistance property of layered materials For the same layers – ½ area = 2 x Resistance Resistance x Capacitance (RC) speed; large RC = slow ½ A x 2 R = RA A x R = RA

Two “Read” sensors – RA product limitation Low resistance metal based CPP-GMR type sensors (metal/metal/metal layer structures) RA ~ m  m 2 Problem: very small signal! High resistance insulator based MTJ type sensors (metal/insulator/metal layer structures) RA ~ M  m 2 Problem: too slow (RC too big)!

Modified Oxides Magnetic Sensors Industry Need : Continuously variable RA for a single sensor design with useable MR (signal strength). HCIMO  Quality Oxides with variable resistance Ferromagnet Metal Spacer Ferromagnet  All metallic  Low RA product (1-10 mΩ●μm2) GMR RA (Ω  m 2 ) Ferromagnet Insulating Barrier Ferromagnet  Uses insulators  High RA product (10+ Ω●μm 2 ) MTJ

Overview of Method 1.Build the “base” of the electronic device by depositing electrodes and an insulating layer 2.Expose the insulating layer to highly charged ions (Coulomb bombs) – creating small, individual “craters” in the insulator 3.Deposit upper device structure over the irradiated insulator, thereby filling the craters with metal The layer that was initially an insulator becomes a combination of metal and insulator (1) (2) (3) Patent Pending – Application #12/036,729 – licensing opportunities available.

Huge RA product range from one recipe Using conventional strategies, each data point would require the development of a new recipe—a huge expense! All points produced from one recipe

Modified Oxide Read Sensor Performance MR > 20% (good signal) NIST process is compatible with working “read” sensors

Product Development Opportunities Specific market opportunity – NIST process provides variable-RA “read” sensors like those required for high density hard drive sensor packages – requires a “tool” This example also maps to MRAM industry, and other resistance based sensor markets While the ultimate customer is likely a large magnetic storage company, individual process tools are developed and provided by a wide range of smaller companies Patent Application #12/036,729 – licensing opportunities available.