Speedstack New features May Richard Attrill Copyright Polar Instruments 2014

2 New Features Copy / Paste Material Properties option Speedstack includes the option to copy existing material properties and then paste them to other multiple selected materials within the stack up. This provides a method to exchange materials very quickly within the stack – for instance, swapping all prepregs from one type to another. Very powerful, especially useful for high layer count stack ups New features for Speedstack v14.05 (purchasable options) PCB Stack up data exchange using IPC-2581 Rev B IPC-2581 – an efficient single file industry-standard XML data exchange format to be used between designers and manufacturers of printed circuit boards Replaces the multiple Gerber, NC Drill, Net List, Stack Up and Documentation files normally included within a data set that designers send for fabrication and assembly Ucam/Integr8or.job file import Speedstack imports files in Ucamco Job File format from both Ucam and Integr8or Copyright Polar Instruments 2014

3 New Features Copy / Paste Material Properties option New ‘Copy / Paste Material Properties’ options. Copy Material Properties Paste Material Properties Copyright Polar Instruments 2014

4 New Features Step 1: Select existing material and Copy Material Properties Select an existing material, in this case the Prepreg 1080 between layers 1 and 2 Select the Copy Material Properties toolbar option The Prepreg 1080 properties (attributes) are recorded Copyright Polar Instruments 2014

5 New Features Step 2: Select materials and Paste Material Properties Select existing materials, in this example six sheets of prepreg materials (3080 and 1651) between layers 3 and 6 Select the Paste Material Properties toolbar option Copyright Polar Instruments 2014

6 New Features Step 2: Select materials and Paste Material Properties (cont’d) Chose which properties you would like to paste to the selected materials. For this example all Property Groups have been selected. Selecting Apply will update all the selected materials within the stack with the previously recorded material, for this case the Prepreg Copyright Polar Instruments 2014

7 New Features Step 3: Review the stack up Review the stack up changes. When changing multiple materials simultaneously it is important to review the stack up. It may be necessary to recalculate impedance structures especially if dielectric height and copper thickness parameters have changed. Copyright Polar Instruments 2014

8 New Features Drill enhancements – new ‘Laser (Stacked)’ option A new ‘Laser (Stacked)’ option has been introduced that automatically adds stack vias to the stack up in a single operation. Previously, it was necessary to add each via individually. Copyright Polar Instruments 2014

9 New Features Drill enhancements – new ‘Laser (Stacked)’ option (cont’d) The completed stack up with stacked laser vias. Copyright Polar Instruments 2014

10 New Features Drill enhancements – now retains properties The drill properties are now retained between each ‘Add Drill’ operation. This speeds up the process of adding drills, especially when multiple drills of the same type are being added to the stack up. Copyright Polar Instruments 2014

11 New Features Drill enhancements – new ‘Delete All Drills’ option Delete all drills on the stack up in a single operation Copyright Polar Instruments 2014

12 New Features Target thickness – tolerance in percentage or absolute This option has been enhanced to support both percentage and absolute tolerances Copyright Polar Instruments 2014

13 New Features Stack Up Wizard – enhancements when in Material Library mode Stack Up Thickness (with and without solder mask) calculated as soon as materials are chosen from the Material Library. It is now easy to monitor the overall stack up thickness within the Stack Up Wizard option Material selection enhanced. It is now possible to select multiple sheets of Prepreg that will be placed between each Foil / Core within the stack up New symmetrical mode option, enables quick selection of planes and mixed layers Copyright Polar Instruments 2014

14 New Features Stack Up Wizard – enhancements when in Material Library mode This is the 8 layer stack up created by the new wizard Copyright Polar Instruments 2014

15 New Features Library Mode / Virtual Material Mode Library Mode – uses real materials to generate stack ups by referencing the Speedstack material library. This method provides an absolute definition of the stack up down to the exact materials used in the build. Virtual Material Mode – uses ‘virtual’ materials to generate stack ups. This is useful for exploring design options before committing to real materials. Copyright Polar Instruments 2014

16 New Features Symmetry mode – current mode highlight improved Symmetry mode on Symmetry mode off Copyright Polar Instruments 2014

17 New Features Toolbar options and menu entry enhancements Materials are now grouped into rigid / flex / other Rigid Materials Other Materials Flex Materials Copyright Polar Instruments 2014

18 New Features Toolbar options and menu entry enhancements (continued) All stack up editing options now available when Controlled Impedance structures already exist on the stack up ‘Rebuild and Calculate’ option Controlled Impedance tab selected When the Controlled Impedance tab is selected, all stack up editing options are now enabled. Users may now make changes to a stack that has existing structures and then recalculate the structures using the ‘Rebuild and Calculate’ option Copyright Polar Instruments 2014

19 PCB Stack up data exchange using IPC-2581 Pre-layout stack up design IPC-2581 Fabricator final stack up design PCB layout system IPC-2581 Stackup data exchange using IPC-2581 Rev B – workflow

20 PCB Stack up data exchange using IPC-2581 Pre-layout stack up design Pre-layout stack up designs often use ‘Virtual Materials’, where the design engineer specifies copper / substrate thicknesses but not the actual fabrication materials used. Once the stack arrives at the Fabricator these ‘Virtual Materials’ are exchanged for the true materials.

21 PCB Stack up data exchange using IPC-2581 Pre-layout stack up design The finished copper thickness and final substrate heights are critical for impedance calculations. A single dielectric substrate region could be constructed from multiple materials in order to manufacture the required height.

22 PCB Stack up data exchange using IPC-2581 Export stack up to IPC-2581 format The completed stack is exported to IPC-2581 for import into other PCB design tools IPC-2581

23 PCB Stack up data exchange using IPC-2581 Fabricator final stack up design – exchange Virtual Materials On receipt of the stack, the fabricator exchanges the ‘Virtual Materials’ for real PCB materials.

24 PCB Stack up data exchange using IPC-2581 Fabricator final stack up design – final checks Stack up is checked to ensure that the final fabrication stack up still meets the required design specification.

25 PCB Stack up data exchange using IPC-2581 Export final fabrication stack up to IPC-2581 format It is often useful to pass the final fabrication stack “back up the chain” so that future designs can make use of accurate fabrication data. IPC-2581

Thank you Copyright Polar Instruments 2014

For more information: Contact Polar now: Phone USA / Canada / Mexico Ken Taylor ( 503) Ken Taylor Asia / Pacific Terence ChewTerence Chew UK / Europe Neil Chamberlain Neil Chamberlain Germany / Austria / Switzerland Hermann Reischer Hermann Reischer Copyright Polar Instruments 2014