10 December 2012 Clive Max Maxfield All Programmable FPGAs, SoCs, and 3D ICs Part V. Advanced Concepts and Future Trends 1

Programmable Analog 2

3

High-Speed Serial Interconnect 4

Clock Recovery 5

8-bit/10-bit (8b/10b) Encoding 6

Pre-Emphasis and Equalization 7

Additional Considerations Multiple Standards Fibre Channel InfiniBand PCI Express (PCIe) RapidIO SkyRail 10 Gigabit Ethernet JESD204B etc. Increasing Speeds 3.xxx Gbps 6.xxx Gbps 10.xxx Gbps 28.xxx Gbps (28nm) 40.xxx Gbps (20nm) 56.xxx Gbps (14nm) Optical (10nm) 8

Before 3D ICs 9

Before 3D ICs (cont.) 10

Before 3D ICs (cont.) 11

Early 3D ICs 12

Early 3D ICs (cont.) 13

Dice on SIP Substrate 14

Dice on Silicon Interposer 15

Die on Die 16

A Brave New World 17

State-of-the-Art Today Homogeneous 18

State-of-the-Art Today (cont.) Heterogeneous 19

Rad-Hard, Rad-Tolerant What exactly is radiation? Ionizing versus non-ionizing Particles (α, β, Protons, Neutrons, Heavy Ions) Rays (X-Rays, Gamma Rays, Cosmic Rays…) 20

Rad-Hard, Rad-Tolerant Where can effects occur On-chip registers and SRAM memory cells On-chip combinatorial logic On-chip clock buffers On-chip configuration cells Off-chip general-purpose memory Off-chip configuration memory 21

Rad-Hard, Rad-Tolerant Common radiation-induced problems SEE/SEP (Single Event Effects/Phenomenon) SEL (Single Event Latchup) SEU (Single Event Upset) SET (Single Event Transient) SEFI (Single Event Functional Interrupt) Speed degradation 22

Rad-Hard, Rad-Tolerant Mitigation Strategies Silicon-level (trenches, epitaxial layer) LPT (latchup protection technology) circuit Using special configuration cells TMR (triple modular redundancy) Delaying combinatorial signals Designing fail-safe state machines Lock-step dual processor architectures Design to accommodate speed degradation 23

More Information / Further Reading 24