Project: IEEE 802.15 Working Group for Wireless Personal Area Networks (WPANs) Submission Title: [Response to the No Comments Involving Time To Market.

Slides:



Advertisements
Similar presentations
September 2004 doc.: IEEE Submission Slide 1 Jack Pardee, INNOV8RS, LLC Project: IEEE Working Group for Wireless Personal Area Networks.
Advertisements

Sept 2002 Project: IEEE P Working Group for Wireless Personal Area Networks (WPANs) Submission Title: [Task Group 4 Low Rate WPANS Closing Report]
Submission Title: [Add name of submission]
May 2000 doc.: IEEE /109r0 May 2000 Project: IEEE P Working Group for Wireless Personal Area Networks (WPANs) Submission Title: WPAN Requirements.
Name - WirelessHD doc.: IEEE g July 2010
June 2006 Project: IEEE P Working Group for Wireless Personal Area Networks (WPANs) Submission Title: [Proposed Scenarios for Usage Model Document.
March 2018 Project: IEEE P Working Group for Wireless Personal Area Networks (WPANs) Submission Title: [IG LPWA Agenda November 2017 Plenary] Date.
Submission Title: [MC EventsList] Date Submitted: [11Jul00]
doc.: IEEE <doc#>
doc.: IEEE <doc#>
<month year> doc.: IEEE <030158r0> March 2004
July 2005 Project: IEEE P Working Group for Wireless Personal Area Networks (WPANs) Submission Title: [FCC-UWB-certifications-below-1-GHz] Date Submitted:
doc.: IEEE <doc#>
September 2008 Project: IEEE P Working Group for Wireless Personal Area Networks (WPANs) Submission Title: [TG5 Closing Report] Date Submitted:
Project: IEEE Wireless Personal Area Networks (WPANs)
March 2008 Project: IEEE P Working Group for Wireless Personal Area Networks (WPANs) Submission Title: [Toumaz response to TG6 Call for Applications]
<month year> doc.: IEEE < e>
doc.: IEEE <doc#>
January 2007 Project: IEEE P Working Group for Wireless Personal Area Networks (WPANs) Submission Title: [TG3c Technical Requirement sub-group report]
<month year> doc.: IEEE <xyz> January 2001
平成31年1月 doc.: IEEE /424r1 July 2007 Project: IEEE P Working Group for Wireless Personal Area Networks (WPANs) Submission Title: [TG3c motion.
August, 2008 Project: IEEE P Working Group for Wireless Personal Area Networks (WPANs) Submission Title: [Enhancing reliability of data transmission.
Submission Title: [Proposal to split the TG3a into two]
November 2007 Project: IEEE P Working Group for Wireless Personal Area Networks (WPANs) Submission Title: [TG4c Project Plan] Date Submitted: [15.
Sept 2004 doc.: IEEE b Sept 2004 Project: IEEE P Working Group for Wireless Personal Area Networks (WPANs) Submission Title:
Submission Title: TGe Liaison Repor
Submission Title: [Proposal to split the TG3a into two]
Submission Title: [TG3a Closing Report September 2005]
<month year> doc.: IEEE <xyz> November 2000
<month year> November, 2004
doc.: IEEE <doc#>
doc.: IEEE <doc#>
doc.: IEEE /XXXr0 Sep 19, 2007 June 2009
Submission Title: [Frame and packet structure in ]
November 2006 Project: IEEE P Working Group for Wireless Personal Area Networks (WPANs) Submission Title: [Simplified geometry for the usage model.
<month year>20 Jan 2006
<month year> doc.: IEEE <030158r0> January 2004
doc.: IEEE <doc#>
Sept 2004 doc.: IEEE a Nov 2004 Project: IEEE P Working Group for Wireless Personal Area Networks (WPANs) Submission Title:
May 2006 Project: IEEE P Working Group for Wireless Personal Area Networks (WPANs) Submission Title: [TG3c Technical Requirement sub-group report]
<month year> doc.: IEEE < e>
<month year> <doc.: IEEE doc> January 2016
May 2016 Project: IEEE P Working Group for Wireless Personal Area Networks (WPANs) Submission Title: [Timeline of TG4s] Date Submitted: [19 May 2016]
doc.: IEEE <doc#1>
March 2019 Project: IEEE P Working Group for Wireless Personal Area Networks (WPANs) Submission Title: [DF6 Radio-burst length over PSDU size] Date.
Submission Title: [Proposed Resolution for FSK/GFSK Prior Comments]
doc.: IEEE <doc#>
doc.: IEEE <doc#>
10 May 2000 Project: IEEE P Working Group for Wireless Personal Area Networks (WPANs) Submission Title: [Open Issues with the TG3 Criteria Document]
July 2010 <month year> doc.: IEEE g Doc.: IEEE g
March 2017 Project: IEEE P Working Group for Wireless Personal Area Networks (WPANs) Submission Title: [Timeline of TG4s] Date Submitted: [16 March.
<month year> doc.: IEEE <030158r0> <March 2003>
Submission Title: [LB 28 Results] Date Submitted: [14 March 2005]
January 2008 Project: IEEE P Working Group for Wireless Personal Area Networks (WPANs) Submission Title: [TG3c Project Plan] Date Submitted: [17.
January 2000 Project: IEEE P Working Group for Wireless Personal Area Networks (WPANs) Submission Title: [Study Group Summary and Motion for .15WG.
November 2007 Project: IEEE P Working Group for Wireless Personal Area Networks (WPANs) Submission Title: [TG3c Project Plan] Date Submitted: [15.
Mar 2008 Project: IEEE P Working Group for Wireless Personal Area Networks (WPANs) Submission Title: [Resolution for Comment 70 ] Date Submitted:
Mar 2008 Project: IEEE P Working Group for Wireless Personal Area Networks (WPANs) Submission Title: [Resolution for Comment 70 ] Date Submitted:
November 2007 Project: IEEE P Working Group for Wireless Personal Area Networks (WPANs) Submission Title: [TG4c Project Plan] Date Submitted: [15.
Nov Project: IEEE P Working Group for Wireless Personal Area Networks (WPANs) Submission Title: [Report on IEEE PAC Draft Status]
August, 2008 Project: IEEE P Working Group for Wireless Personal Area Networks (WPANs) Submission Title: [Improve the latency between GTS request.
September 2015 Project: IEEE P Working Group for Wireless Personal Area Networks (WPANs) Submission Title: [Timeline of TG4s] Date Submitted: [17.
July 2003 doc.: IEEE <03/242> July 2003
Jul 12, /12/10 Project: IEEE P Working Group for Wireless Personal Area Networks (WPANs) Submission Title: Dependable Interest Group Closing.
Submission Title: TG9ma Agenda for September Meeting
August 2019 Project: IEEE P Working Group for Wireless Personal Area Networks (WPANs) Submission Title: CID 422 Proposal Date Submitted: 14 August,
August 2019 Project: IEEE P Working Group for Wireless Personal Area Networks (WPANs) Submission Title: MLME-SOUNDING and MLME-CALIBRATE comment.
August 2019 Project: IEEE P Working Group for Wireless Personal Area Networks (WPANs) Submission Title: MLME-SOUNDING and MLME-CALIBRATE comment.
Submission Title: [TG3a Compromise Direction]
12/15/2019 Project: IEEE P Working Group for Wireless Personal Area Networks (WPANs) Submission Title: [AWGN Simulation Results] Date Submitted:
Presentation transcript:

Project: IEEE 802.15 Working Group for Wireless Personal Area Networks (WPANs) Submission Title: [Response to the No Comments Involving Time To Market Issues] Date Submitted: [14Sept2004] Source: [Jack Pardee] Company [Innov8rs, LLC] Address [9135 W. Manitoba St. #2, Milwaukee, WI, USA] Voice:[+1 414-364-6688], FAX: [], E-Mail:[Jack.Pardee@ieee.org] Re: [15-04-0377-11-003a-consolidation-explanations-no-vote-confirmation.doc] Abstract: [Response to 802.15.3a No Vote Comments] Purpose: [Explain rationale for how one or more no votes for confirmation of DS-UWB merger #2 proposal have been addressed by the merger #2 comment resolution team.] Notice: This document has been prepared to assist the IEEE 802.15. It is offered as a basis for discussion and is not binding on the contributing individual(s) or organization(s). The material in this document is subject to change in form and content after further study. The contributor(s) reserve(s) the right to add, amend or withdraw material contained herein. Release: The contributor acknowledges and accepts that this contribution becomes the property of IEEE and may be made publicly available by 802.15.

Time To Market - Representative Issues Time to market for DS-UWB proposal Currency of proposed specification for standardization vis-à-vis the silicon chips in DS-UWB products presently being shipped

Representative TTM Comments #3 - It is not clear what the time to market for this proposal is. #55 - I would consider changing my "NO" vote for merged proposal #2 to a "YES" vote if:There is a better explanation of the time-to-market considerations. #84 - I also have concern for power and time to market. Lack of data for these items as still missing

Representative TTM Comments #29 - Time to market Merge proposal #2 has repeatedly claimed time to market advantages because of "silicon shipping today". I have heard these claims for almost 2 years now repeated over and over again but there is no evidence that this is true. Since this proposal has changed as recently as last meeting, I am worried about time-to-market with this proposal because there is so much work to do and they are so far behind the dozens of vendors already building silicon and end products based on the MBOA proposal. Additionally, in the IEEE meetings the presenters or merged proposal #2 have repeatedly made contradictory statements about whether or not the proposal they are presenting represents the silicon they claim is commercially available. … For me to change my no vote to yes would require seeing working silicon that implements the proposal as I fear there is significant time to market concerns for merge proposal #2. In addition, I would require that credibility of their claims be re-established since there are so many inconsistencies in their past claims.

Representative TTM Comments #73 - Merge proposal #2 claims time to market advantage of silicon that is supposedly available in the market as generation 3; however, merge proposal #2 has recently drastically changed and the silicon does not represent the proposal before us; does not meet performance requirements as specified by the selection criteria, including power consumption.

Representative TTM Comments #152 - Merge proposal #2 claims time to market advantage of silicon that is supposedly available in the market as generation 3; however, merge proposal #2 has recently drastically changed and the silicon does not represent the proposal before us; does not meet performance requirements as specified by the selection criteria, including power consumption.

Representative TTM Comments #200 - Freescale has not addressed the questions raised regarding time to market issues with their proposal. The proposal has changed significantly several times, and yet they have continued to say they have ICs ready to ship with each version of their proposal. This is not a realistic statement.

Representative TTM Comments #253 - Time to Market - There is too much confusion in the argumentation about DS-UWB products. The arguments since 2003 are that "the silicon is already here, the production has started". However many changes have occurred since that time in Proposal#2, and the way the current silicon reflects or will reflect that (technical changes, interoperability, worldwide regulation) is very unclear to me (gate count, power consumption etc.).