Subcontracting of electronics modules

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Presentation transcript:

Subcontracting of electronics modules TE-MPE-EM Subcontracting of electronics modules Betty Magnin / 26.09.17 13th ILO meeting

Summary Mandate Structure and ressources Volume of activity Outsourcing and quality management How can you help?

Mandate To provide a CERN-wide support for The layout The production The assembly In the domain of Printed Board Assemblies

Structure Final user Design Components suppliers PCB procurement Planning Coordination Design PCB procurement Components suppliers Subcontracting team Mechanical subcontractors via EN-MME Harness subcontractors Outsourced assembly of electronics modules

Ressources The team: 19 persons Uptodate equipments 26.10.2016 1 team leader 8 technicians for the design of std and special PCBs 2 technicians specialized in CAD libraries 3 technicians specialized in production processes, dedicated to design reviews, subcontractors validation and follow-up 3 technicians specialized in PCB assembly and special repair 2 technical assistants for ordering components and assembly Uptodate equipments CAD stations (CADENCE and Altium) CAD to CAM software (Aegis) Solder paste printing (Mydata) Automatic SMD placement (Mydata) Reflow soldering (vapor phase) Cleaning SMD component repair and replacement Inspection 26.10.2016

Typical examples of layout and production Batch of 70 boards 230*220mm 2-sided, PTH, BGA, QFN, 0402 1325 components 5500 solder joints 26.10.2016

Typical examples of layout and production Crate with 2 PCB cables, mechanical parts 26.10.2016

Volume of activity A yearly average of Forecasts show an increase 800 new designs or design changes 400 PCB manufacturing batches (250 outsourced) 400 PCB assembly batches (250 outsourced) Forecasts show an increase 26.10.2016

A CERN-wide service

Outsourcing Internal facilities are dedicated to prototypes The rest is outsourced Volumes generally from 15 to 250 pcs, some up to 1500 pcs Single shot, no repetitive production Each project is split into PCB procurement, components kitting, assembly subcontracting in order to Keep control Reduce lead time Components purchased through official distributors 3-year contracts with 2 PCB manufacturers Limited number of contractors for PCB assembly 26.10.2016

PCB procurement From 01.01.2016 to 31.12.2016 DAI issued: 247 Total cost: 624’835.- CHF DAI < 5'000.-CHF: 229 DAI > 5'000.- and <10'000.-CHF: 11 DAI > 10'000.-CHF: 7 Most expensive DAI: 33'000.- CHF Average cost per DAI: 2'530.- CHF

Assembly procurement From 01.01.2016 to 31.12.2016 DAI issued: 242 Total cost: 786'114.- CHF DAI < 5'000.-CHF: 216 DAI > 5'000.-<10'000.-CHF: 19 DAI > 10'000.-CHF: 7 Most expensive DAI: 77'346.- CHF Average cost per DAI: 3'248.- CHF

PCB manufacturing One of the most expensive parts of an assembly A defective PCB may jeopardize a whole assembly Defects in PCB may be hidden and involve reliability problems The PCB must withstand the assembly process (RoHS) and CERN safety rules (halogen-free) As compared to components from the shelf, each PCB is a new product made in a small quantity! 26.10.2016

Purchasing of PCB It is important to have trusty suppliers who have the whole process under control. 2 suppliers give some flexibility and help for load balancing The cost of a PCB can easily be determined with a pricing model, based on batch size, lead time and technical parameters: size, layout count, holes, track width,..

How do we select a PCB manufacturer General requirements ISO 9001:2015 certified company Production shall be done in CERN Member States All process steps shall be done in-house, no subcontracting allowed Halogen free base material shall be used  IS41, CERN standard Acceptance of the PCB shall be compliant with IPC-A-600 standards Controlled impedances Finished holes diameter: down to 0.2 mm, aspect ratio to 8:1 Blind and buried via holes according to IPC-DR-572 Surface finishing: electroplated Au, Ni/Au electroless Raphaël Berberat

2 contracts with PCB suppliers Purchasing of PCB 2 contracts with PCB suppliers MS sent early 2014 to 89 firms, 23 replied 17 selected on the basis of their replies to the questionnaire 7 short listed after a technical audit (with the support of EP-DT, Rui de Oliveira) IT sent to 7 firms based on a representative panel of PCB a pricing table was part of the deliverable (to garantee that the costs of the future orders will comply with those announced for the IT). 2 contracts established in July 2014 for 3 years and 370k€ each, extended to 750kCHF in 2016. A new MS is in progress to set up new contracts by early 2018

And for electronic assemblies?

Electronic assembly procurement strategy 3 categories of assemblies Simple: through hole components, low density Intermediate: Through hole and simple SMD components Complex: BGA, QFN, LGA Each category has its assembly requirements, leading to different installed processes A firm equipped for complex boards will not be competitive for simple ones Urgent projects often require proximity with the firm An open contract requires a pricing model to guarantee the best cost at any time for any project. For assembly, a price model is not easy to establish

Purchasing of assemblies A survey of the market is regularly done with inputs from ILO’s, previous professional experience, other CERN groups, Purchasing Office, exhibitions at CERN or in dedicated fairs, adverts in specialised newspapers and websites Firms looking as adapted to our requirements are highlighted A first quote is requested to verify if their price is acceptable as compared to those from usual suppliers The firm is then audited to verify on-site their technical capabilities A limited panel of firms is qualified to fulfill our purchasing planning. All large orders are discussed with Purchasing Office before inititiating the DO

Purchasing of assemblies 9 firms audited in 2016: 5 validated for series: 2 in UK, 2 in NO, 1 in PT 1 in PT to be further examined 3 did not have the required competences

Purchasing of assemblies Selection Matrix

Purchasing of assemblies The objective is to place large orders to unbalanced countries PO by member state over the period 2013 – 2016

How do we select a supplier General requirements ISO 9001:2015 certified company Production shall be done in CERN member states All steps of process shall be done in-house, no subcontracting allowed Acceptance of the electronic assemblies shall be compliant with IPC-A-610 standard, class 3 Class 1 -- General Electronic Products Includes products suitable for applications where the major requirement is function of the completed assembly. Class 2 -- Dedicated Service Electronic Products Includes products where continued performance and extended life is required, and for which uninterrupted service is desired but not critical. Typically the end-use environment would not cause failures. Class 3 -- High Performance Electronic Products Includes products where continued high performance or performance-on-demand is critical, equipment downtime cannot be tolerated, end-use environment may be uncommonly harsh, and the equipment must function when required, such as life support or other critical systems. Industrial cleaning equipment in house Vapor phase oven may be an advantage

How can you help?

How can you help? The world of electronics production, both PCB and assembly, is moving fast. Word of mouth is not the most efficient way to survey the market, even if usefull. We cannot only count on our previous professional experience, or Purchasing Office information or adverts in specialised newspapers and websites We need your support

How can you help? When you organize exhibitions at CERN With your input about firms able to fit to our requirements. When you organize for us visits to such firms.

How can you help? A 30’ presentation cannot go into all details We are open to receive you at our lab to deeper discuss all technical constraints of our activities.

Questions?