EuCARD Status: September 2010

Activities of AIT Manufacturing of Cu-Dia composite plates with 150 mm x 150 mm using direct heated hot pressing method for further characterisation Machining of samples for mechanical testing, CTE measurement and thermal diffusivity by water jet cutting Thermal Diffusivity Analysis at room temperature (total 40 samples) Testing of mechanical properties at high temperature (done at University of Vienna) Design and manufacturing of graphite die for direct bonding experiment of SiC on copper-diamond composite (in progress) First evaluation of Mo-diamond composites (in progress)

Manufacturing of Cu-diamond composite Manufacturing of Cu-diamond plates with 60 vol.% Water jet cutting of samples for: Thermal Diffusivity CTE Mechanical Testing Measurement of mechanical properties at high temperature Samples have been forwarded to CERN for further distribution of samples Measurement of RT thermal diffusivity of 40 samples: 218 +/- 18 mm²/s Measurement of CTE on 5 samples: CTE ~6 ppm/K at 100°C. 150 mm x 150 mm

Resonant Beam Technique Resonant Beam Technique, European Standard EN 15335:2007 Advanced technical ceramics - ceramic composites - elastic properties by resonant beam method up to 2000 °C and Fine ceramics (advanced ceramics, advanced technical ceramics) – test method for elastic moduli of monolithic ceramics at room temperature by sonic resonance, International Standard ISO 17561:2002. Sample Size: 45x4x3 mm3

Set-up for Resonant Beam Test

Mechanical Properties Mechanical Properties @ RT   Temperature E Error G RHP_334-02 M-1 26 238 8 230 114 M-2 25 214 6 212 104 M-3 205 7 198 96,4 Mean-Value 219 213 105

Young´s Modulus and Shear Modulus

First experiments with Mo-Diamond First experiments with Mo-Diamond composites did not result in promising results (poor densification; high required consolidation temperature cause degradation of diamonds – even when using rapid consolidation First experiments with Mo-Cu-Diamond, but full densification was not achieved up to now (<90%). This resulted in low thermal conductivities (<100 W/mK).

Next steps Further experiments with Mo-Cu-Diamond => increasing of Cu content Direct bonding of SiC during hot pressing of metal-diamond material