MicroTCA.0 to MicroTCA.4: A standard and it's evolution

xTCA Specification landscape Defense Industrial, Test & Measurement, Transportation Telecom Data Center AdvancedTCA Including dot-specifications PICMG 3.1 – 3.6 MicroTCA MTCA.1 Air Cooled Rugged MicroTCA ATCA 300 MTCA.3 Hardened Conduction Cooled MicroTCA Abandoned MTCA.4 Enhancements for Rear I/O and Precision Timing MTCA.2 * Hardened Air Cooled MicroTCA xTCA for Physics* ATCA Extensions * standardized Zone 3 connector Timeline * Work in process

Advanced Mezzanine Card the base for MicroTCA Carrier Blade in an AdvancedTCA chassis AdvancedMC Modules Carrier Blade The AdvancedMC Modules are defined as Mezzanine Cards for the use on special AdvancedTCA Blades, called AdvancedMC Carrier, within the AdvancedTCA System.

MicroTCA (MTCA.0) „Micro Telecommunications Computing Architecture Base Specification“ AdvancedMC in MicroTCA Systems AdvancedMC Modules MicroTCA Subrack The Advanced Mezzanine Card is plugged directly into the MicroTCA Subrack or System. The AdvancedMC is converting from a hook-on module to a functional board

MicroTCA = standalone solution of AdvancedMC New standard platform Backplane directly accepts AdvancedMC modules AdvancedMC interchangeable between AdvancedTCA and MicroTCA Subracks fits into 300mm deep ETSI racks No rear I/O, power input and all moduls will be inserted from the front side New dimensions (not 3U / 6U anymore), card depth 180mm (instead of 160 / 220 / 280 mm)

AdvancedMC Module dimensions 6 different Module sizes: „Height“: Compact, Mid-size, Full-size „Width“: Single and Double Mid-size = 4 HP Single = 73.8 mm Double = 148.8 mm Compact = 3 HP Full-size = 6 HP

Management: List of standards MicroTCA Specification AdvancedMC Specification AdvancedTCA Specification IPMI Specification I2C-bus Specification

Physical Management Controllers MCMC MicroTCA Carrier Management Controller Resides on the MCH MMC Module Management Controller Resides on the AdvancesMC Module EMMC Enhanced Module Management Controller Resides on the PMs and CUs MicroTCA Shelf MicroTCA Carrier MCH MCMC Backplane MMC MMC MMC EMMC EMMC AMC 1 AMC 2 AMC 12 Cooling Unit Power Module

Management Buses IPMB-L Connects the MCMC on the MCH to the MMC on the AdcanvecMC Modules Radial architecture IPMB-0 Connects the MCMC on the MCH to the EMMC on the PM and CU Bused architecture I2C-bus Connects the MCMC on the MCH to the Carrier FRU EEPROM on the backplane MicroTCA Shelf MicroTCA Carrier MCH MCMC IPMB-L I2C-bus IPMB-0 Backplane Carrier-FRU SEEPROM MMC MMC MMC EMMC EMMC AMC 1 AMC 2 AMC 12 Cooling Unit Power Module

MicroTCA Management Structure Shelf Manager System Manager Carrier Manager Resides on the MCH Enables power to the AdvancedMCs via the PM E-keying Shelf Manager Resides either on the MCH or external to the shelf Maintains SEL (System Event Log) Fan control System Manager Highest level management function Manages one or more MicroTCA Systems Each FRU’s (Field Replaceable Unit) equipped with a management controller All FRU’s connected via IPMI (Intelligent Platform Management Interface) MicroTCA Carrier MCH Carrier Manager MCMC IPMB-L I2C-bus IPMB-0 Backplane Carrier-FRU SEEPROM MMC MMC MMC EMMC EMMC AMC 1 AMC 2 AMC 12 Cooling Unit Power Module

MicroTCA Power Module (PM) and Cooling Unit (CU) The MTCA Power Module is involved into the Carrier Management Enables Management and Payload power to each slot individually Decision for enabling / disabling power is done by the MCH (Carrier Manager) The MTCA Cooling Unit is controlled by the MCH (Shelf Manager) too Sets different fan speed levels on the request of the MCH (AMC: temperature event -> MCH -> MCH command to CU to increase fan speed) Cooling Unit Power Module

♥ Powering up a MicroTCA Shelf ♥ Autonomous mode Booting Operational CU ♥ ♥ MP PP Pres. IPMB-0 Enable IPMB-0 Booting Operational Autonomous mode Booting Operational MCH PM -48V X

♥ Powering up a MicroTCA Shelf ♥ Operational CU FRU-ID FRU-ID AMC MP PP Pres. IPMB-0 IPMB-L Enable IPMB-0 Operational Operational MMC operational Operational MCH PM -48V X

MicroTCA Connector and Backplane Data transport is based on switched fabrics (serial data transfer) Connector: 170 pin Card Edge Component side 1 is left!! Supported protocols: GbE, 10GbE, SRIO, PCIe, S-ATA, SAS

“low cost” MicroTCA Chassis with direct interconnects Backplane Topologies (Connection Schemes) MicroTCA Specification defines a Star and a Dual Star Backplane, other topologies often requested by customers Examples “low cost” MicroTCA Chassis with direct interconnects Dual star MicroTCA Chassis with direct interconnects on port 2 &3 and in the fat pipe

MicroTCA Backplane Technology Aggregated Bandwidth per link: 4 * data rate per lane Near Future “speeds” per lane PCIe II 5,0 Gbps, PCIe III 8,0 Gbps 10GigE 10Gbps (IEEE802.3ap, -KR) SRIO  5 - 6Gbps Bandwidth: shall support up to 12,5Gbps, today’s “speeds” per lane PCIe I 2,5Gbps GbE 1,25Gbps (“-KX”) 10GigE 3,125Gbps (“-KX4”) SRIO 1,25; 2,5 & 3,125Gbps

MicroTCA Carrier Hub (MCH) Tongue 1: Common Options interface, IPMB connections Tongue 2: Common Options, Clocks Tongue 3, 4: Fat Pipe and Extented Fat Pipe connections

Thermal requirements for a MicroTCA System Different Power losses defined: MTCA.0 R1.0  Single Compact = 20 W Double Compact = 40 W Single Full-size = 40 W Double Full-size = 80 W AMC.0 R2.0  Single Compact = 24 W Double Compact = 48 W Single Mid-size = 30 W Double Mid-size = 60 W Single Full-size = 48 W Double Full-size = 80 W The maximum ambient temperature is defined at 55°C The allowed temperature increase within a slot is ΔT = 10 Kelvin One slot can be a several AMC modules in a row (1) + (2) + (3) = one slot Double FS + Single FS + Single FS 80 W + 48 W + 48 W = 176 W 3 2 1

Rugged MicroTCA The Rugged Micro Telecommunications Computing Architecture specifications define the requirements for a System that meets more stringent levels and cycles of temperature, shock, vibration, and humidity than those defined in MicroTCA.0. MTCA.1 (Air Cooled Rugged MicroTCA): this first sub-specification of MicroTCA describes rugged air-cooled systems for industrial applications. MTCA.2 (Hardened Air Cooled MicroTCA): the second sub-specification of MicroTCA; it describes rugged air-cooled systems for military applications. MTCA.3 (Hardened Conduction Cooled MicroTCA): the third sub-specification of MicroTCA; it describes rugged conduction-cooled systems for military applications

MTCA.1 Shock & Vibration requirements Specification MicroTCA.0 0.5g 7g IEC 61587-1 DL1 MicroTCA.1 3g sinusodial 8g random 25g IEC 61587-1 DL3 ANSI/VITA 47 V2 Thermal requirements : 3 different Levels: Ambient (MicroTCA.0) and 2 Extended Temperature ranges XT1 & XT1L MicroTCA.0: - 5°C to + 55°C XT1L: - 40°C to + 55°C XT1: - 40°C to + 70°C Additional requirements: Drop test, RoHS, Acoustic, Surface temperature are defined as application specific For other requirements like Earthquake, Flammability, Atmospheric, Module insertion cycles, ESD, EMC, Safety MTCA.1 refers to the MTCA.0 base specification

additional retention screw front panel with flange Solution AdvancedMC front panel has to be fastened (screwed) to the subrack additional retention screw front panel with flange MTCA.1 front panel ( XR2 ) AdvancedMC.0 front panel

Issues using a normal screw Face plate deflection When the Rugged MicroTCA Module is screwed to the subrack… F … the face plate will be deflected… … and the force will be applied to the connector. The module bare board and the connector bottom side will be stressed. F Conclusion: A locking method is needed, that fixes the module in the chassis in position without applying force into direction of the connector. F

Solution Gap 0.0 mm Maximum gap ( 1.60 mm )* Collet Welded sleeve MTCA chassis Front panel flange Sleeve welded onto front panel 1.60 Collet Welded sleeve * Based on 185,85 subrack depth Screw M3

MicroTCA Evolution (Rugged MicroTCA) MicroTCA.2 (work in process) - Hardened air Cooled MicroTCA For Telecommunication outdoor and military air, land and sea applications Clamshell System similar to MicroTCA.3, similar shock & vibration demands Conduction Cooling, Heat path: From the hot spots though thermal paste to clamshell and through Card-LOK to the chassis Wedge-LOK is blocking the air flow Special retainer solution is needed allowing forced air flow through heat sinks

MTCA.3 Hardened Conduction Cooled MicroTCA Specification approved Febr 2011 For Telecommunication outdoor and military air, land and sea applications 5 ruggedization levels with up to 15g vibration and up to 40g shock Standard AMC board in a clamshell it hardens the Boards protects the active circuits of the PCB from ESD damage, supports Two Level Maintenance / 15KV ESD Protection provides a thermal conduction path to the Thermal Interface Surfaces of the Chassis Sidewall

MTCA.3 (Hardened Conduction Cooled MicroTCA) Demands other kind of chassis The chassis must have slots to hold the boards with wedge-loks The chassis must be able to emit the heat to the surrounding air

Karlsruher Tritium Neutrino experiment KATRIN MicroTCA.4 - Enhancements for Rear I/O and Precision Timing The advanced Physics community has made the decision to use AdvancedTCA and MicroTCA in their next generation of systems Today their platform is VME Main Reason for the change: Remote management, failure detection of FRU’s (fans, PSU’s, Blades) The AdvancedTCA & MicroTCA Specification need some adoption to fit the needs of the community This was the reason for starting the working group “xTCA for Physics” inside the PICMG The Large Hadron Collider, Cern Karlsruher Tritium Neutrino experiment KATRIN

MicroTCA.4 Why are enhancements needed to the existing MicroTCA specification? No Rear Transition Module (RTM) for MicroTCA defined Physics applications typically require a large number of I/O cables. It makes sense to connect them to the rear of the chassis. Special clock and trigger topology MicroTCA.0 specifies 3 Clocks and AMC.0 R2.0 specifies 4 Telecom and 1 Fabric Clock on the AMC Module. Physics / measurement applications typically need additional Clocks and Triggers

MicroTCA.4 AMC µRTM Requirements for mechanics and sizes AMC Module size: Double Mid-size Allows for the max number of 12 AMCs in a 19” wide shelf Large µRTM real estate µRTM size approximately the size of the AMC (doubles depth of existing MicroTCA chassis) Use front panel mechanics based on Rugged MicroTCA Use Rugged MicroTCA retention device Reuse existing AMC front panels for the µRTM Optional zone 3 backplane

Features of a MicroTCA shelf with RTM, side view xTCA for Physics Features of a MicroTCA shelf with RTM, side view Rear 3-pair ZD connector (2 x 30 diff. pairs) Safety keying, 8 positions Retention device (defined in Rugged MicroTCA spec.) µRTM handle, is at the top of the µRTM (µRTM front panel appears up side down) Space for mounting mezzanine boards Could be used for clock and trigger distribution AMC µRTM AMC card edge connector Front

MicroTCA.4 Management extensions required for Physics I2C-bus Connects the AMC to the µRTM The µRTM is treated as managed FRU of the AMC µRTM fans can be independently managed MCMC MMC IPMB-L AMC 2 AMC 12 Power Module Cooling Unit MCH MicroTCA Shelf Backplane MicroTCA Carrier IPMB-0 EMMC µRTM 1 AMC 1 µRTM 2 µRTM 12 µRTM Cooling I2C-bus

Differences MTCA.0 / MTCA.4 backplane topology Direct S-ATA slot interconnects (used in most MTCA.0 systems too) Special slot to slot interconnects (star & daisy chain routing) on user defined ports 12 to 15 Parallel bus structure on user defined ports 17 to 20 Backplane Topology, 23005-463 12Slot Dual Star Common Options MCH1 Fabric [A] to AMC Port 0 Common Options MCH2 Fabric [A] to AMC Port 1 AMC Port 2 AMC Port 3 Fat Pipe MCH1 Fabric [D:G] to AMC Port [4:7] 4 4 4 4 4 4 4 4 4 4 4 4 4 Extend. Fat Pipe MCH2 Fabric [D:G] to AMC Port [8:11] 4 4 4 4 4 4 4 4 4 4 4 AMC Port 12 AMC Port 13 AMC Port 14 AMC Port 15 AMC Port 17 AMC Port 18 AMC Port 19 AMC Port 20 Clocks MCH1 CLK1 to AMC TCLKA Clocks MCH2 CLK1 to AMC TCLKC Clocks AMC TCLKB to MCH1 CLK2 Clocks AMC TCLKD to MCH2 CLK2 Clocks MCH1 CLK3 to AMC FCLKA PM01 PM02 MCH01 AMC01 AMC02 AMC03 AMC04 AMC05 AMC06 AMC07 AMC08 AMC09 AMC10 AMC11 AMC12 MCH02 PM03 PM04