Dirk Beernaert European Commission Head of Unit Nanoelectronics EC Programmes in Micro & nanoelectronics A way to a bright future? EU 2020, KET, H2020, ECSEL JTI

Europe 2020: Reaching the targets Industrially relevant R&D Innovation ICT Growth based on knowledge & innovation An inclusive, high-employment society Green growth: A competitive & sustainable economy EU levers for Growth and jobs - Single market - Trade policies - Financial support

EUROPE 2020 Flagships H2020 / CIP II / CSF Regional Policy for Smart Growth (Structural Funds) EU Levers Trade / External Policies/ Single Market Key Enabling Technologies ………….

R&D&I is part of Industrial Policy Key Enabling Technologies Nanotechnology Micro- and nanoelectronics, including semiconductors Photonics Advanced materials Biotechnology Preparing for our future: Developing a common strategy for key enabling technologies in the EU Advanced manufacturing Systems

Public & Private Investments Needs EU should improve rate of attractiveness to business investments (China and US offer more public funds and/or easier regulations.) EU needs “smart incentives” to cover all steps, from R&D to the market, to avoid “valley-of-death” for European businesses in particular for new businesses

The 3-Pillar Bridge over the Valley of Death

Successful framework conditions to build this “bridge of hope” Policy and strategy - Public Private Partnerships - Integrated policies - Value chain - Cross border and institutional cooperation - IP & patent regulation - Public procurement - Standards - Output driven vs process driven policies Societal conditions Economic and Financial conditions -Trade barrier -Tax credits - Financial Incentives - Access to capital - Combined funding -Political will -Skilled work force - Societal acceptance

Phase 2 working method : 7 working groups Europe urgently needs to construct its own “bridge of hope”, turning the “valley of death” into a “valley of life”

Source: CT IC ICTs require raw materials: computer chip The dynamics of two decades of computer chip technology development and their mineral and element impacts. In the 1980s, computer chips were made with a palette of twelve minerals or their elemental components. A decade later, sixteen elements were employed. Today, as many as sixty different minerals (or their constituent elements) are used in fabricating the high-speed, high-capacity integrated circuits that are crucial to this technology.

Findings of a Study on Nanoelectronics in Europe Alarming & encouraging developments Europe could lose out in the competitive race: Building fabs subsidies are higher in US and China Losing manufacturing/process know-how may lead to a loss in R&D No new advanced labs and fabs planned in Europe for next technological steps (<=22nm) EUV lithography and 450mm fabs delays may be a chance or a threat Europe could lose out in the competitive race: Building fabs subsidies are higher in US and China Losing manufacturing/process know-how may lead to a loss in R&D No new advanced labs and fabs planned in Europe for next technological steps (<=22nm) EUV lithography and 450mm fabs delays may be a chance or a threat Europe has a chance to maintain a leading position: Market is rapidly growing in several domains (MEMS, automotive, photovoltaics, …) Mastering manufacturing is required to perform large volume productions R&D is less expensive than “More Moore” but still essential Pilot lines or lab-fabs are crucial to bring innovations to a manufacturing step Europe has a chance to maintain a leading position: Market is rapidly growing in several domains (MEMS, automotive, photovoltaics, …) Mastering manufacturing is required to perform large volume productions R&D is less expensive than “More Moore” but still essential Pilot lines or lab-fabs are crucial to bring innovations to a manufacturing step “More Moore” “More than Moore”

European vision of the More Moore and More than Moore domains More than Moore: Diversification Moore’s Law: Miniaturization Baseline CMOS: CPU, Memory, Logic 130nm 90nm 65nm 45nm 32nm 22nm Beyond & Extended CMOS Analog/RFPassivesHV Power Sensors Actuators Biochips Information Processing Digital content System-on-Chip (SoC) Interacting with people and environment Non-digital content SoC & System-in- Package (SiP) Combining SoC and SiP: Higher Value Systems, Beyond & Extended CMOS technologies need to meet the criteria of integratability and systemability and manufacturability Nanoelectronics ”Small, smaller, smarter” - Advanced components in advanced systems enabling pervasive applications -

ITRS-ERD vision of the role of Beyond CMOS and More than Moore elements to form future extended CMOS platforms. Beyond CMOS and advanced More than Moore as an extended-CMOS vision. No disconnection from the advanced silicon CMOS in order to keep impact of its results on the applications and markets. Needs of hybridizing silicon with molecular switches, ferromagnetic logic, spin devices and sensors in order to enable heterogeneous and morphic system architectures. Integrate-ability of novel technology with CMOS and their reliability become key factors. Advanced Nanoelectronics Technology