FPI Training Material New Product Development Group 1 2015.05.25

Ⅰ What is Fingerprint? The definition of minutia feature is made from modern fingerprint method by E.R. Henry, a British scholar, which is Henry System Classification. He classified the fingerprint as 2 parts and 8 types. If there are 13 features matching, Henry will consider they are same fingerprint. The gap between 2 ridges are between 300 to 500 μm, while the height difference are between 100 to 400 μm. In order to get enough feature points for identification, the size and resolution of the fingerprint image should be 1cm x 1cm and 500dpi.

Ⅰ What is Fingerprint?

Ⅰ What is Fingerprint?

Ⅱ Fingerprint Identification System and Application

Ⅱ Fingerprint Identification System and Application ENROLMENT: Extraction of biometric data and construction of template FTE: Failure To Enrol Template Verification (1:1): User: “I am Christian” System: “Yes you are” or “No, you are not” Identification (1:n) or (1:many): User: “Here I am” System: “You are Christian” or “I do not know you”

Ⅱ Fingerprint Identification System and Application VERIFICATION:Comparison of captured biometric data with one predetermined stored template FRR: False Rejection Rate FAR: False Acceptance Rate

Ⅱ Fingerprint Identification System and Application IDENTIFICATION:Comparison of captured biometric data with many stored template in database

Ⅱ Fingerprint Identification System and Application Fingerprint Identification provides a safe and convenient method for ID Verification and Management Cellphone/PAD Unlocking App. Access Control Folder Encryption Fast Logging(alternative for digital code) Quick Launch and Logging Express Payment

Optical：Illuminant+CMOS+Lens Ultrasonic：determine the distance Ⅲ Fingerprint Sensoring Principle Capacity Type Trans Capacitive Self Capacitance Optical：Illuminant+CMOS+Lens Ultrasonic：determine the distance Two types: Area vs. Swipe Sensor

Self Capacitance Ⅲ Fingerprint Sensoring Principle Sapphire Cover Lens Exciter Ring Sense Pixel Array

Ⅲ Fingerprint Sensoring Principle Each square is pixel RX Finger is TX Driven by Exciter Ridge Valley Excitation voltage ~1 MHz coupled into finger via Exciter Ring or Bezel Sense Amps at each pixel measure capacitance between finger and pixel Very good sensitivity, but active circuitry at each pixel needed

Trans Capacitive Ⅲ Fingerprint Sensoring Principle Very fine TouchPad TX RX Ridge Valley Very fine TouchPad Sense trace spacing typically 70-110 um 16 MHz 3V RF placed onto successively-scanned TX rows

Swipe Type Sensor Ⅲ Fingerprint Sensoring Principle Host Platform Reconstruct Image Extract Minutiae M1={x1,y1,a1,z1) M2={x2,y2,a2,z2} ... Raw Image Data Fingerprint Template

Ⅲ Fingerprint Sensoring Principle Area Type Sensor

Ⅳ FPI Module Structure and Sensor List I Molding + Ultra thin cover lens II Molding+Thick CoverLens

Ⅳ FPI Module Structure and Sensor List III Molding+Coating IV CoverLens（Independent)

Ⅳ FPI Module Structure and Sensor List V Under Glass FPI Module RoadMap MP PP MP PP MP R&D PP MP R&D PP MP

Molding+Coating Structure FPI Appearance and Surface Magnification Ⅳ FPI Module Structure and Sensor List Molding+Coating Structure FPI Appearance and Surface Magnification Features Coating Sapphire Lens Glass(thick) Lens Glass(thin) Lens Appearance Hardness Cost IC Compatibility MP Capacity IC Sources for Truly Goodix、Silead Goodix Goodix、Silead、MicroArray

Ⅳ FPI Module Structure and Sensor List FPI Solutions IC Supplier IC P/N IC Packaging IC Size Pixels 0.26mm Saphire/Glass Cover Lens Goodix GF616 COB+Trench+Exposed Molding 4.2*12*0.47 68*118 GF816 COB+Trench++Exposed Molding GF818 96*96 0.2mm Glass Cover Lens GF516 COB+Molding GF518M Silead GSL6163DPR Die 109*123 MicroArray AFS120 TVS Square 0.05mm Ultra-thin Glass Cover Lens /Coating GSL6162MSB COB+Trench++Molding 110*118 GSL6162MRB GSL6162EM GSL6172MTB 80*200 GF316 GF318

Ⅴ Production Capacity Plan

Ultra-thin Glass Cover Lens Ⅵ Market Information Smart Phone Apple iPhone6/Plus HuaWei Mate 7 OPPO N3 Meizu Mx4Pro GuanQun 3022 Type Sapphire Cover Lens Coating Ultra-thin Glass Cover Lens Sensor Authentic FPC Goodix Silead Module Vendor Taiwan ASE Korea CrucialTec A-Kerr Truly Cost 13 USD 8 USD 11 USD 10 USD

LENS Manufacturing Process： Substrate Cleaning→Silkscreen/Ink Spraying →Solidification→AF Evaporation→Cutting →Splintering→LENS QC Assembly Process： FPC Baking→Solder Paste Printing→Chip Mounting →Reflow Soldering→Gel Filling →Solidification →Washing→LENS Lamination→Autoclave→ Solidification→Semi-finished Product Electrical QC→Holder Attaching→ Solidification →Label Printing →Splintering→Silicone Pad Attaching →Finished Product Electrical QC →Protective Film Attaching→Visual Inspection→OQC→Shipping

Sensor Supplier Qualification List Qualcomm (Ultrasonic) √ Qualified ×Total Rejected Updated by 2015/03/15 Class Customer FPC Goodix Synaptics Silead Qualcomm (Ultrasonic) 1st Tier Brand VIVO √ x OPPO Huawei ZTE Xiaomi 2nd and 3rd Tier Brand LeTV K-Touch TCL Gionee Design House Ragentek SIMCOM

FPI Module Manufacturing Ability Matrix 20150430 Molding Coating Optical Bonding Sensor Resources Truly × √ Goodix, Silead, MicroArray O-Film FPC, Goodix A-Kerr Goodix, MicroArray WLCSP Silead Crucial Tec FPC, Idex

Notes for Design Stage Independent power for FPI Module to make sure pure AVDD without noise. If the FPI module is placed on the back of smartphone, and the rear cover is made of metal(connected to GND), customer need to contact the sensor supplier need to confirm the potential risk. If the FPI module is placed on the front side, and the middle- frame is made of metal(connected to GND), customer need to contact the sensor supplier need to confirm the potential risk.

Debugging Notice Silead Sensor Debugging Suite. The debugging suites for Android 4.2/4.4 are OK The debugging suite for Android 5.0 will be OK by the end of this month.