MOS CAPACITOR Department of Materials Science & Engineering

Slides:



Advertisements
Similar presentations
6.1 Transistor Operation 6.2 The Junction FET
Advertisements

6.4.3 Effect of real surfaces Departure from the ideal case is due to Work function difference between the doped polysilicon gate and substrate The inevitably.
MOSFETs MOSFETs ECE 663.
VLSI Design/ RMC© D. Al-Khalili Devices-2 1 The Threshold Voltage  The voltage applied between the gate and the source which causes the beginning of the.
Chapter 6 The Field Effect Transistor
Spring 2007EE130 Lecture 33, Slide 1 Lecture #33 OUTLINE The MOS Capacitor: C-V examples Impact of oxide charges Reading: Chapter 18.1, 18.2.
Lecture 11: MOS Transistor
Spring 2007EE130 Lecture 34, Slide 1 Lecture #34 OUTLINE The MOS Capacitor: MOS non-idealities (cont.) V T adjustment Reading: Chapter 18.3.
Lecture 15 OUTLINE MOSFET structure & operation (qualitative)
Metal-Oxide-Semiconductor (MOS)
EE415 VLSI Design The Devices: MOS Transistor [Adapted from Rabaey’s Digital Integrated Circuits, ©2002, J. Rabaey et al.]
Lecture 10: PN Junction & MOS Capacitors
(N-Channel Metal Oxide Semiconductor)
半導體量測技術 Semiconductor Materials and Device Characterization Topic 5: oxide trapped charge and poly-depletion effect in MOSFET Instructor: Dr. Yi-Mu Lee.
Spring 2007EE130 Lecture 32, Slide 1 Lecture #32 OUTLINE The MOS Capacitor: Capacitance-voltage (C-V) characteristics Reading: Chapter 16.4.
Spring 2007EE130 Lecture 30, Slide 1 Lecture #30 OUTLINE The MOS Capacitor Electrostatics Reading: Chapter 16.3.
Chapter 4. MOS Systems Total 3 hours.. The Adventure of Carriers The description must now borrow a picture from the classical books of adventure. To place.
VLSI design Lecture 1: MOS Transistor Theory. CMOS VLSI Design3: CMOS Transistor TheorySlide 2 Outline  Introduction  MOS Capacitor  nMOS I-V Characteristics.
EE105 Fall 2007Lecture 16, Slide 1Prof. Liu, UC Berkeley Lecture 16 OUTLINE MOS capacitor (cont’d) – Effect of channel-to-body bias – Small-signal capacitance.
MOS Capacitors ECE Some Classes of Field Effect Transistors Metal-Oxide-Semiconductor Field Effect Transistor ▫ MOSFET, which will be the type that.
Metal-Oxide-Semiconductor Field Effect Transistors
Depletion Region ECE Depletion Region As electrons diffuse from the n region into the p region and holes diffuse from the p region into the n region,
Modern VLSI Design 3e: Chapter 2 Copyright  1998, 2002 Prentice Hall PTR Topics n Derivation of transistor characteristics.
Basic Equations for Device Operation
1 Metal-Oxide-Semicondutor FET (MOSFET) Copyright  2004 by Oxford University Press, Inc. 2 Figure 4.1 Physical structure of the enhancement-type NMOS.
OXIDE AND INTERFACE TRAPPED CHARGES, OXIDE THICKNESS
EXAMPLE 6.1 OBJECTIVE Fp = 0.288 V
Norhayati Soin 06 KEEE 4426 WEEK 3/2 13/01/2006 KEEE 4426 VLSI WEEK 3 CHAPTER 1 MOS Capacitors (PART 2) CHAPTER 1.
DMT121 – ELECTRONIC DEVICES
© 2012 Eric Pop, UIUCECE 340: Semiconductor Electronics ECE 340 Lecture 30 Metal-Semiconductor Contacts Real semiconductor devices and ICs always contain.
NOTES 27 March 2013 Chapter 10 MOSFETS CONTINUED.
NMOS PMOS. K-Map of NAND gate CMOS Realization of NAND gate.
ECE340 ELECTRONICS I MOSFET TRANSISTORS AND AMPLIFIERS.
ELECTRONICS II VLSI DESIGN FALL 2013 LECTURE 4 INSTRUCTOR: L.M. HEAD, PhD ELECTRICAL & COMPUTER ENGINEERING ROWAN UNIVERSITY.
ECE 4339 L. Trombetta ECE 4339: Physical Principles of Solid State Devices Len Trombetta Summer 2007 Chapters 16-17: MOS Introduction and MOSFET Basics.
Norhayati Soin 06 KEEE 4426 WEEK 3/1 9/01/2006 KEEE 4426 VLSI WEEK 3 CHAPTER 1 MOS Capacitors (PART 1) CHAPTER 1.
Lecture 18 OUTLINE The MOS Capacitor (cont’d) – Effect of oxide charges – Poly-Si gate depletion effect – V T adjustment Reading: Pierret ; Hu.
PROCESS AND DEVICE SIMULATION OF A POWER MOSFET USING SILVACO TCAD.
1 Chapter 5. Metal Oxide Silicon Field-Effect Transistors (MOSFETs)
UNIT I MOS TRANSISTOR THEORY AND PROCESS TECHNOLOGY
Structure and Operation of MOS Transistor
Lecture 18 OUTLINE The MOS Capacitor (cont’d) – Effect of oxide charges – V T adjustment – Poly-Si gate depletion effect Reading: Pierret ; Hu.
Physics of Semiconductor Devices
Introduction to MOS Transistors Section Outline Similarity Between BJT & MOS Introductory Device Physics Small Signal Model.
Norhayati Soin 06 KEEE 4426 WEEK 3/2 20/01/2006 KEEE 4426 VLSI WEEK 4 CHAPTER 1 MOS Capacitors (PART 3) CHAPTER MOS Capacitance.
Network for Computational Nanotechnology (NCN) UC Berkeley, Univ.of Illinois, Norfolk State, Northwestern, Purdue, UTEP First Time User Guide to MOSCAP*
MOS Capacitors UoG-UESTC Some Classes of Field Effect Transistors Metal-Oxide-Semiconductor Field Effect Transistor ▫ MOSFET, which will be the.
Introduction to semiconductor technology. Outline –6 Junctions Metal-semiconductor junctions –6 Field effect transistors JFET and MOS transistors Ideal.
© 2012 Eric Pop, UIUCECE 340: Semiconductor Electronics ECE 340 Lecture 38 MOS capacitor Threshold Voltage Inversion: at V > V T (for NMOS), many electrons.
Integrated Circuit Devices
Structure and Operation of the MOSFET 9 and 11 March 2015.
Metal-oxide-semiconductor field-effect transistors (MOSFETs) allow high density and low power dissipation. To reduce system cost and increase portability,
Field Effect Transistor (FET)
© S.N. Sabki CHAPTER 6: MOSFET & RELATED DEVICES CHAPTER 6: MOSFET & RELATED DEVICES.
MOS capacitor before joining The metallic gate may be replaced with a heavily doped p+ polysilicon gate. The Fermi energy levels are approximately at.
The MOS capacitor. (a) Physical structure of an n+-Si/SiO2/p-Si MOS capacitor, and (b) cross section (c) The energy band diagram under charge neutrality.
EE130/230A Discussion 10 Peng Zheng.
Damu, 2008EGE535 Fall 08, Lecture 21 EGE535 Low Power VLSI Design Lecture #2 MOSFET Basics.
MOS Transistor Theory The MOS transistor is a majority carrier device having the current in the conducting channel being controlled by the voltage applied.
CHAPTER 6: MOSFET & RELATED DEVICES CHAPTER 6: MOSFET & RELATED DEVICES Part 1.
Lecture 18 OUTLINE The MOS Capacitor (cont’d) Effect of oxide charges
Revision CHAPTER 6.
EMT362: Microelectronic Fabrication CMOS ISOLATION TECHNOLOGY Part 1
ECE574 – Lecture 3 Page 1 MA/JT 1/14/03 MOS structure MOS: Metal-oxide-semiconductor –Gate: metal (or polysilicon) –Oxide: silicon dioxide, grown on substrate.
Lecture 18 OUTLINE The MOS Capacitor (cont’d) Effect of oxide charges
Sung June Kim Chapter 16. MOS FUNDAMENTALS Sung June Kim
Modern Semiconductor Devices for Integrated Circuits (C. Hu)
Sung June Kim Chapter 18. NONIDEAL MOS Sung June Kim
MOS Capacitors Dr. David W. Graham West Virginia University
MOSCAP Non-idealities
Presentation transcript:

MOS CAPACITOR Department of Materials Science & Engineering Dae-Hong Ko Semiconductor Device Physics and Technologies dhko@yonsei.ac.kr

* MOS CAPACITOR ⇒Two terminal structure ⇒Metal Oxide Semiconductor CAPACITOR

* MOS CAPACITOR

◎ Energy Band Diagram of a MOS Capacitor with a P-type substrate

◎ Energy Band Diagram of a MOS Capacitor with a N-type substrate

* MOS CAPACITOR ◎ Depletion Layer Thickness

*n-type substrate ◎ At inversion point (threshold voltage) *p-type substrate *n-type substrate

■ Work Function Differences

* P+ and N+ POLY SILICON GATE

*MOS SUBSTRATE

Flat-Band Voltage Flat-band condition In real cases, Vox ≠ 0 1. work function difference 2. trapped charge in the oxide 1. Φms = Φm – Φs ≠ 0 2. Oxide charges - fixed charge : positive → broken or dangling covalent bonds near semiconductor- oxide interface →Q’ss close to the oxide-semiconductor interface

• p-sub or Under gate voltage for flat-band condition

* Threshold Voltage → Applied gate voltage required to achieve the threshold inversion point → Φs=2Φp for NMOS, p-sub Φs=2Φn for PMOS, n-sub

At inversion point Space charge width → maximum Energy band diagram of the MOS system with an applied positive gate voltage

* MOS CAP Capacitance-Voltage Characteristics - Ideal C-V Characteristics Three operating conditions, • Accumulation • Depletion • Inversion MOSCAP with p-type sub. 1. Accumulation If VG < 0 ⇒ induce an accumulation layer of holes in the semiconductor at the oxide-semiconductor interface ⇒ small VG change → Qm and QSD change

* MOS CAP 2. Depletion - VG : small positive voltage ⇒ induce a space charge region in the semiconductor ⇒ small differential change in VG induces a differential change in the space charge width As VG ↑ → xd ↑ → C’SD ↓ → C(depl)↓

At high frequency - different from low frequency case Two source of electrons in the inversion layer 1. diffusion of minority carrier electrons from the p-type sub across the space charge region 2. thermal generation of electron-hole pairs within the space charge region Both processes generate electrons at a particular rate ⇒ The electron concentration in the inversion layer CANNOT change INSTANTANEOUSLY. ⇒ The change in the inversion layer charge cannot respond to the high frequency AC voltage change.

Fixed oxide and interface charge effects two types of charges for C-V characteristics change. Fixed oxide charge & Interface charge 1. Fixed oxide charge - VFB shift negatively for positive fixed oxide charges. - Oxide charge → not a function of VG → parallel shift of C-V curve with oxide charge → same shape of C-V curve High-frequency characteristics of a MOSCAP with p-type sub

2. Interface state charge - At the oxide-semiconductor interface → periodic nature of semiconductor is abruptly terminated → electronic energy levels exist within the forbidden bandgap ⇒ Interface states - Charge can flow between the semiconductor and interface states → The net charge in the interface state is a function EF

Some are acceptor-like and some are donor-like

⇒ change electron occupancy in the states due to the VG charge ⇒ change in C-V characteristics