1. PACS IHDR12/13 Nov 2003 Warm Electronics1 Warm Electronics: Overview, Interfaces, Grounding and EMC Martin von Berg PACS IHDR

2. 12/13 Nov 2003 Warm Electronics2 Warm Electronics Overview

3. PACS IHDR12/13 Nov 2003 Warm Electronics3 Warm Electronics Redundany

4. PACS IHDR12/13 Nov 2003 Warm Electronics4 PACS AVM ILT WE Set-up

5. PACS IHDR12/13 Nov 2003 Warm Electronics5 Grounding PACS System Grounding Concept consolidated PACS System Grounding Doc. PACS-ME-LI-006 via CR-0018 updated. Next issue to be released until 30.11.2003 (in response to Astrium comments). Verification Matrix will be provided Spectrometer Detector chain Grounding is still adaptable after EQM Testing Photometer Detector chain was analysed (verify Doc. SAp-PACS-DS-0010/0011-02)

6. PACS IHDR12/13 Nov 2003 Warm Electronics6 EMC PACS EMC Control Plan is to 30% ready. Final version end of this year All Test Procedures and Sequences will be provided Verification Matrix will be provided CEA EMC Analysis triggered RfW-004 to reduce incident H- Field  RfW rejected Some EMC testing already done (Chopper, SPU CE-CM, DPU DC/DC, 1355 I/F) Main constraint: poor EMC representativity of the CQM ILT PACS set-up

7. PACS IHDR12/13 Nov 2003 Warm Electronics7 EMC Preparation for EQM ILT MPE EMC Measurements –Set-up different to PFM and EQM PACS –Cryostat, harness length, WU Box dimensions, PS –External PS (DMC and BOLC), only DPU FFF –Only Conducted Measurements feasible Astrium EQM EMC Measurements –Long harness between external PS not possible –EQM Cryo Harness longer than PFM CH –Refurbished ISO Cryostat will be used –EGSE environment different to S/C –Cryostat closed (but main coupling through harness)