Presentation is loading. Please wait.

Presentation is loading. Please wait.

≈450 mm 50 x 220 mm 2 ≈450 mm 50 x 220 mm 2 Electronics boards Size: 50 x 220 mm 8 VMM chips à 64 ch Total: 512 ch/board Zebra contact Arrangement of electronics.

Published byTrevor Dixon Modified over 8 years ago

Similar presentations

Presentation on theme: "≈450 mm 50 x 220 mm 2 ≈450 mm 50 x 220 mm 2 Electronics boards Size: 50 x 220 mm 8 VMM chips à 64 ch Total: 512 ch/board Zebra contact Arrangement of electronics."— Presentation transcript:

1 ≈450 mm 50 x 220 mm 2 ≈450 mm 50 x 220 mm 2 Electronics boards Size: 50 x 220 mm 8 VMM chips à 64 ch Total: 512 ch/board Zebra contact Arrangement of electronics on MM readout panels or Stereo planes require slightly different routing of readout strips and shape of electronics boards

2 ≈450 mm 50 x 220 mm 2 Electronics boards Size: 50 x 220 mm 8 VMM chips à 64 ch Total: 512 ch/board Arrangement of electronics on MM readout panels GBT trigger boards Size: 50 x 100 mm 1 link 32 VMM chips Total: 16 boards/MP GBT data boards Size: 50 x 100 mm 1 link for 64 VMM chips Total: 4 boards/MP Zebra contact Readout panels Drift electrode panels HV + LV cables ??

3 Electronics boards Size: 50 x 220 mm 8 VMM chips à 64 ch Total: 512 ch/board Zebra contact Arrangement of electronics on MM readout panels

Download ppt "≈450 mm 50 x 220 mm 2 ≈450 mm 50 x 220 mm 2 Electronics boards Size: 50 x 220 mm 8 VMM chips à 64 ch Total: 512 ch/board Zebra contact Arrangement of electronics."

Similar presentations

RPC calibration D. Piccolo INFN Napoli. Calibrations Electronic test –Channels check –Strip pattern for trigger check –Threshold test –Synchronization.

RPC calibration D. Piccolo INFN Napoli. Calibrations Electronic test –Channels check –Strip pattern for trigger check –Threshold test –Synchronization.
1 500cm 83cm 248cm TPC DETECTOR 88us 1MIP = 4.8 fC = 3 x10 4 e Dynamic : 30 MIP S / N = 30:1 1MIP = 4.8 fC = 3 x10 4 e Dynamic : 30 MIP S / N = 30:1 LATERAL.

1 500cm 83cm 248cm TPC DETECTOR 88us 1MIP = 4.8 fC = 3 x10 4 e Dynamic : 30 MIP S / N = 30:1 1MIP = 4.8 fC = 3 x10 4 e Dynamic : 30 MIP S / N = 30:1 LATERAL.
TPC DETECTOR SEGMENTATION OF THE READOUT PLANE LATERAL VIEW OF THE TPC

TPC DETECTOR SEGMENTATION OF THE READOUT PLANE LATERAL VIEW OF THE TPC
Present Status of GEM Detector Development for Position Counter 1.Introduction 2.GEM 3.Readout Board 4.Fabrication Test 5.Large GEM 6.Readout Electronics.

Present Status of GEM Detector Development for Position Counter 1.Introduction 2.GEM 3.Readout Board 4.Fabrication Test 5.Large GEM 6.Readout Electronics.
Status of the ATLAS MM project

Status of the ATLAS MM project
1 Apr. 28, 2007 Test of the Pulse Height and Time Jitter for the IHEP Full-Size RPC’s with 8-m-Long Readout Strip Planes C. Lu, K. McDonald and W. Sands.

1 Apr. 28, 2007 Test of the Pulse Height and Time Jitter for the IHEP Full-Size RPC’s with 8-m-Long Readout Strip Planes C. Lu, K. McDonald and W. Sands.
131.123.247.253 -> 131.123.246.52 -> 131.123.11.254 131.123.8.1 131.123.11.254 131.123.247.253 131.123.246.52.

> >
1 MUON UPGRADE: ME0 GMM 3-3-2014 All engineering drawings from Sasha Surkhov 22.2.2014 PRELIMINARY !!

1 MUON UPGRADE: ME0 GMM All engineering drawings from Sasha Surkhov PRELIMINARY !!
Infrastructure for LHCb Upgrade workshop – MUON detector Infrastructure for LHCB Upgrade workshop: MUON power, electronics, cable Muon upgrade in a nutshell.

Infrastructure for LHCb Upgrade workshop – MUON detector Infrastructure for LHCB Upgrade workshop: MUON power, electronics, cable Muon upgrade in a nutshell.
PCB layout issues PCB alignment and spacing MMM meeting, 22/01/2014G. Sekhniaidze/ J. Wotschack1.

PCB layout issues PCB alignment and spacing MMM meeting, 22/01/2014G. Sekhniaidze/ J. Wotschack1.
Various Topics Related to FEB Liang Han, Ge Jin University of Science and Technology of China Dec.21,2013.

Various Topics Related to FEB Liang Han, Ge Jin University of Science and Technology of China Dec.21,2013.
20/10/2008A. Alici - ALICE TOF Festival1 Electronics and data acquisition of the ALICE TOF detector A.Alici University and INFN, Bologna.

20/10/2008A. Alici - ALICE TOF Festival1 Electronics and data acquisition of the ALICE TOF detector A.Alici University and INFN, Bologna.
MM construction organization Some thoughts MMM Saclay, 18/04/2013J. Wotschack1.

MM construction organization Some thoughts MMM Saclay, 18/04/2013J. Wotschack1.
1 PreFPIX2 Inner board and test beam triggering Gabriele Chiodini Fermilab - Jan 07, 02.

1 PreFPIX2 Inner board and test beam triggering Gabriele Chiodini Fermilab - Jan 07, 02.
HallA/SBS – Front Tracker PARAMETERDESIGN VALUE Microstrip Silicon Detector Number of tiles/plane and size2 Number of planes2 Size of the single

HallA/SBS – Front Tracker PARAMETERDESIGN VALUE Microstrip Silicon Detector Number of tiles/plane and size2 Number of planes2 Size of the single
The ALICE Forward Multiplicity Detector Kristján Gulbrandsen Niels Bohr Institute for the ALICE Collaboration.

The ALICE Forward Multiplicity Detector Kristján Gulbrandsen Niels Bohr Institute for the ALICE Collaboration.
The Readout Electronics for TPC with GEM readout chamber (and for almost any other readout chamber) Anders Oskarsson Lund Univ. Electronics: Bruxelles,

The Readout Electronics for TPC with GEM readout chamber (and for almost any other readout chamber) Anders Oskarsson Lund Univ. Electronics: Bruxelles,
MICROMEGAS CONNECTICS Electronics Boards And Readout Panels 25 JUNE 2013.

MICROMEGAS CONNECTICS Electronics Boards And Readout Panels 25 JUNE 2013.
CMS-GRPC status Imad Laktineh for the GRPC-CMS groups.

CMS-GRPC status Imad Laktineh for the GRPC-CMS groups.
2 Silicon pixel part Done and to be written Written! Under way To be done Introduction 1.Hybrid Pixel Assembly Concept 2.Silicon sensor 1.First thinned.

2 Silicon pixel part Done and to be written Written! Under way To be done Introduction 1.Hybrid Pixel Assembly Concept 2.Silicon sensor 1.First thinned.

Similar presentations

Ads by Google