1. Pop’em Drop’em Robots TCSP #8 – Reliability & Safety Analysis Duncan Swartz

2. Abstract Electronic version of “Rock’em Sock’em Robots” Two players control movements of one of two punching robots via a Microsoft Kinect Player punches and dodges translated into robot movements Hits recorded through depletion of a health bar Selectable battle music with light effects, potential single- player mode vs. computer

3. Components for Analysis AT32UC3C2128C Microcontroller – High complexity component with many I/O pins L298 Dual Full-Bridge Driver – Component with a lot of heat and power to deal with. LM2675M Linear Regulator – Components deals with a lot of heat and power, and is vital to the the proper functioning of most the board. 1N5819 Schottky Diode – 34 of these components on the board, most dealing with a lot of heat and power.

4. AT32UC3C2128C Microcontroller ParameterDescriptionValueComments C1Die complexity.5632 bit microprocessor πTTemperature factor1.5Max T_J = 100C C2Pin count.03264 pins, nonhermetic SMT πEEnvironment constant2Ground fixed πQQuality factor10Commercial grade πLLearning factor1.5In production ~1 year λpConstant failure rate13.56Failures per 1e6 hours MTTFMean time to failure8.42Years to failure λp = (C1 * πT + C2 * πE) * πQ * πL

5. Definition of Criticality Levels Low – No damage done to other components, and no creation of a dangerous situation to user. Medium – Damage done to other components, but no creation of dangerous situation to the user. High – Causes a dangerous situation to a user.

6. AT32UC3C2128C Microcontroller FMECA Chart Failure number Failure mode Possible causes Failure effects Method of detection Criticality A1Outputs 0 or 1 continuously Passive component failure, bad solder connection, noise on traces Connected systems always on or off, overheating of analog components possible ObservationMedium A2 Operating at wrong frequency Failure of oscillator Connected systems unresponsive to input data. ObservationLow

7. L298 Dual Full-Bridge Driver λp = (C1 * πT + C2 * πE) * πQ * πL ParameterDescriptionValueComments C1Die complexity.01<100 gates, linear MOS πTTemperature factor3.5Max T_J = 130°C C2Pin count.009120 pins, nonhermetic SMT πEEnvironment constant2Ground fixed πQQuality factor10Commercial grade πLLearning factor1In production >2 years λp Constant failure rate.532Failures per 1e6 hours MTTFMean time to failure214.6Years to failure

8. L298 Dual Full-Bridge Driver FMECA Chart Failure number Failure mode Possible causes Failure effects Method of detection Criticality B1Outputs 0V continuousl y Overheating device causes short, passive component failure, bad solder connection Physical system unresponsive to input ObservationLow B2 Outputs +12V or - 12V continuousl y Overheating device causes short, passive component failure, bad solder connection Linear regulators and passive components overheat, potential trace damage ObservationMedium

9. L298 Dual Full-Bridge Driver FMECA Chart Failure number Failure mode Possible causes Failure effects Method of detection Criticality B3Outputs <12V Passive component failure, bad solder connection, overheating device Physical system less responsive or unresponsive to input. ObservationLow

10. LM2675M Linear Regulator λp = (C1 * πT + C2 * πE) * πQ * πL ParameterDescriptionValueComments C1Die complexity.01<100 gates, linear MOS πTTemperature factor5.6Max T_J = 150°C C2Pin count.00348 pins, nonhermetic SMT πEEnvironment constant2Ground fixed πQQuality factor10Commercial grade πLLearning factor1In production >2 years λpConstant failure rate.628Failures per 1e6 hours MTTFMean time to failure181.8Years to failure

11. LM2675M Linear Regulator FMECA Chart Failure number Failure mode Possible causes Failure effects Method of detection Criticality C1Outputs 0V Overheating device, passive component failure, bad solder connection Entire board unresponsive ObservationLow C2 Outputs 12V Overheating device causes short, passive component failure, bad solder connection Most connected devices fail overheat and are damaged. ObservationMedium

12. 1N5819 Schottky Diode λp = λb * πT * πS * πE * πQ * πC ParameterDescriptionValueComments λbBase failure rate.003Schottky πTTemperature factor6.4Max T_J = 90°C πSStress factor1Use w/voltage regulator πEEnvironment constant6Ground fixed πQQuality factor8Plastic encapsulated πCContact construction1Metallurgically bonded λpConstant failure rate.9216Failures per 1e6 hours MTTFMean time to failure123.9Years to failure

13. 1N5819 Schottky Diode FMECA Chart Failure number Failure mode Possible causes Failure effects Method of detection Criticality D1 Diode between L298 and 12V not responsive Overheating diode causes open circuit, current spike causes diode failure Physical system unresponsive to input ObservationLow D2 Diode between L298 and GND not responsive Overheating diode causes open circuit, current spike causes diode failure Physical system unresponsive to input, L298 and linear actuators overheat ObservationMedium

14. Questions?