1. 1 H. Pernegger/CERNVertex 2011 ATLAS Insertable B-Layer Overview Vertex 2011 Rust, Austria H. Pernegger / CERN on behalf of the ATLAS IBL collaboration ~2 cm FE-I4 R/O Chip 27 k Pixels 87 M transistors

2. 2 H. Pernegger/CERNVertex 2011 IBL Layout: 14 staves around beam pipe  Provide ATLAS with a 4 Layer Pixel Tracker from 2014 onwards  Maintain and improve physics performance (b-tagging, light jet rejection) until HL-LHC  Insertion of new pixel inside current pixel detector: Insertable B Layer IBL.  IBL sensors at ~34mm radius: 250 Mrad TID and 5.10 15 n eq /cm 2 NIEL.  Installation 2013!  Provide ATLAS with a 4 Layer Pixel Tracker from 2014 onwards  Maintain and improve physics performance (b-tagging, light jet rejection) until HL-LHC  Insertion of new pixel inside current pixel detector: Insertable B Layer IBL.  IBL sensors at ~34mm radius: 250 Mrad TID and 5.10 15 n eq /cm 2 NIEL.  Installation 2013!

3. 3 H. Pernegger/CERNVertex 2011 Stave and module arrangement 3 3 Transition to cables Staves Services IP Underside of stave: IBL modules 14 staves Each stave: 32 FEI4 chips For 3D sensors: 1 sensors + 1 chip = 1 module For planar sensors: 2 chips + 1 sensor = 1 module Total installed 224 planar modules or 448 3D modules

4. 4 H. Pernegger/CERNVertex 2011 IBL readout chip: FEI4 (see Marlon’s talk) FEI4A Wafer received : IBL 16 in hands and 11 of 24 more delivered Good chip yield approx 2/3 (i.e. ~40/wafer) Analog tests with chips very promising to run at low thresholds (<2000e-) Core focus now is submission of production version FEI4-B expected in early July (see Maurice talk) AUN6NGH: 67% green AWN6TUH: 78% green

5. 5 H. Pernegger/CERNVertex 2011 IBL Sensors Planar 2-chip sensor tile 3D 1-chip sensor tile Sensor specifications for IBL:  Qualify to 5x10 15 n eq  max. power dissipation: 200 mW/cm 2 at -15 C  tracking efficiency > 97%.

6. 6 H. Pernegger/CERNVertex 2011 Two type under test: 3D and Planar 3D slim edge (FBK,CNM)Planar n-n Slim Edge Design (CiS) o column through ~full bulk 2 electrodes per pixel o depletion horizontally (short depletion width leads to low bias voltage) o Manufacturing yield now being tested with pre- production runs by CNM and FBK o minimize inactive edge by shifting guard rings underneath active pixel region.  200 – 250  m inactive edge achievable o test signal after full IBL irradiation now o manufactured by CiS like present Pixel 700nm DRIE stopping membrane FBK DRIE: Full thru columns

7. 7 H. Pernegger/CERNVertex 2011 Preliminary: Planar + FEI4 in DESY TB PPS, Slim Edge Design sensor (250 μm thick) Un-irradiated device. Charge collection measured in units on 25ns of Time Over Threshold (TOT). Calibration: 10TOT at 30ke-: larger than expected, under investigation. Tracking efficiency, over all sensor. Require a hit in other device (FE-I3 reference) to avoid fake tracks. A few noisy/dead pixels. Over tracking efficiency: 99.95 %, excellent!

8. 8 H. Pernegger/CERNVertex 2011 Preliminary: Planar after irradiation  2 PPS Slim Edge (250 μm thick) irradiated at Ljubljana (4.10 15 n eq /cm 2 )  1 PPS Conservative (250 μm thick) irradiated at Ljubljana (4.10 15 n eq /cm 2 ) PPS, Conservative Design sensor (250 μm thick) Irradiated to 4.10 15 n eq /cm 2. Perpendicular, tracks Bias voltage: -1000 V. Very few dead or noisy pixels! Preliminary overall tracking efficiency: 98.4% (perpendicular), 99.1% at 15 degrees (mean IBL sensor angle). Recently operated in TB at 1600e- threshold (half of present pixel detector) and noise occupancy of <10 -8

9. 9 H. Pernegger/CERNVertex 2011 Preliminary: FBK 3D with FEI4 FBK un-irradiated, from early batch: Normal beam incidence. Works very well. TOT and cluster size distributions as expected. Overall tracking efficiency: 98%: loss of efficiency for tracks going through electrodes (electrodes not filled). Recover full efficiency tilted tracks. amplitude Cluster width Efficiency map

10. 10 H. Pernegger/CERNVertex 2011 Irradiations followed by CERN SPS TB (now!) Test at IBL specs of 5E15 neq. Tests done at Karlsruhe, and Ljubljana Number of samples Sensor type Design Thickness (µm) Irrad Facility Fluence (n eq// cm2) Irrad statusStatus 3xPlanarSlim Edge250Ljubljana4.00E+15irradiatedlab- and beam-tested 1xPlanarSlim Edge250Karlsruhe3.00E+15irradiatedlab- and beam-tested 1xPlanarSlim Edge150Karlsruhe2.00E+15irradiatedlab- and beam-tested 1x3DFBK-atlas07230Karlsruhe2.00E+15irradiatedlab- and beam-tested 1xPlanarConservative200Karlsruhe5.00E+15irradiatedlab-tested 2x3DCNM230Ljubljana5.00E+15irradiated to be wire-bonded and tested 3x3DCNM230Karlsruhe5.00E+15irradiated 1x lab-tested 2x to be tested 1x3DFBK-atlas09230Karlsruhe5.00E+15irradiatedto be tested 3xPlanarSlim Edge200Karlsruhe5.00E+15irradiatedto be tested 2xPlanarSlim Edge200Ljubljana5.00E+15 Irrad planned for today to be wire-bonded and tested 1x3DFBK-atlas09230Karlsruhe2.00E+15irradiatedto be tested 1x3DCNM230Karlsruhe2.00E+15irradiatedto be tested

11. 11 H. Pernegger/CERNVertex 2011 IBL : Modules Core focus: Sensor and bump-bonding for final modules IBL modules with planar and 3D sensors –Over 78 single-chip assemblies done for sensor qualification –Test in irradiations and test beam to establish sensor performance ahead of sensor review (July 4-5) –Preparing for sensor review for final choice Thin FEI4 (150um) on planar sensors (200 & 250um) have been prepared by IZM to test feasibility of thin modules (i.e. final IBL modules): –Test with 90  m thin test chips successful –First 5 modules done, next 20 SC and 8 2-chip modules to come Substrate Thin IC 1.1. 2.2.

12. 12 H. Pernegger/CERNVertex 2011 IBL Staves Bare stave: –K13C shell structure filled with light (0.2g/cc) carbon foam for heat transfer to central cooling pipe (1.5mm ID Ti pipe 0.1mm wall thickness) –Cooled with CO 2 system at -40C (~1.5kW total) –Design focus on mechanical and thermal optimization (use of faceplate to stop grease and deformation) and material reduction with limited space available

13. 13 H. Pernegger/CERNVertex 2011 Stave thermal performance: tests on prototypes Tested a large number of prototypes (different coatings, faceplate configurations) to find right balance between thermal performance, mechanical stiffness and reasonable X0 CO2 cooling with manifolds at Muon chamber level (maintenance!) and 1.5mm stave pipe ID Prototype stave in final configuration has TFoM ~ 13 Expect sensor temperature ~< -20C at - 40C coolant with long cooling lines Stave out of plane deflection ok for loading Use “as-thin-as-possible” (i.e. 150um) 3-ply faceplate and omega to save material

14. 14 H. Pernegger/CERNVertex 2011 IBL status: Stave flex Flex Bus Cu/Al design, produced at Cern Key topics: –Integration to staves and type 1 services (PP0) –Final dimensions of flex –Start next prototype with final layout (integration dummy, all Cu for tests, Al-Cu –Optimization of X0 In parallel proceed with Al/Al flex Assemble flex now to staves and will test with modules Flex glued to omega

15. 15 H. Pernegger/CERNVertex 2011  Special Jigs have been made for loading accurately the single chip modules. - Metrology of those modules were made before loading allowing to make precisions jigs  Loading of the short W-shape stave with bump bonded dummy modules : -Dummy sensor and dummy chip assembly with two types of bump-bonding tried  Metrology survey done on the cutting edge - Confirmation of the loading problem with the Barcelona module stave  Electrical results loading with dummy modules:before vs after loading - thin modules are fragile to handle (danger of open bumps) - tests with dummies sofar encouraging -Try now with first thin full size electrical functional modules with FEI4 Sensors against alignment refs 100 microns thick shims 20g load added 15 Loading of modules on staves

16. 16 H. Pernegger/CERNVertex 2011 Stave topics for next months Mockup with actual staves –Currently build final stave to be used as “Stave-0” and as staves with heaters to the full IBL –Include dummy IST and dummy beam pipe –Study integration and thermal performance of IBL Stave-0 program: fully functional stave with modules –Plan to build 1-2 fully functional staves with present qualification modules -Use “digital modules” (i.e. modules with functional chips and dummy sensors) for first stave -Use full qualification modules to make another Stave-0 –Flex to stave lamination : integration dummys in preparation to test process; –Module loading to stave 0: summer –First electrical tests of stave-0: September/ October

17. 17 H. Pernegger/CERNVertex 2011 IBL integration: Staves around beam pipe New ATLAS VI beam pipe: expect delivery summer 2012 ready for integration 1.) Setup beam pipe on tool in ATLAS SR1 2.) mount each stave around beam pipe, connect to services, test Integration with beam pipe (in SR1 at CERN) Loaded stave with modules And flex hybrid

18. 18 H. Pernegger/CERNVertex 2011 IBL integration: Staves to Services Deeper look at integration of staves with services –Take up thermal expansion of type 1 services (up to 9mm!) and decouple from staves –Create “bellow” area with use of an intermediate flex Wire suspension system on IST Intermediate flex Stave flex Minimize this length Shorten multi-layer flex for production Finish PP0 before wire suspension system Cooling braize/weld joint is being pushed to higher Z position Stave flex CF support cylinder (takes force during Connector mating) CF support cylinder Service support ring Stave support ring 6 Intermediate flexes Rigid EoS card Type 1 service Strain relief top plate Type 1 services end moves with CTE (up to 9mm) Stave end fixes through Stave support ring on IST

19. 19 H. Pernegger/CERNVertex 2011 2400mm long Dummy IST (used for Stave assembly around the beam pipe) 1 out of 4 tubes… IST: this supports IBL and new beam pipe: 7m CF tube with 0.5mm wall thickness 3 segments of IST assembled (K13C/RS3 fiber pre-preg) LGT: for Long Guiding Tube… used for BP extraction (active system to keep a straight tube over 7m) This tool prevents the sagging of the beam pipe after its support are released (sag is much larger than 8mm clearance to present B-Layer) Mockup : 1:1 mockup in Bat 180: Test tools and procedures at CERN in this Summer 19 IBL support inside Pixel: 7m CF tube

20. 20 H. Pernegger/CERNVertex 2011 Beam pipe extraction and IBL installation 20 Multipurpose container ID Supporting frame IBL installation tooling Rotation table Long Guiding Tube I/F table Used to remove present beam pipe and install support tube, then IBL with beam pipe 20 Fixed Table Beam Pipe

21. 21 H. Pernegger/CERNVertex 2011 IBL integration: Material budget Task force in place to monitor actual X0 during construction Went from 1.5% (TDR) to 2.0% -> now go back and save material Aim on saving X0 now (within reasonable engineering limits) Potential Savings Stave: 1.5mm ID pipe- 0.05% to 0.1% Modules: 230um sensor and thinner grease- 0.1% Modules: 100um FEI4 (150um under test by IZM right now) - 0.18% Total savings to target-0.3% to -0.4% Present status with conservative material thicknesses: (perpendicular incident, smeared over active surface, average over stave length  <3)

22. 22 H. Pernegger/CERNVertex 2011 Off-detector: Powering Key point: voltage drop Voltage drop on cables likely higher than our limit of ~900mV (limited by space and wire gauges Possible solution: prevent Zero- Current condition by operating FEI4 at constant current (Shunt LDO) Needs to be tested -> need to start thinking of powering system test setup Cable definition, grounding and shielding concept progressing well (see Ned’s talk) Sharing of resistance between flex and type 1+2 cables: maximum resistance for a given min current on FE-I4 (space to lower left are OK)

23. 23 H. Pernegger/CERNVertex 2011 Detector readout: upgrade to 160Mb/s Readout Driver (ROD) fabrication has started: 2 prototypes expected by next month –ROD firmware design is ongoing The design of a full DAQ chain simulation environment has started Back-of-Crate card (BOC): makes optical data/cmd link from control room to IBL modules prototypes expected by September, then testing and redesign until the end of the year Detector opto-link: –First complete prototype of optobox in October –investigation underway to use commercial SNAP12 modules Optobox concept for Pixel readout upgrade and IBL 23 BOC block diagram

24. 24 H. Pernegger/CERNVertex 2011 IBL schedule for installation 2013 During March to May worked out detailed schedule for installation 2013 for both scenarios (planar and 3D) based on informal input from main external vendors: CiS, CNM, FBK, IZM. The present version is 4.6 with most recent information: EDMS ATL-IP-SC-0003 –Won’t show all 30 pages now –Schedule is based on sensor information and is now at IZM for confirmation of BB schedule –Tightly packed -> work steps depend strongly on each other, hence delays in component production are the key risks. Time critical items – We have now detailed work-plans for those items: –Sensor pre-production run : on-going – wait for results (deliveries of first batches in July-Aug) –FEI4 Version 2 submission (July 2011) –Bump bonding of thin modules –Stave 0 program to qualify full stave mechanically and electrically (requires rapid advancement on stave flex and module loading) (mechanical stave April-May, loaded Aug, tested Oct) –Beam pipe qualification of split flange and order of beam pipe (submit order now to receive pipe in July 2012 in SR1 ready for integration)

25. 25 H. Pernegger/CERNVertex 2011 ActivitiesStartingEnding FEI4-BJuly 11: SubmissionOct to Dec 11 for wafer tests Bump bondingAug 11: pre-productionJuly 12: Completion Module assembly Feb 12: 1 st modules ready for loading Oct to Dec 12 depending of sensor Module loadingFeb 12:  4 staves to be ready by Apr 12 Jan 13: Completion Stave loadingSep 12: starting with the 1 st available staves Feb – Mar 13: Completion Final tests and commissioning Sep 12Jul 13: IBL Installation All is tight and does not allow early delay in the all program The production has started or is starting for some items The Beam pipe should be ready in July 12 and 2 month later the staves should already be integrated The current work preparation for stave fabrication, flex, module assemblies, loading and tests is requiring a lot of effort across all IBL working groups The mechanics for the integration and beam pipe removal/insertion is under work preparation and should be tested with the mock-up this year in bldg 180 IBL schedule key dates

26. 26 H. Pernegger/CERNVertex 2011 Summary Installation 2013 Schedule : start production of IBL now Several key IBL developments have made much progress recently: –FEI4 Version 2 design –Sensor pre-production –sensor tests with FEI4 in test beam and irradiations –IBL module and bump-bonding of thin chips –Stave flex –IST and integration tools, mock-up Main topic is now the launch of production (component orders) –FEI4 –B –Sensor choice July 4-5 and order to manufacturers –Launch of bump-bonding order with IZM –Demonstration of Stave-0 and full stave readout –Production of components for staves, support and tools Enter production for modules and staves this autumn