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ATLAS SCT Endcap Detector Modules Lutz Feld University of Freiburg for the ATLAS SCT Collaboration Vertex 2002 5.6m.

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Presentation on theme: "ATLAS SCT Endcap Detector Modules Lutz Feld University of Freiburg for the ATLAS SCT Collaboration Vertex 2002 5.6m."— Presentation transcript:

1 ATLAS SCT Endcap Detector Modules Lutz Feld University of Freiburg for the ATLAS SCT Collaboration Vertex m

2 Vertex 2002Lutz Feld, Freiburg University2 Endcap Disks covered by 3 Rings of Modules outer modules inner modules cooling block power tapes middle modules (on backside) 9 disks in each endcap, ~1.2m diameter CF structure 132 detector modules on a full disk, 1976 endcap modules in total modules have central mounting and cooling point  module overlap easy each module serviced by a power tape and 3 optical fibres evaporative cooling circuits serve up to 13 modules

3 Vertex 2002Lutz Feld, Freiburg University3 3 Module Types outer module (52 per ring) inner module (40 per ring) middle module (40 per ring)

4 Vertex 2002Lutz Feld, Freiburg University4 Endcap Module Design: Silicon Sensors strip direction 4 wedge shape silicon sensors 768 p-in-n strips, single sided supplied by Hamamatsu and CiS sensor alignment < 5µm 40mrad stereo angle

5 Vertex 2002Lutz Feld, Freiburg University5 Endcap Module Design: „Spine“ strip direction sensors are glued to „spine“: TPG bar for heat removal (1700 W/m/K) AlN wings for mechanical stability mounting points and cooling contacts

6 Vertex 2002Lutz Feld, Freiburg University6 Endcap Module Design: Hybrid strip direction hybrid: flex circuit on carbon-carbon hybrid connected to sensors only by fanins  thermal split 12 ABCD3TA binary read-out chips (DMILL)

7 Vertex 2002Lutz Feld, Freiburg University7 Hybrid development of hybrid was critical and needed several iterations very low impedance is key for successful operation of binary ABCD chips requirements: double sided, 12 readout chips supply well filtered analogue/digital power com/data lines and drivers for optical link detector bias supply (up to 500V) heat removal (7W) low mass implementation: 6 layer copper/Kapton flex circuit ~75µm feature size, ~3000 micro vias flex folded around carbon-carbon substrate full assembly and basic testing in industry

8 Vertex 2002Lutz Feld, Freiburg University8 Thermal Performance of Endcap Module evaporative C 3 F 8 cooling system, capable to cool down to –30°C central module cooling block, split between hybrid and detectors, long modules have additional far end cooling block detailed simulations, confirmed by measurements of non-irradiated and irradiated modules on an evaporative cooling test rig expected after 10 years inner moduleouter module detector temperature vs. radiation damage for coolant at –21°C

9 Vertex 2002Lutz Feld, Freiburg University9 Electrical Performance binary front-end chip  occupancy vs. threshold  „s-curves“ signal height and noise are derived from „s-curves“ relevant for operation: hit efficiency and noise occupancy noise occupancy determined by –front-end noise (fixed for given ASIC and detector) –channel-to-channel threshold variations (threshold trim per channel) –additional noise: common mode, feedback etc. (the difficult part...) occupancy vs. channel and thresholdoccupancy vs. threshold

10 Vertex 2002Lutz Feld, Freiburg University10 16 Prototype Modules 9 outer, 2 middle, 5 inner modules built reliably inside tolerances, in several institutes noise 1500 e or less noise ~10 -5 gain ~50mV/fC threshold spread 150 e ENC noise threshold spread gain

11 Vertex 2002Lutz Feld, Freiburg University11 System Test: 4 Modules on a Disk Sector with 4 modules on disk no extra noise common mode noise negligible noise for each chip when operated  simultaneously  singly common mode noise

12 Vertex 2002Lutz Feld, Freiburg University12 Testbeam Results binary read-out: efficiency and noise occupancy at given threshold spec: single hit efficiency > 99% while noise occupancy < 5E-4 long modules before / after irradiation to 1.6 or 3.3 E14 24GeV-p/cm 2 in a beam of 180 GeV pions 10 years LHC operation ~2.6 E14 p/cm 2 spatial resolution of 23µm achieved, as expected from pitch/sqrt(12) 150V bias 1.6E14 24GeV-p/cm 480V bias 3.3E14 24GeV-p/cm 480V bias

13 Vertex 2002Lutz Feld, Freiburg University13 Summary & Outlook ATLAS SCT endcap modules final design review in August 02 now preparing for production of 2000 modules (+spares): –ASICs and detectors: ~80% delivered –hybrid: pre-series of 100 pieces in production, first samples delivered; for production: full assembly and basic testing in industry –spines and fan-ins: pre-series in production, first samples delivered; production can start soon module assembly and QA at 7 sites –good experience with assembly of prototype modules (>20) –preparation of production tooling and qualification over next months –production will take about 1.5 years


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