1. P i x e l 2 0 0 2 - C a r m e l Sept. 9, 2002M. Garcia-Sciveres - The ATLAS Pixel Detector1 The ATLAS Pixel Detector Pixel 2002 Workshop M. Garcia-Sciveres Lawrence Berkeley National Lab

2. P i x e l 2 0 0 2 - C a r m e l Sept. 9, 2002M. Garcia-Sciveres - The ATLAS Pixel Detector2 Aerial View of the LHC Site Circumference of 27 km Main CERN Site

3. P i x e l 2 0 0 2 - C a r m e l Sept. 9, 2002M. Garcia-Sciveres - The ATLAS Pixel Detector3 A Toroidal LHC ApparatuS Calorimeters Inner Tracking Superconducting Toroids Muon Detectors Tall person Superconducting Solenoid LHC beam pipe

4. P i x e l 2 0 0 2 - C a r m e l Sept. 9, 2002M. Garcia-Sciveres - The ATLAS Pixel Detector4 ATLAS Inner Detector

5. P i x e l 2 0 0 2 - C a r m e l Sept. 9, 2002M. Garcia-Sciveres - The ATLAS Pixel Detector5 Pixel Detector 1.3m 3 hit design

6. P i x e l 2 0 0 2 - C a r m e l Sept. 9, 2002M. Garcia-Sciveres - The ATLAS Pixel Detector6 ATLAS Pixel Collaboration University of Toronto, Canada Academy of Sciences of the Czech Republic Czech Technical University Charles University, Czech Republic CPPM, France U. of Bonn, Germany U. of Dortmund, Germany MPI, Germany U. of Siegen, Germany U. of Wuppertal, Germany INFN Genova, Italy INFN Milano, Italy INFN Udine, Italy Academia Sinica, Taiwan SUNY Albany, USA LBNL, USA Iowa State U., USA U. of New Mexico, USA Ohio State U., USA U. of Oklahoma, USA UC Santa Cruz, USA U. of Wisconsin Madison. USA

7. P i x e l 2 0 0 2 - C a r m e l Sept. 9, 2002M. Garcia-Sciveres - The ATLAS Pixel Detector7 Detector Parameters 3 Barrel layers, 3+3 Disks covering |  |<2.5 Inner radius: ~5cm Outer radius: ~12cm n+ on n oxygenated sensors, 400  m (z,R) x 50  m (phi) pixels. Number of channels 67M (barrel) + 13M (disks). Readout type: zero-suppressed time over threshold. Lifetime Dose, 10 15 neq/cm 2, 50MRad. LHC Interaction rate: 40MHz. Max readout rate: 160Gb/sec => 7KHz trigger at 1% occupancy. ASICs: 0.25  m CMOS with rad. Tolerant layout. AC signal protocol: LVDS in active volume, optical outside. Active volume operating power: 6.5kW at 2V Silicon operating temperature: <0 o C Cooling system: evaporative C 3 F 8. Radiation length at normal incidence: ~10% R.L.

8. P i x e l 2 0 0 2 - C a r m e l Sept. 9, 2002M. Garcia-Sciveres - The ATLAS Pixel Detector8 Performance  =9  m  =13  m Test beam measurement of single Front End chip bump bonded assembly. For single hits expect  =sqrt(12) x pitch ~ 14  m. Test beam measurement of hit efficiency unirradiated and fully irradiated assemblies. Time (10ns/div.) 0 1 Efficiency

9. P i x e l 2 0 0 2 - C a r m e l Sept. 9, 2002M. Garcia-Sciveres - The ATLAS Pixel Detector9 Sensors Simulation of 70% depletion voltage at innermost layer. 150% LHC nominal fluence. 2 Manufacturers: CIS and Tesla Basic Requirements: –Leakage current after 10 15 neq/cm 2 : <50nA / pixel –Total input capacitance: <400fF –Inter-pixel capacitance: small –Signal after irradiation: >10Ke -

10. P i x e l 2 0 0 2 - C a r m e l Sept. 9, 2002M. Garcia-Sciveres - The ATLAS Pixel Detector10 Sensors (cont.) Charge collection efficiency (meas) n+ implants and bias grid 100mm wafer with 3 “tiles”, n side Detail of p-side multi guard ring structure

11. P i x e l 2 0 0 2 - C a r m e l Sept. 9, 2002M. Garcia-Sciveres - The ATLAS Pixel Detector11 Custom ASIC Electronics Suite of chips all fabricated in 0.25  m commercial bulk CMOS. Use circuit library with special layout rules for radiation tolerance (based on RD49 library) Doric (from PIN diode to decoded LVDS) VDC array (from LVDS to laser diodes) Front End Chip 2880 channels Module Control Chip Manages data & control between module’s 16 chips Optical interface chips

12. P i x e l 2 0 0 2 - C a r m e l Sept. 9, 2002M. Garcia-Sciveres - The ATLAS Pixel Detector12 Readout architecture FE chip sensor FE chip Module Control Chip Optical driver Optical receiver power HV bias bump bonds LVDS control LVDS data out 1m 100m optical

13. P i x e l 2 0 0 2 - C a r m e l Sept. 9, 2002M. Garcia-Sciveres - The ATLAS Pixel Detector13 Xray of bumps 16 chips. 46,080 bump bonds Solder Bumps SensorICs The “Bare” Module 50  m Indium Bumps OR 6.3cm 2cm

14. P i x e l 2 0 0 2 - C a r m e l Sept. 9, 2002M. Garcia-Sciveres - The ATLAS Pixel Detector14 Pixel Module Schematic Cross Section (through here) Bumps Flex Hybrid (green) Sensor Wirebonds ASICs Pigtail (beyond)

15. P i x e l 2 0 0 2 - C a r m e l Sept. 9, 2002M. Garcia-Sciveres - The ATLAS Pixel Detector15 Interconnection Flex hybrid. Interconnects 16 Front End chips to 1 Module Control. Distributes power to all chips and bias to sensor. All connections wirebonded. Flex pigtail + Al/Cu wire bundle connect flex hybrid to patch panels at either end of pixel detector. Transition to optical at ends of pixel detector. Power continues on Al/Cu wires to end or inner detector.

16. P i x e l 2 0 0 2 - C a r m e l Sept. 9, 2002M. Garcia-Sciveres - The ATLAS Pixel Detector16 Production line oriented design Flex hybrids mounted on frames immediately after fabrication. All module assembly proceeds on frame. Allows safe shipping & handling, testing, bar-code tracking, storage. Modules are removed from frame (by cutting sacrificial ends of flex) only at the time of attaching to a local support. Bar code Fully assembled module on frame

17. P i x e l 2 0 0 2 - C a r m e l Sept. 9, 2002M. Garcia-Sciveres - The ATLAS Pixel Detector17 Detector building blocks Bi-stave assembly Is replicated to form Barrel layers. 2x13 modules Sector is replicated to form disks. 3+3 modules (back side looks the same) Same unit repeated many times for production line assembly, uniformity of work at different sites

18. P i x e l 2 0 0 2 - C a r m e l Sept. 9, 2002M. Garcia-Sciveres - The ATLAS Pixel Detector18 Mechanics and services In the detector volume: –high power density –minimum material (=> no thermal mass) –cold operation –<10  m alignment maintained between room and operating temperatures –Remain cold & dry even during down times Outside detector volume: –Supply 2V power from 100m away with acceptable voltage drop –Supply adequate cooling with minimal plumbing –Meet overall detector geometry and installation constraints –Minimize material in front of calorimeters at low angles

19. P i x e l 2 0 0 2 - C a r m e l Sept. 9, 2002M. Garcia-Sciveres - The ATLAS Pixel Detector19 Module support Exploded view of sector Stave

20. P i x e l 2 0 0 2 - C a r m e l Sept. 9, 2002M. Garcia-Sciveres - The ATLAS Pixel Detector20 1 st mode 515.6 Hz 1 st mode546 Hz Global Support F.E.A. Real life prototype Disk section of frame Solid computer model of frame (cutaway view) TV Holograph image Need very stiff low mass structures with near zero CTE (build at room temperature- operate down to –25C). Use carbon composites, intense computer modeling & simulation barrel disks

21. P i x e l 2 0 0 2 - C a r m e l Sept. 9, 2002M. Garcia-Sciveres - The ATLAS Pixel Detector21 Pixel and Beam Pipe Assembly Service and Beampipe Support Pixel Detector A “package” that can be inserted in place into the inner detector (and removed also) Fits into a support tube that provides mechanical support, but also electrical and environmental isolation from the outside. Cold inside & dry inside & out no matter outside conditions

22. P i x e l 2 0 0 2 - C a r m e l Sept. 9, 2002M. Garcia-Sciveres - The ATLAS Pixel Detector22 Construction Timeline Sensor production: started Pre-production chip submission: Dec. 2002 Production chip submission: Summer 2003 End Production Module assembly: Dec. 2004 Start integration at CERN: Jan. 2005 Start lowering detector into cavern: Fall 2005 Begin commissioning: Spring 2006 First collisions: 2007