1. ALICE ITS Coordination Board 16 July 2013 L. Musa 1

2.  CET + 6h  CET +3h  CET +7h  CET -1h  CET -9h  CET +1h  CET +2h WP meetings 15h - 18h WP meetings 15h - 18h TDR - draft 2

3. Project Leader L. Musa Deputy Project Leader V. Manzari Technical Coordinator - Physics Performance A. Dainese Simulation, Calibration and Reconstruction J. Belikov, M. Masera Pixel Chip Design L. Musa Sensor Post-processing Mass testing P. Riedler Sensors Characterization and qualification M. Mager Inner Layers A. Di Mauro Middle Layers - Outer Layers P. Kuijer, V. Manzari Readout Electronics P. Giubilato Mechanics Cooling C. Gargiulo Institute Board PL, DPL, TL Project Coordination PL: Project Leader DPL:Deputy Project Leader TL:Institute Team Leader TC:Technical Coordinator WP:Work Package WPC: Work Package Convener 3 ITS Upgrade Project Management and Organization

4. The ITS Project Leader (PL) heads the Inner Tracking System project. He/she is assisted by the ITS Deputy Project Leader (DPL) and the ITS Technical Coordinator (TC). The ITS PL, DPL and TC are members of the ALICE TB and thus can assure the coherence of this project in the ALICE experiment in general. Institute Board Issues of financial, managerial and organizational nature are discussed and decided by the ITS Institute Board, which is chaired by the ITS PL. This Board also endorses technical matters recommended by the ITS Technical Board and proposed by the ITS PL. All Institutes participating in the ITS project are represented in the ITS Institute Board. PL, DPL and TC are ex-officio members of the Institute Board. Coordination Board The ITS Upgrade is organized in ten work-packages. The Work Package Coordinators (WPC) are nominated by the PL and endorsed by the ITS Institute Board. The WPCs are members of the ITS Coordination Board. The ITS CB discusses technical matters on a regular basis. PL, DPL and TC are ex-officio members of the ITS CB. Management of the ITS Project (draft text for TDR) 4

5. 2 nd AugustTDR Draft 0 available to ALICE ITS and MB 24 th SeptemberTDR Draft 1detailed presentation to LHCC 14 th OctoberTDR Draft 2available to ALICE 28 th October TDR 1.0 submission to LHCC 3 rd December TDR 1.1presentation to LHCC Presentation of TDR to ALICE and LHCC (proposal) 5

6. Project cost breakdown and planning are being review with the WPC and will be part of TDR Draft-0 Funding and preliminary distribution of responsibilities WILL NOT be part of TDR Draft-0 Discussions with all Institutes starting now and will continue till end of September Preliminary tables will be part of TDR 1.0 All team leaders will be contacted in the following two weeks to define dates for dedicated meetings Cost, Planning and Funding (proposal) 6

7. ItemCost (kCHF)Institutes PIXEL Chip4 200 CMOS Wafers3 000 Thinning & dicing 700 Series Test 500?? Inner Layer Stave 200 Flexible Printed Circuit 50?? Space-frame & Cold-plate 50 Stave assembly & Test 100 Middle Layers 750 Flexible Printed Circuit 200?? Module assembly & test 200 Space-frame & Cold-plate 150 Stave assembly & test 200 7 Cost break-down and preliminary distribution of responsibilities 1/4 (TDR draft 0)

8. ItemCost (kCHF)Institutes Outer Layers 1500 Flexible Printed Circuit 600?? Module assembly & test 300 Space-frame & Cold-plate 300 Stave assembly & test 300 Mechanics (support, assembly, installation) 600 Inner Layers 50 Middle Layers 150 Outer Layers 200 Outer Shell 50 Service Cones 100 Installation 50 8 Cost break-down and preliminary distribution of responsibilities 2/4 (TDR draft 0)

9. ItemCost (kCHF)Institutes Readout Electronics 800 Data e-Links 500 Common Readout Units 200 Patch Panels 100 Power supply and distribution1300 Power Supplies1000 On-detector regulators 200 Cabling 100 Cooling 500 Detector Control System 200 Total10050 9 Cost break-down and preliminary distribution of responsibilities 3/4 (TDR draft 0)