1. Pb-Free Electronics Risk Management (PERM)

2. What PERM is: A Consortium sponsored by the Aerospace Industries Association (AIA) Includes industry and government organizations with a common interest in managing the risks of Pb-free electronics in Aerospace, Defense, and other High Performance (ADHP) industries Evolved from merger of GEIA’s Lead-free Electronics in Aerospace Project (LEAP) WG and the DoD Executive Lead-free Integrated Process Team (ELF IPT) Purpose Provide a long-term overall ADHP strategy to deal effectively with Pb-free electronics issues Resulting in a coordinated approach to manage the evolving risks from the global electronics industry transition to Pb-free electronics Strategy Technical knowledge: Identify sources of information, including research projects, to understand the issues and risks associated with Pb-free electronics, and establish the knowledge base to manage and mitigate them Requirements: Develop common requirements to manage ADHP use of Pb-free electronics Implementation: Implement the requirements across the links of the supply chain that are within ADHP control Verification: Develop and implement criteria and processes to verify that the requirements are being verified

3. Deliverables: GEIA-HB-0005-1: Program Management/Systems Engineering Guidelines For Managing The Transition To Lead-Free Electronics GEIA-HB-0005-2: Technical Guidelines for Aerospace and High Performance Electronic Systems Containing Lead-free Solder and Finishes GEIA-HB-0005-3: Rework/Repair Handbook to Address the Implications of Lead-Free Electronics and Mixed Assemblies in Aerospace and High Performance Electronic Systems GEIA-STD-0005-1: Performance Standard for Aerospace and High Performance Electronic Systems Containing Lead-free Solder GEIA-STD-0005-2: Standard for Mitigating the Effects of Tin Whiskers in Aerospace and High Performance Electronic Systems GEIA-STD-0005-3: Performance Testing for Aerospace and High Performance Electronic Interconnects Containing Pb-free Solder and Finishes GEIA-STD-6: Requirements for Using Solder Dip to Replace the Finish on Electronic Piece Parts AIA Issue Paper: Reliability Assessment of Lead-free Electronics in the Aerospace, Defense and High Performance Electronics Industries Pb-Free Electronics “Manhattan Project” Captured current “Best Practices” Identified issues and short-comings needing resolution Established a 3 year Roadmap for research & development projects

4. Current Efforts: Performing maintenance of previously released GEIA HBs & STDs GEIA-HB-0005-4: Guidelines for Performing Reliability Assessment for Pb Free Assemblies used in Aerospace and High-Performance Electronic Applications (Currently in DRAFT) Pb-free Electronics Risk Reduction Project Follow-on effort to “Manhattan Project” Working with OSD to identify / prioritize projects for funding Coordination efforts: OSD Technology Focus Team Identify/prioritize projects Encourage release of policy DSPO LSA For Soldering Technologies DoD Soldering Technologies WG AIA Supplier Management Council (SMC) Engaging piece/part manufacturers to address platform integration and system development concerns Beneficiaries Advisory Council Represent the US Departments of Defense, Energy, and Transportation, NASA, FAA and relevant industry organizations International Advisory Group (International Beneficiaries) Non-U.S. Governments, Agencies, Companies, and Academia