1. THEMIS Instrument Suite PEREFI- 1 UCB, May 2, 2005 THEMIS Solid State Telescope (SST) Instrument Suite PER The THEMIS SST, IDPU and II&T Teams

2. THEMIS Instrument Suite PEREFI- 2 UCB, May 2, 2005 Personnel and Organization SST Organizational Chart ( all UCB unless noted ): Davin Larson - Lead Ron Canario - Electrical Robert Lee - Mechanical Thomas Moreau – Design/Testing (Postdoc) Jianxin Chen – FPGA programmer (Outside contractor)

3. THEMIS Instrument Suite PEREFI- 3 UCB, May 2, 2005 SST Mission Requirements Fulfillment

4. THEMIS Instrument Suite PEREFI- 4 UCB, May 2, 2005 REQUIREMENTSST DESIGN IN-1. The Instrument Payload shall be designed for at least a two-year lifetime Compliance. Lifetime has been considered in all aspects of SST design (parts, performance degradation, etc). Primary Impact: Attenuator added to protect detectors from “radiation”. IN-2. The Instrument Payload shall be designed for a total dose environment of 33 krad/year (66 krad for 2 year mission, 5mm of Al, RDM 2) Compliance. All parts screened for total dose. Radiation testing planned if TID is unknown. (All major parts tested to 50 krad.) IN-3. The Instrument Payload shall be Single Event Effect (SEE) tolerant and immune to destructive latch-up Compliance. Most parts screened for SEE. Radiation testing planned if LET is unknown. IN-7. No component of the Instrument Payload shall exceed the allocated mass budget in THM-SYS-008 THEMIS System Mass Budget.xls Compliance. Sensor: 554 gm x2 (Measured) Harness: 141 gm x2 (1.73 meter) (DAP Board tracked with IDPU) IN-9. No component of the Instrument Payload shall exceed the power allocated in THM-SYS-009 THEMIS System Power Budget.xls Compliance. DFE + DAP: 1200 mW (Estimate @ 10 kHz count rate) IN-13. The Instrument Payload shall survive the temperature ranges provided in the ICDs Compliance. DAP: –40 to 65 DFE: -65 to 55 (Heater required to survive eclipse) IN-14. The Instrument Payload shall perform as designed within the temperature ranges provided in the ICDs Compliance. DAP: –30 to 40 DFE: -55 to 55 Mission Requirements

5. THEMIS Instrument Suite PEREFI- 5 UCB, May 2, 2005 REQUIREMENTSST DESIGN IN-16 The Instrument Payload shall comply with the Magnetics Cleanliness standard described in the THEMIS Magnetics Control Plan Compliance?. THM-SYS-002 Magnetics Contamination Control Plan. Budget for SST Magnets is <2 nT @ 2 meters. (Compliance if SST budget is increased, still meets overall system budget) IN-17 The Instrument Payload shall comply with the THEMIS Electrostatic Cleanliness Plan Compliance. THM-SYS-003 Electrostatic Cleanliness Plan. Box electrically isolated. IN-18 The Instrument Payload shall comply with the THEMIS Contamination Control Plan Compliance. THM-SYS-004 Contamination Control Plan (Partially driven by SST; meets all specs) IN-19. All Instruments shall comply with all electrical specifications Compliance. THM-IDPU-001 Backplane Specification. IN-20. The Instrument Payload shall be compatible per IDPU-Instrument ICDs Compliance. THM-SYS-105 ESA and SST Electronics Card (ETC) Specification. IN-21. The Instrument Payload shall be compatible per the IDPU-Probe Bus ICD Compliance. THM-SYS-111 SST-to-Probe ICD. IN-23 The Instrument Payload shall verify performance requirements are met per the THEMIS Verification Plan and Environmental Test Spec. Compliance. THM-SYS-005 Verification Plan and Environmental Test Specification Plan. IN-24 The Instrument Payload shall survive and function prior, during and after exposure to the environments described in the THEMIS Verification Plan and Environmental Test Specification Compliance. THM-SYS-005 Verification Plan and Environmental Test Specification Plan. Mission Requirements

6. THEMIS Instrument Suite PEREFI- 6 UCB, May 2, 2005 REQUIREMENTSST DESIGN IN.SST-1. The SST shall perform measurements of the tailward-moving current disruption boundary speed using the finite gyroradius technique Compliance. Provided by Full Distribution Functions (FDFs). IN.SST-2. The SST shall measure the time-of-arrival of superthermal ions and electrons of different energies emanating from the reconnection region to determine RX onset time. Compliance. 3 second time resolution of FDFs IN.SST-3. The SST shall obtain partial moments of the plasma electron and ion distributions in the magnetotail plasma sheet Compliance. Partial moments produced by ETC board. IN.SST-4. The SST shall obtain measurements of ion and electron distribution functions with one spin resolution (<10sec required) Compliance. Full distribution functions at 1 spin resolution obtained in burst mode. IN.SST-5. The SST shall measure energetic electron fluxes as close to Earth as 6RE geocentric, at all local times. Compliance. Attenuator lowers flux sufficiently to avoid saturation at this distance IN.SST-6. The SST shall measure energetic ions in the solar wind, at the magnetopause and in the magnetosheath. Compliance. Science Requirements

7. THEMIS Instrument Suite PEREFI- 7 UCB, May 2, 2005 REQUIREMENTSST DESIGN IN.SST-7. The SST shall measure energetic particles over an energy range of 30-300keV for ions and 30- 100keV for electrons found in the magnetotail plasma sheet. Compliance. Electrons: ~30 keV to ~800 keV Ions: ~30 keV to ~2 MeV IN.SST-8. The SST energy sampling resolution, dE/E, shall be better than 30% for ions and electrons. Compliance. Intrinsic energy resolution is ~6 keV with 1.5 keV binning. Measured full system resolution is temperature dependent ~10 keV. IN.SST-9. The SST shall be capable of measuring differential energy flux in the range from: 10^2 to 5x10^6 for ions; 10^3-10^7 for electrons (keV/cm2-s -st- keV) whilst providing adequate counts within a 10 second interval. Compliance. Max counting rate estimated at 50,000 cps (per detector). Two geometric factors: G1 ~ 0.1 cm2-ster G2 = G1/64. IN.SST-10. The SST shall measure over 90 deg. in elevation with a minimum resolution of 45 deg. Compliance. Elevation: +/- 60 deg, Resolution:~37 deg. IN.SST-11. The SST shall have an azimuthal resolution of 45 deg. Compliance. Azimuthal resolution = 22.5 deg IN.SST-12. The SST shall supply the high energy partial moments at one spin time resolution. Compliance. Performed by ETC board IN.SST-13. SST calibration shall ensure <20% relative flux uncertainty over the ranges defined above. Compliance. Measured pre-flight; Verified by in-flight calibration. Performance Requirements

8. THEMIS Instrument Suite PEREFI- 8 UCB, May 2, 2005 MRD Functional Requirements The Tough requirements Energy Threshold - ~30 keV (at room temperature; determined by noise. Improves at lower temperature) Energy Resolution - ~10-12 keV ( at room temp; improves at lower temperature) Magnetic Cleanliness <1 nT at location of magnetometer <2 nT at 2 meter

9. THEMIS Instrument Suite PEREFI- 9 UCB, May 2, 2005 SST Status at I-PER Requirements and Design: –No major changes to Requirements since M-CDR (see Changes Since M-CDR and PFR Status for details). Procurement: –All parts procured with exception of detector stacks for P4, P5 and P6. Detector stack delivery delayed due to inadequate Aluminum layer on “O” detectors. Probe 1 Flight Sensors –Have gone through 1 Vibration test – Failure in mechanical structure –Rebuilt but not retested. –Have gone through TV but rework may invalidate tests Probe 2 Sensors –Includes ALL Mods –Passed Vibration –Passed Thermal Vac –Final Calibration scheduled: 2005-5-3 Probe 3 Sensors –Awaiting detector tests before final assembly –Vibe scheduled for 2005-05-6

10. THEMIS Instrument Suite PEREFI- 10 UCB, May 2, 2005 SST Changes Since M-CDR Changes to Mechanical and Electrical Designs: –Sensors –Mechanical Housing strengthened. –Additional light baffling and blacking added. –FET added to prevent preamp saturation during Sun Pulse. –Minor Mods to attenuator mechanism to improve reliability –DAP board –Minor changes to analog housekeeping. –FPGA mods added to control Sun Pulse Blackout. –Attenuator position feedback method changed to allow use of harness wires for sun pulse control. Still Open »If SMA supply is on: should have no impact on measured housekeeping value. »If SMA supply is off: Voltage will drift high due to 5k pull up resistor.

11. THEMIS Instrument Suite PEREFI- 11 UCB, May 2, 2005 Assembly test sequence Mechanical Assembly & Test Electrical Assembly & Test Mating (w/ pictures) Magnetic Characterization CPT Vibration Magnetic Characterization CPT Thermal Vac Magnetic Characterization CPT (?) Calibration 2005-01-03 2004-12-28

12. THEMIS Instrument Suite PEREFI- 12 UCB, May 2, 2005 Sensor Vibration History ETU #1 passed Qual vibration; but resonance had been improperly notched. ETU #2 Mechanical failure during 2nd Qualification vibration ETU #2 support structure added (band-aid approach) ETU #2 with support structure Passes Qual level Viibration test Flight units 01 and 02 (with band-aid) vibe tested –Sensor 1 passes –Sensor 2 has structural failure (epoxy delaminated) –Electrical systems on both units survive Outer casing strengthened and replaced on all units (ETU#2  ETU#3) ETU #3 passes Qualification level vibe Flight units delivered for suite level testing (without revibe) Flight sensors 03 and 04 have passed vibration.

13. THEMIS Instrument Suite PEREFI- 13 UCB, May 2, 2005 Sensor Test History During independent SST system tests of F1 and F2 discovered: –Current surge when the Amptek 225fb comes out of saturation following a sunpulse. (~100 mA for ~50 ms) –Does not affect the operation of the SST. –Current pulse perceived as a problem to other instruments. –Solution: add FET to turn off detector during sunpulse. –Inadequate light baffling in the sensor – corrected on all sensors –Flight detectors were more sensitive to light than expected. Inadequate Al layer on ‘O’ detectors. (detectors acceptable - not optimal) All mods are made on all sensors with exception of FETs in sensors F01 and F02 (currently in suite testing) Plan for F01 and F02 is to do rework following suite testing.

14. THEMIS Instrument Suite PEREFI- 14 UCB, May 2, 2005 SST Vibration Testing (Pictures of Probe 2 units)

15. THEMIS Instrument Suite PEREFI- 15 UCB, May 2, 2005 Per UCB THEMIS Document THM-SST-PRC-002 All 3 Axes Sine Survey, 0.5 G, 5 – 2000 Hz Sine Strength p er Swales TM2430-RevD, 29 November 2004 Random –Per Swales Document TM2430-RevD –12.51 G RMS –1 min duration per axis All Vibration Testing Performed at Quanta Laboratories Retesting (if required) ‘Workmanship Shake’ –Validate any design changes following original Flight build shake –Validate rework of any failures on previous vibration test Entire vibration protocol, single axis only Acceptance Sine Strength SpecificationAcceptance Level Random SpecificationSST Flight Unit SST Acceptance Level Dynamic Test

16. THEMIS Instrument Suite PEREFI- 16 UCB, May 2, 2005 SST Serial Number Test Date Following Initial BuildRetest Date (Rework/Redesign) 001, 002 13 Jan 05To be performed upon completion of suite level testing (Support Structure Reinforcment) 003, 004 22 Apr 05 - 005, 006 Mechanical assembly complete, awaiting electronics scheduled 6 May 2005 - 007, 008 Mechanical assembly complete, awaiting electronics - 009, 010 Mechanical assembly complete, awaiting electronics - 011, 012 Mechanical assembly complete, awaiting electronics - SST Acceptance Level Dynamic Test

17. THEMIS Instrument Suite PEREFI- 17 UCB, May 2, 2005 Deviations from Test Specification (Notching/Force Limiting/Aborts) -None SST First Natural Frequency: 213 Hz (Requirement: >75 Hz) Good Sine Survey Consistency from Unit to Unit (within 10 Hz) Retesting due to Hardware Redesign 1.Reinforcement plate bond failure led to stress fracture formation on SST 001 support structure Resolution: Support structure redesigned and strengthened in high stress areas Flight-like ETU passed qualification level dynamic test performed on 2 Feb 2005 Flight Unit Status Flight Units for Probe 1 scheduled for 2 nd vibration test upon completion of suite level testing Flight Units for Probe 2 completed vibration testing on 22 April 2005 Flight Units for Probe 3 scheduled for vibration testing on 6 May 2005 SST Acceptance Level Dynamic Test X-Axis TestingY-Axis TestingZ-Axis Testing

18. THEMIS Instrument Suite PEREFI- 18 UCB, May 2, 2005 SST TVAC Testing

19. THEMIS Instrument Suite PEREFI- 19 UCB, May 2, 2005 Thermal Profile

20. THEMIS Instrument Suite PEREFI- 20 UCB, May 2, 2005 SST Sensor Thermal Testing Status Actual profile for Sensors 01 and 02. Sensor 1 had no major problems Sensor 2 had failure of Attenuator mechanism due to GSE cable short.

21. THEMIS Instrument Suite PEREFI- 21 UCB, May 2, 2005 SST Thermal Vac test diagram SST GSE DAP Router DaqPad HP triple supply +5V, -5V, +2.5 Triple supply SMA: +3.9V, Heater:+25V Dual 26 pin feed through Thermal Isolators Door- Heater Test box PCB- Not used Am 241 All Sensor testing is done with a DAP board and GSE equipment.

22. THEMIS Instrument Suite PEREFI- 22 UCB, May 2, 2005 SST Sensors Two sensors tested simultaneously in “Themis snout” using thermal isolators 2 (4 if time permits) full cycles – Hot: +50 C Cold: –50 C 4 hours at each soak First cycle has additional non op soak at +55C and –65C Thermal Vac tests are aided with DAP/GSE external to chamber All counts, noise, HKP values are recorded with GSE The following variables are monitored and recorded continuously for each sensor (using DAQPAD at 1 sec resolution) –(2x2) Preg current (voltage across 0.3 Ohm) –(2x2) Nreg current (Voltage across 0.6 Ohm) –(2x1) Internal thermistor temperature (Vtherm - Powered by DAP) –(2x1) Heater current (voltage across 2 Ohm resistor) –(2x1) External thermistor temperature (Vth– Biased by GSE DaqPad Also recorded: –(1) Analog housekeeping channel –(1) Reference voltage Attenuator –Actuated manually (automatically on Probe 2 and later). –Close time / open time measured with a scope Thermocouple temperatures recorded by TV facility DAP Board – Tested with IDPU SST Sensor Thermal Testing measurements

23. THEMIS Instrument Suite PEREFI- 23 UCB, May 2, 2005 CP Tests SST Sensors testing in Thermal Vac Electrical – DFE assembly –Detector functionality –Detector gain (location of Am241 60 keV peak) –Baseline determination –Test Pulser response (calibration of test caps) –Noise characterization vs. Temperature –Bias current vs. Temperature –Thermistor checkout & calibration –Cross Talk –SPB FET functionality over temperature range (not yet done on P1 sensors) Mechanical –Attenuator Mechanism and feedback test. –Heater strip de-lamination testing –Thermostat cycle test (would like ~2 dozen cycles) –Kinematic Flexure testing Pre/Post testing Magnetic characterization –Magnetic dipole and quadrapole moments

24. THEMIS Instrument Suite PEREFI- 24 UCB, May 2, 2005 SST Magnetic Cleanliness Testing

25. THEMIS Instrument Suite PEREFI- 25 UCB, May 2, 2005 Mag cleanliness A magnetic test Fixture was built to determine the magnetic properties of the sensors. Precise magnetic moments (dipole, quadrapole, octapole. etc.) are determined for each sensor prior to and following Vibe and TV tests. Magnetic field maps are produced at 2 meter radius to determine the DC field at the location of the Magnetometer.

26. THEMIS Instrument Suite PEREFI- 26 UCB, May 2, 2005 Magnetic Test results (probe 1) Peak field ~1.2 nT Sensor 02 Magnetic Field map is determined for each sensor at 200 cm All Magnet cages have been measured and paired to reduce the DC field strength as seen at the location of the magnetometer for each probe Sensor 01 Peak field ~0.9 nT Requirement: <1 nT at 2 meter radius - NOT MET

27. THEMIS Instrument Suite PEREFI- 27 UCB, May 2, 2005 Magnetic Test results (probe 1) Sensor F001Sensor F002 The field strength at the location of the magnetometer is <1nT At location of magnetometer: <1 nT at location of Magnetometer - OK ~Location of magnetometer

28. THEMIS Instrument Suite PEREFI- 28 UCB, May 2, 2005 SST Functional Tests

29. THEMIS Instrument Suite PEREFI- 29 UCB, May 2, 2005 F1 Testing To-Date Sensors –Detectors –Light sensitivity –Leakage current measurement –Magnetic cleanliness. –Vibration. –Thermal Vacuum testing. –Attenuator operation. –Cable buzzing. –Mass properties DAP board –Functional (Board-Level) Test. SST (DAP and Sensors) –Calibration with Sources SST -IDPU (Suite-Level Integrated Instrument) –Attenuator operation –Noise tests –ETC communication –Suite-Level CPTs (DC- and AC-Functional, pre- and post-EMC, etc.). –Suite-Level EMI/EMC Test (see IDPU Presentation).

30. THEMIS Instrument Suite PEREFI- 30 UCB, May 2, 2005 SST Functional Tests Detector live test (using Am241 source, verify wire bond connection) Internal Test Pulser Test. External Test pulse test. Actel Operation Memory test Analog Mux operation Bias Voltage operation Baseline restoration Attenuator operation and feedback through DAP Noise measurement Sun pulse recovery tests Light leakage tests Magnetic moments measurement SPB FET Functionality

31. THEMIS Instrument Suite PEREFI- 31 UCB, May 2, 2005 Calibration Sensors tested individually using the both the ETU DAP board and on the Flight Dap board DAP board calibrated separately using external test pulse generator. Flight Board calibrated separately using external test pulse generator. (must be repeated) DAP/Sensor suite calibrated using Am 241 source. DAP/Sensor suite to be calibrated using electron and ion gun (Not yet done on Flight Units)

32. THEMIS Instrument Suite PEREFI- 32 UCB, May 2, 2005 SST PFR Status

33. THEMIS Instrument Suite PEREFI- 33 UCB, May 2, 2005 PFRSTATUS PFR-008, ETU Vibration failure.Closed. See PFR-011 PFR-009, SST Attenuator in Thermal VacClosed. Replaced GSE cables, new Procs PFR-011, SST Reinforcement Plate Epoxy Vib Failure Closed. New Reinforced structure. PFR-037, SST Interference with EFIClosed. (This had little to do with SST) PFR Status