1. THEMIS Instrument CDR 1 UCB, April 19-20, 2004 Integration and Test Critical Design Review Rick Sterling University of California – Berkeley Thm_CDR_IT_Revc

2. THEMIS Instrument CDR 2 UCB, April 19-20, 2004 Agenda Requirements and Responsibilities Facilities (Integration and Environmental) Instrument I&T Requirements Instrument I&T Set-up (MGSE, EGSE) Instrument I&T Flows Instrument-Spacecraft Integration Issues

3. THEMIS Instrument CDR 3 UCB, April 19-20, 2004 Responsibilities Provide Clean Room Facility (Room 125) Access Control & Clean Room Training Develop MGSE –Instrument Harness Mockups & Test Platforms Fabricate Instrument Harnessing Support Instrument-Provided GSE –Mu-Metal Enclosures for FGM & SCM –N2 Purge Systems for ESA, SST –Sphere Sensor Boxes for EFI Integrate & Functional Test of EM, F1-F6 Provide EMC, MAG, Vibration & TV Testing Daily Logistic Planning & “Standup” meetings Deliver & Support to Swales for Spacecraft I&T

4. THEMIS Instrument CDR 4 UCB, April 19-20, 2004 Facilities – Integration Lab Instrument Integration Lab Secure Key-Coded Lock Class 100K Clean room Air Quality Monitored Weekly by Assurance Positive Air Flow Feed Thru’s to Adjacent Lab Gowning Area Storage Shelving for Component Storage Separate Flight and non-Flight Storage Oxygen Sensor (when Nitrogen Purge used) Used for HESSI, CHIPSAT, Stereo Impact

5. THEMIS Instrument CDR 5 UCB, April 19-20, 2004 Thermal Chambers Space Sciences Lab New Chamber for EFI Booms Cal Chamber Upgrade for SST Test Chamber Requirements Pre-Test Clean Pre-Test Bakeout TQCM Monitoring Cryo-Pump Final Bakeout GN2 Backfill Vibration Facilities Wyle AMES EMI/EMC EMCE Engineering – Fremont Facilities - Environmental Available ChambersType HiBay L1TVAXB Booms HiBay L2TVSTEREO 320 T10TVSTEREO 320 CalVacESA Cal 320 “Mini”TVSCM, Bake-outs B20-TV “Bayside”TVEFI B20-Large TVTVPayload TV B20-Cal VAC2VacSST Cal B20-TV “Snout”TV Comment 339-TV Cal SST, IDPU, EFI ESA MCPs

6. THEMIS Instrument CDR 6 UCB, April 19-20, 2004 “Large Chamber(“Bertha”) Developed for EUVE 8’ diam x 16’ depth Adding thermal capability Can do two Themis units at a time if desired.

7. THEMIS Instrument CDR 7 UCB, April 19-20, 2004 Other Chambers Basement SSL Being refurbished

8. THEMIS Instrument CDR 8 UCB, April 19-20, 2004 Chamber for Boom Deploy “Jeffrey” EFI AXB scheduled for 5/04 Developed for Stereo Sharing with Stereo There is another chamber with “snout” extension for boom deploy testing.

9. THEMIS Instrument CDR 9 UCB, April 19-20, 2004 Chamber Schedule

10. THEMIS Instrument CDR 10 UCB, April 19-20, 2004 Chamber Schedule

11. THEMIS Instrument CDR 11 UCB, April 19-20, 2004 Thermal Testing TV Plan 2 Component-Level TV Cycles Prior to Instrument-Level I&T 6 Instrument Level TV Cycles at Instrument-Level Survival, Cold Start, Cycles (Functional at extremes), Bake-out Deployments in Vacuum SPB: Full Deploy w Takeup reel AXB: Deploy Hot & Cold MAG: First Motion Hot & Cold Typical TV Profile:

12. THEMIS Instrument CDR 12 UCB, April 19-20, 2004 Instrument Cleanliness/Contamination Requirements ESA and SST require continual nitrogen gas purge Regulate and use viewcam to monitor remotely Oxygen meter following instruments and gas purge equipment Normal ESD concerns Magnetometer sensor to be boxed except when under test and before flight Instrument-Provided GSE Accommodation Mu-Metal Enclosures for FGM & SCM N2 Purge Systems for ESA, SST Sphere Sensor Boxes for EFI Instrument Red/Green Tag Items Tracking IDPU - Arming plug enables actuators causing boom deployment EFI - Electrical: 4 SPB Test/enable plugs plus one AXB test/enable plug EFI - Mechanical: 4 SPB Snout Covers plus 2 AXB Tube Covers SST - Covers to be removed before flight ESA - Cover; Arming plug; purge fitting;cocking pin nut Instrument Requirements

13. THEMIS Instrument CDR 13 UCB, April 19-20, 2004 Integration Set-up - Instruments at SSL integrated on platform same form factor as probe - 80/20 framing supports platform and sets comfortable work height - Metal rack alongside holds electrical GSE (power supply, UPS, scope) - GSE communicates with BAU Simulator via hardwire or ethernet INSTRUMENT PAYLOAD ASSEMBLY PLATE

14. THEMIS Instrument CDR 14 UCB, April 19-20, 2004 Instrument Payload I&T Flow FGM Functional (Level 2) SCM Functional (Level 2) SST Functional (Level 2) Harness Bake-out IDPU-Harness Safe-to-Mate Payload EMC/EMI/MAGl Payload T-V ESA Functional (Level 2) Test Review Instrument PER MAG INTEGRATION EFI INTEGRATION ESA/SST INTEGRATION PAYLOAD ENVIRONMENTAL PayloadVibration Payload Acceptance ONLY if req’d (workmanship) Mag Alignment EFI AXB Deploy EFI SPB Deploy Mag Boom Deploy EFI Functional (Level 1) EFI Functional (Level 2) EFI/SCM/FGM Phasing ESA/SST Timing Payload CPT

15. THEMIS Instrument CDR 15 UCB, April 19-20, 2004 FGM I&T Flow FGS Vibration FGS Thermal IDPU Safe-to-Mate IDPU/ESA/ SCM Pre-Amp Vibration FGS Acceptance FGM Functional (Level 2) Inspection Mass Properties DC Magnetics 2 cycles T-V Bake-out +60C Sensor in TCU FGE Acceptance FGM Functional (Level 0) Without FGS Inspection IDPU Thermal 2 cycles T-V Bake-out +60C FGS Functional (Level 1) FGB Vibration FGB/SCB Thermal 1 cycle T-V Hot/Cold Deploy FGB Acceptance Inspection Mass Properties DC Magnetics Backplane Alignment EFI/SCM/FGM Phasing Mag Boom Deploy Payload Safe-to-Mate Harness Payload EMI/EMC/MAGl Payload T-V 6 cycles T-V FGM Functional Lev1) IDPU Acceptance Inspection Mass Properties DC Magnetics Test Review Boom Levels Instrument PER FGM BOOM (FGB) FGM SENSOR (FGS) FGM ELECTRONICS (FGE) FGM / PAYLOAD INTEGRATION PAYLOAD ENVIRONMENTAL Payload Vibration Payload Acceptance ONLY if req’d (workmanship)

16. THEMIS Instrument CDR 16 UCB, April 19-20, 2004 FGM Level 0 – Without Sensor (Aliveness) B-field about zero if FGM in Cal Mode (preferred mode) B-field saturated if feedback is closed Interface full functional Power consumption reduced by about 200mW FGM Level 1 – Sensor in Mu-metal cap (Limited Performance Test) B-field about 10,000nT, Noise about 1nT Full functionality, but B-field not representative FGM Level 2 – Sensor in TCU (Comprehensive Performance Test) B-field < 10nT, Noise <10pT/sqrt (Hz) B-field has to be available in full quality Delta in calibration coefficients known FGM Test Configurations

17. THEMIS Instrument CDR 17 UCB, April 19-20, 2004 SCM I&T Flow SCM Sensor Vibration SCM Sensor Thermal SCM Pre-Amp Bake-out IDPU/ESA/ SCM Pre-Amp Vibration SCM Sensor Bake-out Functional (Level 3) Bake-out +60C 3 cycles (air) SCM Sensor in Mu Metal SCM Pre-Amp Thermal SCM Pre-Amp Acceptance IDPU Thermal 2 cycles T-V Bake-out +60C SCM Functional (Level 1) SCB Vibration 14.1g RMS FGB/SCB Thermal 1 cycle T-V Hot/Cold Deploy SCB Acceptance Inspection Mass Properties DC Magnetics Bake-out +60C Alignment EFI/SCM/FGM Phasing Mag Boom Deploy Payload Safe-to-Mate Harness Payload EMI/EMC/MAGl Payload TV 6 cycles T-V SCM Functional (Lev 2) IDPU Acceptance Inspection Mass Properties DC Magnetics Test Review Boom Levels Instrument PER SCM BOOM (SCB) SCM SENSOR (SCM) SCM PRE-AMP SCM / PAYLOAD INTEGRATION PAYLOAD ENVIRONMENTAL Payload Vibration Payload Acceptance ONLY if req’d (workmanship) SCM Sensor Acceptance Inspection Mass Properties DC Magnetics 3 cycles (air) Inspection Mass Properties DC Magnetics

18. THEMIS Instrument CDR 18 UCB, April 19-20, 2004 SCM Test Configurations SCM Safety – Feedback Plug Required when SCM Pre-Amp is powered and sensor is not connected SCM Level 0 – With SCM EGSE I/F Box (Aliveness) Same Power, Command, Analog output interfaces Power and Cal Mode identification by LED Cal Signal re-injected to the input Signal generator connected to input Validation by analysis of data SCM Level 1, 2 – Sensor in Mu Metal Box (Comprehensive Performance Test) Sensor kept in mu metal box during integration Axis identification Re-verification of end-to-end calibration Phase relation Check of conducted noise SCM/EField timing reference

19. THEMIS Instrument CDR 19 UCB, April 19-20, 2004 ESA I&T Flow ESA Functional (Level 2) Instrument Functional Cover Simulator Test ESA Thermal ESA Acceptance Inspection Mass Properties DC Magnetics ESA/SST Timing Payload Safe-to-Mate Harness Payload EMI/EMC/MAG Payload T-V 6 cycles T-V ESA Functional (Lev 1) Test Review Instrument PER ESA SENSOR ESA ELECTRONICS (ETC) ESA / PAYLOAD INTEGRATION PAYLOAD ENVIRONMENTAL Payload Vibration Payload Acceptance ONLY if req’d (workmanship) 2 cycles T-V Bake-out +60C IDPU Safe-to-Mate IDPU/ESA/ SCM Pre-Amp Vibration ESA Functional (Level 0) IDPU Thermal 2 cycles T-V Bake-out +60C Backplane IDPU Acceptance Inspection Mass Properties DC Magnetics ETC Acceptance Inspection

20. THEMIS Instrument CDR 20 UCB, April 19-20, 2004 SST I&T Flow SST Functional (Level 2) SST w/ Radiation Source Attenuator Test SST Vibration SST Thermal SST Acceptance Inspection Mass Properties DC Magnetics ESA/SST Timing Payload Safe-to-Mate Harness Payload EMI/EMC/MAGl Payload T-V 6 cycles T-V SST Functional (Level 1) Test Review Instrument PER SST SENSOR SST ELECTRONICS (DAP and ETC) SST / PAYLOAD INTEGRATION PAYLOAD ENVIRONMENTAL Payload Vibration Payload Acceptance ONLY if req’d (workmanship) 2 cycles T-V Bake-out +60C IDPU Safe-to-Mate IDPU/ESA/ SCM Pre-Amp Vibration DAP Acceptance SST Functional (Level 0) Without SST Inspection IDPU Thermal 2 cycles T-V Bake-out +60C Backplane IDPU Acceptance Inspection Mass Properties DC Magnetics ETC Acceptance Inspection

21. THEMIS Instrument CDR 21 UCB, April 19-20, 2004 EFI I&T Flow EFI Pre-Amp Bake-out EFI AXB Deploy Sensor in Mu Metal EFI Pre-Amp Thermal EFI Pre-Amp Acceptance AXB Vibration AXB Thermal 1 cycle T-V Hot/Cold Deploy AXB Acceptance Inspection Mass Properties DC Magnetics Bake-out +60C EFI Functional (Level 2) EFI/SCM/FGM Phasing EFI SPB Deploy Payload Safe-to-Mate Harness Payload EMI/EMC/MAGl Payload T-V 6 cycles T-V EFI Functional (Lev 1) Test Review Instrument PER EFI AXIAL BOOM (AXB) EFI RADIAL BOOM (SPB) EFI PRE-AMP EFI / PAYLOAD INTEGRATION PAYLOAD ENVIRONMENTAL Payload Vibration Payload Acceptance ONLY if req’d (workmanship) 3 cycles (air) Inspection Mass Properties DC Magnetics EFI ELECTRONICS (BEB and DFB) SPB Vibration SPB Thermal 1 cycle T-V Hot/Cold Deploy SPB Acceptance Inspection Mass Properties DC Magnetics EFI Pre-Amp Vibration IDPU Safe-to-Mate IDPU/ESA/ SCM Pre-Amp Vibration BEB Acceptance EFI Functional (Level 0) Without sensors Inspection IDPU Thermal 2 cycles T-V Bake-out +60C Backplane IDPU Acceptance Inspection Mass Properties DC Magnetics DFB Acceptance Inspection

22. THEMIS Instrument CDR 22 UCB, April 19-20, 2004 Instrument I&T with SC Berkeley to Provide: GSE Equipment for independent verification instrument operation. Purge monitoring support Safety control support (securing of deployable items etc)

23. THEMIS Instrument CDR 23 UCB, April 19-20, 2004 Schedule – Overview of Key Dates ETU: I & T 7/04 – 8/04 Integrating and Testing Flight Units Fall 2004 – Spring 2005. Delivery P1: 2/10/05 Delivery P2: 4/6/05 Delivery P3: 5/4/05 Delivery P4: 6/6/05 Delivery P5: 7/1/05 With each instrument suite we deliver harnesses, GSE computer, booms, sensors in protection boxes. Instrument Delivery to SC

24. THEMIS Instrument CDR 24 UCB, April 19-20, 2004 Issues Transportation/Shipping Berkeley to Swales Ground or commercial air? Under consideration. Access for Red/Green Tag Instrument Items when all probes on PCA Logistics and timing of removal/addition of red and green tag items still to be detailed. Detailed I & T Plans, Functional Procedures, etc. In development.