Presentation is loading. Please wait.

Presentation is loading. Please wait.

Mark Franklin, S06 CS, CoE, EE 362 Digital Computers II: Architecture Prof. Mark Franklin: Course Assistants: –Drew Frank:

Similar presentations


Presentation on theme: "Mark Franklin, S06 CS, CoE, EE 362 Digital Computers II: Architecture Prof. Mark Franklin: Course Assistants: –Drew Frank:"— Presentation transcript:

1 Mark Franklin, S06 CS, CoE, EE 362 Digital Computers II: Architecture Prof. Mark Franklin: jbf@cse.wustl.edu Course Assistants: –Drew Frank: ajf1@cec.wustl.edu Required Book: “Heuring & Jordan” 2 nd Edition Optional Book: “Intro. VHDL” Yalamanchili Read: Academic Integrity Statement. Course Web Site: http://www.cse.wustl.edu/~jbf/cse362.d/cse362.html

2 Mark Franklin, S06 Four Key Questions What components must every computer have ? How can computers be described, specified and evaluated ? What constitutes computer architecture (hardware, software, firmware, algorithms, etc.) ? How does technology effect computer architecture (chip size, feature size, power, pin density, etc) ?

3 Mark Franklin, S06 Essential Computer Components Processor: interpret/execute instructions. Memory: store instructions & data. Communication Device(s): communicate with outside world, I/O. Processor Control Unit ALU Memory Input/ Output Classic Computer Architecture (SISD: Single Instruction Stream-Single Data Stream)

4 Mark Franklin, S06 Architecture Components INSTRUCTION SET DESIGN: Programmer visible instruction set Algorithm, compiler, OS design, algorithmic complexity HIGH LEVEL COMPONENT ORGANIZATION: Memory system, bus structure, processor design, branch handling, pipelining, execution algorithms, instructions/second, clocks/instruction. HARDWARE: Detailed logic design, packaging VLSI & Logic design CAD algorithms speed, area, power, …

5 Mark Franklin, S06 ALU Interconnection Network Data Memory Unit Program Control Unit Program Memory Input / Output (SIMD) Single Instruction Stream – Multiple Data Stream Architecture

6 Mark Franklin, S06 Performance Expression: Amdahl’s Law

7 Mark Franklin, S06 Amdahl’s Law It does no good to have many processors if there is not enough parallelism. What portion of a computation can be sequential if we want the processors to be used at 50 percent efficiency ? ( S = p/2 )

8 Mark Franklin, S06 Generalize Amdahl’s Law Speedup overall = ExTime old ExTime new = 1 (1 - Fraction enhanced ) + Fraction enhanced Speedup enhanced Example: “Suppose a program runs in 100 seconds on a machine. Multiply operations are responsible for 80 seconds of this time. How much do we have to improve the speed of multiplication if we want the program to run 4 times faster?” What about 5 times faster? PRINCIPAL: Make the common case fast!

9 Mark Franklin, S06 Computer Market Partitioning (costs are for processor, not system) Desktop Computing ($100 - $1,000): –Price-performance Servers: ($200 - $2,000) –Availability (reliability + effectiveness) –Scalability –Throughput Embedded Computers: ($0.20 - $1,000) –Real-time performance –Power and memory minimization –Cost minimization –Interface with special purpose logic; use of processor cores

10 Mark Franklin, S06 HLL (e.g., C, C++, Perl) vs Machine/Assembly Language (AL) HLL Pros: –Easier to express algorithms due to higher level constructs (e.g., For, Case, Arithmetic expressions, objects, etc.) –Type checking (Hardware for type checking ?). –Some memory allocation checking. Assembly Language Pros: –More control over ISA  more speed, less memory –More control over I/O Combination is often best for embedded systems: HLL calling AL.

11 Mark Franklin, S06 Example: HLL  AL Mapping b = c + d*e LOAD R1, d LOAD R2, e LOAD R3, c MPY R4, R2, R1 ADD R5, R4, R3 STORE R5, b HLL AL

12 Mark Franklin, S06 Buses: I A set of path(s) (wires) connecting on-chip or off-chip modules. –Serial bus: transmit one bit at a time –Parallel bus: transmits many bits simultaneously Generally time-shared. Generally has separate data & control paths. Typically has a separate bus controller or arbiter that decides which modules can use the bus at any given time.

13 Mark Franklin, S06 Buses: II Some common buses: –On-chip: AMBA, Wishbone, (generally not standard) –Off-chip: PCI Bus Family), ---------------- 32bit transfer64bit transfer 33-MHz PCI133 MB/sec 266 MB/sec 66-MHz PCI266 MB/sec 532 MB/sec 100-MHz PCI-X------------ 800 MB/sec 133-MHz PCI-X------------ 1 GB/sec PCI-e(xpress) serial, 1 lane 500 MB/sec PCI-e(xpress) serial, 4 lanes 2 GB/sec –Off-chip: Other buses - SCSI, IDE, Infiniband Common issues: Arbitration, congestion. Logical equivalence between buses, multiplexers and switches.

14 Mark Franklin, S06 Bandwidth Requirements

15 Mark Franklin, S06 Bandwidth Trend

16 Mark Franklin, S06 Simple Queuing Theory View of Buses Bus is a shared resource and can be viewed as a server in a queuing system. Modules attached to the bus present inputs (i.e., requests) to the server (or Bus) and are queued up if the server is busy. BUS CPU I/O MemoryServer Queue

17 Mark Franklin, S06 Basic Queueing Theory Utilization: % time a server is busy Average Queue Length: Avg # of jobs in queue. Average System Delay (latency): Avg time from job entry into, to job departure from system. Arrival Time Distribution: Poisson Distribution of arrival times (exponential interarrival times). Service Time Distribution: Exponentially distributed service times. Queue Charactericstics: Infinite length; FIFO service discipline.

18 Mark Franklin, S06 Basic Queueing Results

19 Mark Franklin, S06 Basic Queueing Results M/M/1 Queue Length Waiting Time

20 Mark Franklin, S06 Computer Generations 1: 1950 - 1959 Vacuum Tubes 2: 1960 - 1968 Transistors 3: 1969 - 1977 Integrated Circuit 4: 1978 - 2005 LSI-Large Scale Integration; VLSI-Very LSI 5: 2005 - 20?? ULSI-Ultra LSI; parallel processing

21 Mark Franklin, S06 Technology: How we make a chip (roughly)

22 Mark Franklin, S06 Integrated Circuit Cost Cost.per.wafer Cost.per.die = ----------------------------------- (Dies.per.wafer) x (Yield) Wafer.area Dies.per.wafer = ------------------- (approximate) Die.area 1 Yield = ---------------------------------------------- (empirical observation) (1 + (Defects.per.area)x(die.area/2)) 2 Typical: Die area = 1.5 cm x 1.5 cm; Wafer Diameter = 10 inches; Defects.per.cm 2 = 1.7; Yield = 50 %

23 Mark Franklin, S06 TECHNOLOGY TRENDS Semiconductors: –Transistor Density: +50%/year, quadruple in 4 years. –Die Size: +10 - 25%/year IC Logic Technology: –Transistors per Chip: +50 - 60%/year –Device Speed: +30%/year –Wire/Communications Speed: ~constant (Cu vs Al) Magnetic Disk Technology: –Density: +25 - 60% / year –Access Time: +35% / 10 years (8 ms).

24 Feature and Die Size

25 Mark Franklin, S06 Wafer Size 12-inch wafer

26 Mark Franklin, S06 SILICON & MAGNETIC DENSITIES

27 Mark Franklin, S06 Processor Performance Gains Performance (x VAX-10/780)

28 Mark Franklin, S06 Processor Cost Trends with Time

29 Mark Franklin, S06 SILICON & MAGNETIC DENSITIES


Download ppt "Mark Franklin, S06 CS, CoE, EE 362 Digital Computers II: Architecture Prof. Mark Franklin: Course Assistants: –Drew Frank:"

Similar presentations


Ads by Google