1. Heterogeneous Technology Alliance SOI MEMS Platform HTA General Assembly November 12 – 13, 2013

2. The Heterogeneous Technology Alliance HTA Status Report Platform / Roadmap / Flagship Title: SOI MEMS Platform Short Description: Platform purpose To create flexibility in designing and manufacturing new components Definition Platform composes of process equipment, steps, modules and needed personnel of HTA partners (e.g. CSOI-AlN pMEMS platform of VTT) Activity in practice Network of four platform managers having regular Telcos & meetings Gateway to services and facilities of other partners (= matchmaker) Standardized documents (RFQ-template, customer case database, equipment list) Main challenge: (internal) marketing => project managers and planners Contact: Panu.Pekko@vtt.fi

3. The Heterogeneous Technology Alliance HTA Status Report Platform / Roadmap / Flagship Title: SOI MEMS Platform Status & Partners (institutes, departments, contact): CEA-Leti:Jean-Philippe.Polizzi@cea.fr CSEM:Arno.HOOGERWERF@csem.ch FhG: ENAS/IMS/IPMS/ISIT:Maik.Wiemer@enas.fraunhofer.de VTT: Panu.Pekko@vtt.fi Vision, Mission, Strategy: Vision:Platform for research, prototyping and pilot production as well as production ramp-up services Mission:Helping researcher to do their work, through networking, creating new projects and fostering innovations Contact: Panu.Pekko@vtt.fi

4. The Heterogeneous Technology Alliance HTA Status Report Platform / Roadmap / Flagship Title: SOI MEMS Platform Recent Activities (white papers, joint projects, joint PR, …) 5 inquiries handled in 2013 (3 closed without contracts, 2 still underway) CSEM: Philippe Niedermann replaced by Arno Hoogerwerf Next steps: Standard activities continue Participation to trade show under HTA banner planned (experiences of Semicon 2012 utilized) Contact: Panu.Pekko@vtt.fi

5. The Heterogeneous Technology Alliance HTA SOI MEMS Platform: success stories Challenge: IPDiA develops in collaboration with Leti a unique technology to integrate a wide range of capacitor values on silicon. A high K dielectric with coverage on high aspect ratio trenches is required. Leti does not have the technology. Solution: Fhg-CNT has the perfect solution Added value of HTA: Access to capabilities not available within a single partner Project was not feasible otherwise. Development of high density capacitors 50µm