1. “Signal Integrity for High Speed Design” Technical Course mohantygc@gmail.com

2. What does it take to fill these jobs featured in popular job sites? SIGNAL INTEGRITY ENGINEER: Simulation and modeling of the complete interconnect system; experience of high speed digital and/or RF simulation tools and test equipment. A working knowledge of Ansoft and/or Agilent/HP measurement equipment. POWER INTEGRITY / DELIVERY ENGINEER: Develop electrical guidelines for chipset package designs based upon interactions with Silicon design, Platform design, Technology development and Manufacturing organizations. Responsibilities include but not be limited to: - Designing and performing analog simulations for high-density electronic package and system-level interconnects for PC-based platforms - Performing transmission line modeling analysis for packaging parasitic extraction, pwr/gnd plane modeling, and power delivery network design - Performing Signal Integrity and Power Delivery Network analysis using FD and TD analysis techniques - Developing Power Delivery and Signal Integrity guidelines for package design - Performing model correlation with lab measurements PACKAGE ELECTRICAL ENGINEER: - Lead platform electrical designs and its associated processor and chipset packages - Interfacing with die circuits, package layout, and board design engineers. - Develop predictive models for package and board electrical analysis, and verify design robustness. PACKAGE DESIGN ENGINEER: Define packaging project objectives, scope, deliverables, performance requirements/indicators, resources, and implementation requirements to establish agreed upon and focused goals, and complete projects on time and within budget. Determine product fragility, critical parameter's, dimensional criteria and other requirements and environmental conditions through interaction with Product Line Teams, Production Operators, Account Managers, Marketing, & Customers. Assess package design specifications by identifying critical to function parameters, and estimating the process/manufacturing minimum capabilities. Knowledge of packaging materials, processes, and design limitations. Optimize package design concepts through technical design reviews with core engineering and supplier/manufacturer groups. Troubleshoot poor, or unacceptable packaging performance using dimensional analysis, data analysis, general physics, and simulation as problem solving tools to meet qualification criteria and satisfy product launch strategies.

3. Skill set Required for the jobs shown on the previous slide Transmission Lines – Theory, Types, Signal propagation (Equations of Motion) Concept of Electrical Length and Physical Length Switching Logic Families Microstrip and Stripline Properties and Design Equations Multiconductor Transmission Lines and Crosstalk Common Mode and Differential Mode Signal Propagation Non-ideal / Real World effects in Signal Propagation Frequency Domain Concepts in Transmission Lines Skin Effects and Applications Concept of Return Paths Functions of Ground Planes in Package and PCB’s Time domain versus Frequency Domain Analysis Power Bus Design Measurements on high speed circuits Device Modeling and Packaging System Design Concepts Thorough Overview of SPICE

4. Course Details Venue: Bhubaneswar (Exact Place to be Decided) Timeline: December 2006 or January 2007 5 days, 5 hours on each day => Half Semester Equivalent Price: Rs 3000 /- per person Incentives: –2–25% discount for successfully recommending another candidate if the candidate actually joins the course –R–Rs 1000 /- discount for successfully recommending 2 candidates if both the recommended candidates join the course –5–50% discount for successfully recommending 5 candidates if all the 5 recommended candidates join the course –F–Fee Waiver & Rs 3000 /- Cash back offer for successfully recommending 10 candidates if all the 10 recommended candidates join the course Wall projected or Whiteboard assisted display Hands-on with Pertinent Design Examples using SPICE Complete Course Materials available at Rs 1800 /-

5. Instructor Qualifications 7 years Work Experience in India, USA, Malaysia, Singapore Wide horizon of academic and work experience with Power Integrity, Signal Integrity, and Package Electrical Design for Desktops, Mobile Products, Servers, and Communication Products Worked for Tata, US Army, UMR, Intel, Agere Have contributed in projects recognized as amongst Top 20 Inventions in Year 2002 Technically contributed and mentored in myriad cultural settings

6. Introduction to Signal Integrity What is Signal Integrity? –The art and science that pertains to ensuring that signals are launched with sufficient fidelity, and are received to ensure proper timing and no faulty switching What is the need to learn Signal Integrity? –Signal Integrity in real-world applications is compromised by artifacts of the circuit layout on PCB, the packaging used, and is impacted by the circuit logic family, and other aspects of high-speed digital design. These real-world effects can lead to severely distorted voltage and current waveforms, and result in faulty switching and logic errors. This course discusses necessary skills to ensure signal quality for designs using standard design practices, computer simulations, and measurements.

7. Who might be interested in this course Electrical Engineers, Electronics Engineers, Instrumentation Engineers Anyone interested in a career in High Speed Signal Integrity, Power Integrity, Package Design, Board Design, and Electromagnetic Compatibility in VLSI Design

8. Course Objectives After the end of this course students will be able to: –Understand the basic concept of electronic packaging –Understand package and board design stackup principles as well as actual designs –Understand signal and power routing in package and board designs –Understand frequency dependency of Signal Integrity –Understand the meaning of electrical concepts in time and frequency domain –Provide package and board design guidelines to actual customers / employers –Calculate signal delays across signal paths –Estimate and calculate the effects of signal and power nets on other signal and power nets in the design –Draw simple electrical circuit models for physical features in package and board design –Decide on optimum lengths of traces, signal levels, signaling strategies –Understand the use of Oscilloscopes and Vector Network Analyzers in Signal Integrity Measurements

9. The End Please contact ‘Silicon Mohanty’ for course registration guidelines