1. NeSSI™ - Generation II The Elements & Power of an Automated Analytical System Rob Dubois CPAC/NeSSI™ Workshop – AM Session Seattle, Washington, USA May 3-6, 2004 “the best way to predict the future is to create it”

2. rnd/May 6, 20042 The Vision of Success We are able to… –design, auto-document & assemble...an analytical system at our workbench. Lego®-like (unskilled) assembly –increase reliability by predicting system failure by full, integrated automation –reduce time to configure/install by 75% –reduce total cost by 40% Gregor Rasputin – “Visionary ”

3. rnd/May 6, 20043 Courtesy of Dow Chemical, Fort Saskatchewan, Canada Objective 1 Facilitate the acceptance/implementation of modular, miniature & smart sample system technology based on ANSI/ISA SP76 standard substrate Objective 2 Provide a technology bridge to the process for...“sensor/lab-on-a-chip” micro-analytical devices

4. rnd/May 6, 20044 Courtesy of Dow Chemical, Freeport, Texas Objective 3 Promote the concept of... field-mounted (By-Line) smart analytical systems Objective 4 Lay the groundwork for Pipe to Pixel™ open connectivity architecture for intrinsically safe transducer communications (e.g. CAN, ProfiBus, etc.) and industry standard communication protocols (e.g. Ethernet, OPC, etc.) OPC Gateway T Sample System Gas Analyzer SAM IS bus

5. rnd/May 6, 20045 Today NeSSI™ Development Progress Gen III Gen II Gen I Mechanical/4-20 mA Electrical Networked & Smart & Wireless uAnalytical END USER VALUE 2006-07 2004-05

6. rnd/May 6, 20046 Concept of Modular Sampling System based on SEMI design conceived at ISA AD Meeting, 1998 Groundwork for NeSSI™ started at CPAC focus group. (Nov 99) NeSSI™ (CPAC Initiative) formally initiated in June 2000 at ISA SP76 (Gen I) standard approved by ANSI/ISA – June 2002 Gen II Proof of Concept (POCA) delivered to Dow & ExxonMobil – Mar 2003 $10 MM DoE Sensors and Wireless AWARDED to Honeywell in Nov. 2003 project will help co-fund 12 NeSSI™ prototype systems Chronology of events and Gen II specification can be found at … http://www.cpac.washington.edu/NeSSI/NeSSI.htm A Brief History of NeSSI™

7. rnd/May 6, 20047 Today’s Technology – some room for improvement Explosion-proof fittings and filled seals – custom assembly by skilled electrician Custom purging assemblies Multiple fittings & valves tubed by skilled inst. fitter Explosion- proof flow switches Manual flow & pressure control Intrinsically Safe Solenoid Valves

8. rnd/May 6, 20048 Reduce Cost to BuildReduce Cost to Build Design, Engineering, Manufacturing, Installation Reduce Cost of OwnershipReduce Cost of Ownership Infrastructure, Utility Usage, Support Costs Increase ReliabilityIncrease Reliability Measurement & Communication Validation What are the Drivers for Change?

9. rnd/May 6, 20049 7 Elements of Generation II 1. Multi-Drop Intrinsically Safe Bus 2. mini-Sensors 3. “Combi”-Valve Actuators 4. SAM* – Sensor Actuator Manager 5. PC/PDA with HMI** [Local Wireless] 6. Programmable Substrate Heater 7. microClimate Enclosure * SAM = Sensor Actuator Manager; **HMI = Human Machine Interface

10. rnd/May 6, 200410 1a. Multi-drop Bus Intrinsically Safe Ex ib Utilizes FISCO low power concept Handles up to 25 transducers (IIB) –sensors and actuators V T P A “NeSSI™-bus”

11. rnd/May 6, 200411 1b. Why not 4-20 mA for Gen II/III? labor intensive wiring space hungry expensive and difficult to wire for hazardous electrical areas NeSSI™-box Test Platform, Dow Chemical “This Dog Don’t Hunt”

12. rnd/May 6, 200412 1c. Early Gen II System (POCA*) Features - serial connectivity (DeviceNet) - PC controlled – smart features - simple plug and play M8 connector Benefits - predict failures before they happen - remote operation in hostile locations - decrease maintenance - increase confidence GET SMART! * POCA – Proof of Concept Apparatus - Dow, EMCC, Honeywell

13. rnd/May 6, 200413 1d. Why an IS network? The most compelling reason for an bus IS is the ability to operate miniature, modular transducers in a hazardous environment using “normal” wiring. reduce electrical seals no purging & pressurization limited conduits/cables no maintenance gas tests no special maint. permits min. X proof boxes allows hot “disconnects” plug and play *POCA = Proof of Concept Apparatus

14. rnd/May 6, 200414 2a. Mini-Sensors Doing analytical is not good enough! –sensors needed for validation & health –predictive maintenance model General Needs –Flow, Pressure, Temp. –Gas and/or liquid apps. –Encapsulated (IEC Ex m) –Intrinsically Safe (IEC Ex ib) –FOR: Div/Zone 1 Gps A-D Substrate A/D Comm. µP Memory A

15. rnd/May 6, 200415 2b. Conceptual Sensor for NeSSI™ Process Cavity - no unswept voids - low volume BARRIER - Process Seal - Electrical Isolation - Thermal Insulation Skirt - engineered A/D Comm. Sensor Base - 316 SS - pressure rated µP Memory Body - encapsulated “Top Hat” Comm. Chip A Port - standard size/pin - daisy chain 1.50” Digital “Smart” Sensor - engineering units - memory

16. rnd/May 6, 200416 3a. COMBI-valve Actuators Take control… –Zero/Span/Stream Select –F, P, T control General Requirements –Gas and/or liquid service –Encapsulated (IEC Ex m) –Intrinsically Safe (IEC Ex ib) –FOR: Div/Zone 1 Gps A-D –on/off (Vo) & modulating (Vm) Challenge to meet low power requirements (1-2 mA/unit) A Air Actuator Inst Air Valve Vent Comm. D/A Solenoid

17. rnd/May 6, 200417 3b. “Combi”-Valve Actuator A Actuator Valve Vent Comm. D/A Solenoid “TopHat” Comm. Chip DeviceNet 3-way “pilot” solenoid valve - Intrinsically Safe c/w o-ring std interface to actuator Actuator - NO or NC Engineered Insulation Skirt Single Female Port - M8 - daisy chain/trunk Digital On-Board - Eng. Data Sheet Thermal Barrier SAE x 1/8 tube connections 40-110 psig inst. air Aug. 26,03

18. rnd/May 6, 200418 3c. Other actuator options Direct mount solenoid valves –useful for non-hazardous applications –limited by physics Motorized electro/hydraulic valves SV Comm. SP76 Actuator

19. rnd/May 6, 200419 4b. SAM-Sensor Analytical Manager** - stand-alone Standalone SAM Analytical Sensor V T P A **hockey-puck/PC

20. rnd/May 6, 200420 4c. SAM - Sensor Analytical Manager** - embedded Embedded SAM Anyone’s Analyzer V T P A **hockey-puck/PC

21. rnd/May 6, 200421 Gateway to an Ethernet LAN (DCS/maintenance systems) can use multiple com protocols - OPC/HTTP/FF/PB, etc. - Remote Wireless (Gen III) Host Port for… (1) Intrinsically Safe NeSSI™-Bus (2 chan.) (2) Remote I/O PDA/PC Local Field Port - Local Wireless Software Applets for Sampling System Repetitive Tasks - AppLI (monitoring/control) Provides “Open” Development Space for Developers Custom Software (e.g. microAnalytical) SAM 4d. Distributed Control is Essential - Sensor Actuator Manager

22. rnd/May 6, 200422 4e. SAM AppLI* Repetitive Tasks 4Validation – zero/span 4Control… Sample pressure, flow, temperature Enclosure/substrate heating Heat Tracing Pumps 4Health of analytical system (F, P, T) 4Short term historical data 4Stream Switching 4DCS** interface protocol * AppLI = Application **DCS = Distributed Control System

23. rnd/May 6, 200423 5. Graphical HMI* Div II, Portable Field PC/PDA “Tool” Purpose –Allows field (local) adjustment and interrogation of an analytical system. (mimics remote PC) –A Graphical User Interface –System information instruction manuals parts list maintenance procedures application data PDA/PC HMI V T P A * HMI = Human Machine Interface SAM

24. rnd/May 6, 200424 6. Programmable substrate heater Purpose: –maintain temperature above dewpoint –provide special zone heating for permeation calibrations –supports microAnalytical & microreactor applications temperature controlled via the NeSSI™-bus and SAM. Ex d explosion proof heater AC Power TE Div/Zone 1 GP. A-D

25. rnd/May 6, 200425 7. MicroClimate Enclosure Purpose: –safe environment for analytical systems –allow usage in various climatic conditions for by-line applications –temp. control via NeSSI™-bus & SAM. – Ex d X-Proof Heater 120/240 VAC NEMA or IP Rated Enclosure Div/Zone 1 GP. A-D

26. rnd/May 6, 200426 Need to design & certify electrical components to global requirements... UL or FM (USA) CSA (Canada) ATEX Directive (Europe) GOST (Russia)

27. rnd/May 6, 200427 Programmable Substrate Heater What will a Gen II system look like? V P A F SAM NeSSI™-bus PDA Auxiliary Heating/Cooling Substrate T T dcs o&m user Ethernet LAN

28. rnd/May 6, 200428 Summary & Conclusion NeSSI™ Gen II ready for development –working spec/prototype design complete –alpha prototypes demonstrated DOE program –12 systems to be built – End Users provide field test locations What can your involvement be?