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1 Visual Computing Group Senior Mechanical Engineering Project Definition Mike MacGregor.

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Presentation on theme: "1 Visual Computing Group Senior Mechanical Engineering Project Definition Mike MacGregor."— Presentation transcript:

1 1 Visual Computing Group Senior Mechanical Engineering Project Definition Mike MacGregor

2 2 Visual Computing Group Problem Statement & Scope  Problem Statement: Need to enable Larrabee PCI graphics card by designing a cooling solution that meets –Volumetric/dimensional constraints of the PCI card form factor as well as the chip and circuit board that it cools –PCI Express™ x16 Graphics 150W-ATX Specification Revision 1.0 & PCIe 2.0 Spec Compliant –Card form factor: 2 slot, Full height, 240mm length –Thermal performance requirements of the Graphics Processor Unit (GPU) under a worst-case use condition –Structural performance requirements driven by shipping and handling use condition  Scope –Fan & thermal test vehicle to be supplied by Intel –Competitive research, feasibility analysis, quantitative evaluation of multiple design concepts, identification of final design concept, detailed design and design analysis, validation through laboratory testing

3 3 Visual Computing Group Thermal & Acoustic Requirements  GPU Thermal Design Power (TDP)70 Watts  Fan max. power8Watts  Max. T ambient35°C  Typical T ambient25°C  T rise to card inlet10°C  GPU T case max.85°C

4 4 Visual Computing Group Constraint #1: Fan  5 fans to be supplied by Intel  Fan supplier: AVC  Fan model series: BA10033

5 5 Visual Computing Group Constraint #2 Thermal Test Vehicle (TTV)  Heater to be spec’d from Omega supplier catalog –KHR-3/10 (3 cm diameter, 70 W max.) –http://www.omega.com/pptst/KHR_KHLV_KH.htmlhttp://www.omega.com/pptst/KHR_KHLV_KH.html  PCI card with assembled heater and heat spreader to be supplied by Intel 3cm TTV PCI Card

6 6 Visual Computing Group Structural Requirements  Design must pass shock test –PCI card assembled with ATX MB to rigid plate with rear panel I/O bracket (see backup slides) –Hockey stick max retention force: 29 lbf –Shock test input in all 6 directions: trapezoid, 30g amplitude  Expectations –derivation of worst-case DAF for HS mass –disposition of which shock directions pose the greatest risk to SJR as well as RM component loading –estimation of max stress and deflection of RM (0,0) acceleration in g’s msec (3,30)(16,30) (19,0)

7 7 Visual Computing Group BACKUP

8 8 Visual Computing Group Starting Materials: S&V Fixture and MB (not pictured)

9 9 Visual Computing Group Step 1: Install MB  Install the MB onto the fixture with qty 10, 6-32 screws torqued between 6 to 10 in-lbf

10 10 Visual Computing Group Step 2: Install Card  Seat the card into the PCI x16 connector and check that the hockey stick feature is engaged  Install the qty 2, 6-32 screws torqued between 6 to 10 in-lbf to secure card to I/O bracket


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