1. NeSSI*: The Good, The Bad and the Ugly - Early Implementations and Directions IFPAC Scottsdale, AZ, USA - January 22, 2003 John Cumbus Rob Dubois “the best way to predict the future is to create it” *New Sampling/Sensor Initiative

2. “And let it be noted that there is no more delicate matter to take in hand, nor more dangerous to conduct, nor more doubtful in its success, than to set up as the leader in the introduction of changes. For he who innovates will have for his enemies all those who are well off under the existing order of things, and only lukewarm supporters in those who might be better off under the new.'’ Niccolò Machiavelli (from The Prince pub. 1515)

3. Presentation Outline Recap of NeSSI Structure, Objectives & History NeSSI Gen I, II, III Overview Some “sacred cows” The good, the bad, the ugly Implementations and Directions –POCA Projects –DoE Project Acknowledgements Summary

4. NeSSI Structure & History An ad hoc global industry initiative, formed in June, 2000 to drive permanent change in the way we do Process Analytical. –NeSSI mail-out has now grown to 330+ subscribers Represents over 33 End Users from Oil and Petrochemical as wells as Manufacturing Companies, Academia, National Labs An “Open” Initiative sponsored by CPAC (Center for Process Analytical Chemistry) End User driven

5. NeSSI Objectives Facilitate the acceptance/implementation of... –modular, miniature & smart process analytical technology Promote the concept of... –at the pipe/field-mounted (“by-line”) analytical Lay the groundwork for... –open connectivity communication architecture Provide a technology bridge to the process for... –“sensor/lab-on-a-chip” microanalytical devices

6. NeSSI: The Vision of Success Reduce Engineering Time –“configurator tool” –self-documenting Reduce Assembly Time –Lego  Like Assembly Lower Maintenance Costs –diagnostics Vision Element: To design, assemble and configure an analytical system on one’s kitchen table. Courtesy of J. Warnowski/D. Mitchell. Swagelok/Panametrics Courtesy of U. Bonne. Honeywell.

7. NeSSI Generation Segmentation Gen III Gen II Gen I Mechanical Components (mostly) Electrical Transducers/IS Network Wireless, Advanced Gas & Liq. Sensors & Platform for microAnalytical Value

8. NeSSI Generation I Mechanical: Miniature and Modular Adapted from SEMI ANSI/ISA SP76 approved “Standard” Form Factor Allows Lego®-like construction Several SP76 substrate compliant vendors exist Courtesy of Swagelok

9. NeSSI Gen. II Networked/I.S./ miniTransducers/Wireless PDA Programmable Substrate Heater V P A F Ethernet LAN Analyzer Controller or PC SAM CANbus PDA Auxiliary Heating/Cooling Substrate T T

10. NeSSI Gen III - an enabling platform for  Analytical SAM Fiber Optic AT One sensor measures multiple components Ethernet LAN Enabling Technology for  Analytical V T A A One sensor measures one component uanlaytical

11. Sacred Cows........ or Opportunities? Size of sample passages restrictive to flow Sample System should be located under the GC Double block and bleed valves are needed for stream switching Modular assembly prone to leaks from number of connections Components do not meet area electrical classification insufficient flow to purge for stream switching Flow path difficult to follow without tubing

12. The Good Reduction in detailed engineering effort Ease of Construction Saves space, allows options for location Simple design Competitive costs Remote monitoring possible Alarm on failure Number of manufacturers increasing

13. The Bad Harder for technicians to intuitively understand / follow Need more components, broader ranges O-rings/seals in vertical configuration Low flow monitors / controllers

14. The Ugly (Softer Issues) Who constructs the system Packaging for ease of maintenance interface Interconnection (power, signal, control) with analyzer SAM interface? Technician education / acceptance Re-evaluation of maintenance effort

15. Field Installations

16. Substrate Selection What do we like? 4-screw approach o-ring grooves (gripper) no torque requirements flow pattern inscribed P/N & function visible on parts What we don’t like! metal seals tight space what component is it? any special tools required inconsistencies with other substrates

17. Shopping List of Downmount Components Pressure regulator Flow measurement devices Flow control devices Quick change filters Any temp/pressure/flow transmitters with liquid crystal display

18. Activities and Directions Since IFPAC, 2002 –May, 2002. DoE supplier/user team formed & White Paper developed by U. Bonne/Honeywell Labs –June, 2002. White Paper Submitted to DoE –June, 2002. Honeywell demonstrates first IS CANbus –July, 2002. POCA* Project conceived –August, 2002. ISA SP76 footprint approved by ANSI –12 Installations in Dow & ExxonMobil Facilities –November, 2002. POCA prototypes ordered. *POCA = NeSSI Gen II Proof of Concept Apparatus Project

19. Introducing the POCA Project(s) Purpose: Accelerate NeSSI Gen II dev. Seeded by Dow Chemical, ExxonMobil Chemical, Air Products Honeywell is the major supplier/integrator –B. Nickels/J. Mosher (commercialization & networking) –U. Bonne (sensor R&D) Impact to Industry first SP76 diagnostic physical minisensors (p, T, F) first SP76 miniactuators (Vo, Vm) first intrinsically safe, low cost, network IN PROGRESS

20. Introducing Potential DoE Project Purpose –Field test NeSSI Gen II –Develop/source missing components –Certification of electrical products ~ $2MM funding (50% “work in kind”) 2 year duration (1 year lab/1 year field test)

21. The DoE User/Supplier Team (More folks welcome!!) User Team –Peter van Vuuren (ExxonMobil) –Rob Dubois (Dow Chemical) –Joe Andrisani (DuPont) –Steve Wright (Eastman) –Bob Reed (Merck) –Paul Vahey (Honeywell-SM) –D. Young/D. Nettles (ChevronTexaco) –Frank Scweighardt (Air Products) –George Vickers (BP) –Paul Barnard (EquistarChemicals) –Steve Doherty (Pharmacia) –Bob Maglagenta (Kraft) –Alan Eastman (ConocoPhillips) –UOP Supplier Team –Ulrich Bonne (Honeywell Labs)* –Bob Nickels (Honeywell ACS) –Dave Simko (Swagelok) –Steve Doe (Parker-Hannifin) CPAC –Mel Koch * Supplier Team Lead PI

22. DoE Project Deliverables 1. Heated/Temperature Programmed Substrate 2. mini-Sensor Transducers (p, T, F) 3. “Combi” Actuator Transducers (Vo, Vm) (on/off & modulating transducers) 4. SAM - Sensor/Actuator Manager 5. Multi-Drop Digital Intrinsically Safe Bus 6. Micro Climate Enclosure * HMI = Human Machine Interface Certified CSA, FM, CENELEC

23. Acknowledgements Dow Chemical –R. Hartwig/D. Quevillon –Craig Snook –B. Vu /P. Williams/J.Leach –R. O’Reilly –W. Henslee Air Products –Frank Schweighardt Eastman Chemical –Steve Jacobs Tatera & Associates –Jim Tatera ExxonMobil Chemical –Dan Podkulski –Jeff Gunnell –Peter van Vuuren –Rajko Puzic –Kelley Bell Honeywell –John Mosher –Bob Nickels –Ulrich Bonne CPAC –Mel Koch –Dave Veltkamp

24. Summary... Gen I products moving into the field Strengths and Weaknesses Reviewed –Strengths to build on…weaknesses to overcome Gen II - High Level of Activity –Proof of Concept (POCA) in progress –DoE Potential Project Gen III Products in Sight